Techniques pertaining to designs of integrated circuits having on-chip inductors with low common mode coupling effect are described. According to one aspect of the present invention, an integrated circuit is designed to have a first circuit operating at a first frequency and including a first inductor, and a second circuit including a second inductor and provided to process an input signal. The second circuit includes a second inductor and is provided to process an input signal. The second inductor includes a first terminal, a second terminal, an intermediate terminal, and an intermediate node, wherein a first wire is formed between the first terminal and the intermediate node, a second wire is formed between the intermediate node and the second terminal, and an intermediate tap is coupled between the intermediate node and the intermediate terminal, the first wire and the second wire forming a coil with one or more turns, and the first terminal, the second terminal and the intermediate terminal of the second inductor being located on one side of the coil and adjacent to each other.

Techniques pertaining to designs of integrated circuits having on-chip inductors with low common mode coupling effect are described. According to one aspect of the present invention, an integrated circuit is designed to have a first circuit operating at a first frequency and including a first inductor, and a second circuit including a second inductor and provided to process an input signal. The second circuit includes a second inductor and is provided to process an input signal. The second inductor includes a first terminal, a second terminal, an intermediate terminal, and an intermediate node, wherein a first wire is formed between the first terminal and the intermediate node, a second wire is formed between the intermediate node and the second terminal, and an intermediate tap is coupled between the intermediate node and the intermediate terminal, the first wire and the second wire forming a coil with one or more turns, and the first terminal, the second terminal and the intermediate terminal of the second inductor being located on one side of the coil and adjacent to each other.

Detection circuit for detecting electrical capacitance of electrode device in electrostatic holding device with clamp carrier, particularly for detecting component held by holding device, includes phase control circuit couplable to electrode device and has reference oscillator device, phase comparator and VCO circuit (VCOC). Phase comparator is arranged to generate a control voltage of VCOC as a function of reference signal from reference oscillator device and of VCO feedback signal from VCOC, at least one phase control circuit is configured for controlling VCOC as a function of capacitance to be detected, and for outputting an output signal characteristic of capacitance based on control voltage of VCOC, phase control circuit is configured for connection to electrode device such that VCOC contains capacitance to be detected as frequency-determining component, and reference oscillator device is configured for generating reference signal with adjustable reference frequency. Electrostatic holding device includes at least one such detection circuit.

Detection circuit for detecting electrical capacitance of electrode device in electrostatic holding device with clamp carrier, particularly for detecting component held by holding device, includes phase control circuit couplable to electrode device and has reference oscillator device, phase comparator and VCO circuit (VCOC). Phase comparator is arranged to generate a control voltage of VCOC as a function of reference signal from reference oscillator device and of VCO feedback signal from VCOC, at least one phase control circuit is configured for controlling VCOC as a function of capacitance to be detected, and for outputting an output signal characteristic of capacitance based on control voltage of VCOC, phase control circuit is configured for connection to electrode device such that VCOC contains capacitance to be detected as frequency-determining component, and reference oscillator device is configured for generating reference signal with adjustable reference frequency. Electrostatic holding device includes at least one such detection circuit.

A RF transmitter includes a phase-locked loop having an oscillator arranged to output an oscillator carrier and a power amplifier arranged to conduct a power amplifier current. The RF transmitter includes a phase shifter module between the phase-locked loop and the power amplifier arranged to introduce a phase shift between the oscillator carrier and a harmonic of the power amplifier current in order reduce a frequency shift of the oscillator carrier due to pushing and/or pulling.

A proximity sensor and a method of changing a detection distance are provided to suppress changes in a consumption current of an oscillation circuit. The proximity sensor includes an oscillation circuit having an oscillation amplitude that changes with a feedback current, a comparing part comparing the oscillation amplitude with a threshold, a detecting part detecting a target object based on a comparison result of the comparing part, a voltage value signal generating part generating a voltage value signal based on the feedback current and the detection distance, a threshold setting part setting an analog signal converted from the voltage value signal as the threshold, a current value signal generating part generating a current value signal based on the detection distance and the voltage value signal, and a current value setting part setting an analog signal converted from the current value signal as a current value of the feedback current.

A proximity sensor and a method of changing a detection distance are provided to suppress changes in a consumption current of an oscillation circuit. The proximity sensor includes an oscillation circuit having an oscillation amplitude that changes with a feedback current, a comparing part comparing the oscillation amplitude with a threshold, a detecting part detecting a target object based on a comparison result of the comparing part, a voltage value signal generating part generating a voltage value signal based on the feedback current and the detection distance, a threshold setting part setting an analog signal converted from the voltage value signal as the threshold, a current value signal generating part generating a current value signal based on the detection distance and the voltage value signal, and a current value setting part setting an analog signal converted from the current value signal as a current value of the feedback current.

A device includes a control unit that includes an oscillator circuit. The control unit is configured to generate, based on the oscillator circuit, at least one switching signal. The device also includes a direct current (DC)-to-DC conversion circuit comprising at least one electronic switch that is operatively coupled to the control unit. The DC-to-DC conversion circuit is configured to convert, based on the at least one switching signal, a DC input voltage to a DC output voltage, and the control unit is further configured to input, to the oscillator circuit, a current signal that is generated based on a measured output current of the DC-to-DC conversion circuit.

A device includes a control unit that includes an oscillator circuit. The control unit is configured to generate, based on the oscillator circuit, at least one switching signal. The device also includes a direct current (DC)-to-DC conversion circuit comprising at least one electronic switch that is operatively coupled to the control unit. The DC-to-DC conversion circuit is configured to convert, based on the at least one switching signal, a DC input voltage to a DC output voltage, and the control unit is further configured to input, to the oscillator circuit, a current signal that is generated based on a measured output current of the DC-to-DC conversion circuit.

A crystal oscillator internally includes a package storing a crystal unit. The crystal oscillator is configured to include: a substrate having one surface side on which the crystal unit is disposed and another surface side on which a circuit component and a heating element are disposed, the circuit component including an oscillator circuit that oscillates the crystal unit, and the heating element regulating a temperature inside the package; a stepped portion formed at an inner wall of the package to support only an end portion of the substrate from the one surface side such that the crystal unit, the circuit component, and the heating element are spaced from a wall portion of the package; and a wire that connects between a terminal disposed at the heating element and a terminal disposed inside the package without via the substrate.