An apparatus includes a microelectromechanical system (MEMS) die having a first surface and an opposing second surface. The MEMS die includes a surface-mounted resonator on the first surface and includes a first inductor. The apparatus also includes first and second dies. The first die has a third surface and an opposing fourth surface. The first die is coupled to the MEMS die such that the third surface of the first die faces the first surface of the MEMS die. The first and second surfaces are spaced apart. The first die includes an oscillator circuit and a second inductor. The oscillator circuit is coupled to the second inductor. The second inductor is inductively coupled to the first inductor. The second die is electrically coupled to the first die.

In an integrated circuit device having a microelectromechanical-system (MEMS) resonator and a temperature transducer, a clock signal is generated by sensing resonant mechanical motion of the MEMS resonator and a temperature signal indicative of temperature of the MEMS resonator is generated via the temperature transducer. The clock signal and the temperature signal are output from the integrated circuit device concurrently.

In an integrated circuit device having a microelectromechanical-system (MEMS) resonator and a temperature transducer, a clock signal is generated by sensing resonant mechanical motion of the MEMS resonator and a temperature signal indicative of temperature of the MEMS resonator is generated via the temperature transducer. The clock signal and the temperature signal are output from the integrated circuit device concurrently.

A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

The present disclosure describes a low-power, low-phase-noise (LPLPN) oscillator. The LPLPN oscillator includes a resonator load, an amplifier stage, and a loop gain control circuit. The resonator load is structured to resonate at a primary resonant frequency. The amplifier stage is coupled with the resonator load to develop a loop gain that peaks at the primary resonant frequency. The loop gain control circuit is coupled with the amplifier stage, and it is structured to regulate the loop gain for facilitating the amplifier stage to generate an oscillation signal at the primary resonant frequency and suppress a noise signal at a parasitic parallel resonant frequency (PPRF).

The present disclosure describes a low-power, low-phase-noise (LPLPN) oscillator. The LPLPN oscillator includes a resonator load, an amplifier stage, and a loop gain control circuit. The resonator load is structured to resonate at a primary resonant frequency. The amplifier stage is coupled with the resonator load to develop a loop gain that peaks at the primary resonant frequency. The loop gain control circuit is coupled with the amplifier stage, and it is structured to regulate the loop gain for facilitating the amplifier stage to generate an oscillation signal at the primary resonant frequency and suppress a noise signal at a parasitic parallel resonant frequency (PPRF).

An aspect of the present disclosure concerns an oscillator circuit including a driver circuit that includes a first amplifier and a current detector where the first amplifier produces an oscillation voltage signal, where the current detector detects an oscillation current signal and produces a drive voltage signal, and where the oscillation current signal corresponds to difference in voltage between the oscillation voltage signal and the drive voltage signal; a feedback circuit that includes a second amplifier receiving the oscillation voltage signal and the drive voltage signal, to produce a feedback voltage signal to the driver circuit; and an oscillator that oscillates at a frequency determined in accordance with the drive voltage signal.

A drive level auto-tuning system includes a driver circuit, a resonant circuit, a driver controller and an automatic tuner. The resonant circuit is electrically connected to the driver circuit. The driver controller is electrically connected to the driver circuit. The automatic tuner is electrically connected to the driver controller, and the automatic tuner is configured to acquire a root-mean-square (RMS) current measured from the resonant circuit, so as to command the driver controller to automatically adjust a gain of driver circuit.

A device is provided for detecting and/or regulating an amplitude of an oscillation of an oscillatory body about an oscillation axis, wherein a change in a capacitance between at least one electrode of the oscillatory body and a stationary electrode takes place during the oscillation of the oscillatory body. The device comprises a detection circuit for detecting a signal representing a measure of the change in capacitance; and an evaluation circuit for determining information from the signal, wherein the evaluation circuit is designed to calculate the amplitude of the oscillation of the oscillatory body from the determined information and an ascertained period of the oscillation of the oscillatory body and/or to regulate the amplitude of the oscillation of the oscillatory body using the determined information and the ascertained period of the oscillation of the oscillatory body.