A resistor-capacitor oscillation circuit includes a first group of inverters, a second group of inverters, a latch, a delay circuit, and a third group of inverters. The first group of the inverters is connected to the delay circuit and is configured to generate a first signal A and a second signal B. An input end of the second group of the inverters is connected to an enable signal EN. An output end of the second group of the inverters is connected to the latch. An output end of the delay circuit is connected to the latch. The latch is connected to the third group of the inverters and includes a first output end and a second output end. After a first clock signal FB is driven by the third group of the inverters, an output signal CLK is output by an output end of the third group.

According to the present technology, there is provided an oscillator that functions as a transformer-based LC oscillator including a first capacitor group connected in parallel to a primary-side winding of a transformer and forming a first LC tank together with the primary-side winding, and a second capacitor group connected in parallel to a secondary-side winding of the transformer and forming a second LC tank together with the secondary-side winding, the oscillator including: a first type capacitor bank that is a capacitor bank having a maximum variable capacity of a predetermined value or more, and a second type capacitor bank that is a capacitor bank having a maximum variable capacity of less than the predetermined value, as capacitor banks for oscillation frequency tuning, in which the first type capacitor banks are arranged in both of the first capacitor group and the second capacitor group.

A multi-die module includes a first die with a first device and a second die with a second device. The multi-die module also includes a contactless coupler configured to convey signals between the first device and the second device. The multi-die module also includes a coupling loss reduction structure.

A multi-die module includes a first die with a first device and a second die with a second device. The multi-die module also includes a contactless coupler configured to convey signals between the first device and the second device. The multi-die module also includes a coupling loss reduction structure.

A millimeter-scale Bluetooth low energy wireless transmitter is presented with a dual purpose loop antenna. The oscillator employs a high quality factor resonator formed by a printed 3.53.5 mm.sup.2 inductive loop antenna (simulated Q110) and an on-chip digitally-switched capacitor array (simulated Q283). The oscillator replaces the traditional voltage controlled oscillator plus power amplifier, achieving lower power consumption while maintaining phase noise of 118.5 dBc/Hz at 1 MHz offset that results in low FSK modulation error (2.1%) and low frequency drift during BLE packet transmission.

A millimeter-scale Bluetooth low energy wireless transmitter is presented with a dual purpose loop antenna. The oscillator employs a high quality factor resonator formed by a printed 3.53.5 mm.sup.2 inductive loop antenna (simulated Q110) and an on-chip digitally-switched capacitor array (simulated Q283). The oscillator replaces the traditional voltage controlled oscillator plus power amplifier, achieving lower power consumption while maintaining phase noise of 118.5 dBc/Hz at 1 MHz offset that results in low FSK modulation error (2.1%) and low frequency drift during BLE packet transmission.

An apparatus can comprise a DC power supply to generate a DC electrical signal, a pulse generator to generate an electrical pulse, and an electrical element. The pulse generator and the DC power supply can be electrically coupled together. The electrical element can receive the DC electrical signal and the electrical pulse. The electrical element can generate a magnetic field in response to receiving the DC electrical signal and cool in response to receiving the electrical pulse.

An apparatus can comprise a DC power supply to generate a DC electrical signal, a pulse generator to generate an electrical pulse, and an electrical element. The pulse generator and the DC power supply can be electrically coupled together. The electrical element can receive the DC electrical signal and the electrical pulse. The electrical element can generate a magnetic field in response to receiving the DC electrical signal and cool in response to receiving the electrical pulse.

A package on a die having a low resistive substrate, wherein the package comprises an inductor on low-k dielectric and a capacitor on high-k dielectric. The stacked arrangement having different dielectric materials may provide an inductor having a high Q-factor while still having a high capacitance density. In addition, moving the inductor from the die to the package and fabricating the high density capacitor on the package reduces the silicon area required permitting smaller RF/analog blocks on the chip.

Systems and methods for compensating a non-linearity of a digitally controlled oscillator (DCO) are presented. Data comprising a plurality of silicon measurements is received. Each silicon measurement in the plurality of silicon measurements is compared to an ideal value. Based on the comparing, a plurality of compensation vectors is generated. Each compensation vector comprises at least one silicon measurement. At least one frequency is adjusted based on a compensation vector in the plurality of compensation vectors. A digitally-controlled oscillator frequency is generated based on the adjusted at least one frequency.