A method for calibrating a first clock signal output by an oscillation module to obtain a calibrated second clock signal includes obtaining a first count value by counting a third clock signal of an external device. A second count value is obtained by counting a scan signal of the oscillation module, and a first cycle ratio is obtained based on the first count value and the second count value. It is determined whether the first clock signal has a frequency deviation by comparing the first cycle ratio with a reference cycle ratio. A frequency division coefficient of the oscillation module is adjusted when the first clock signal has the frequency deviation, so that the oscillation module divides a frequency of the first clock signal according to the adjusted frequency division coefficient, thereby obtaining the calibrated second clock signal.

A method for calibrating a first clock signal output by an oscillation module to obtain a calibrated second clock signal includes obtaining a first count value by counting a third clock signal of an external device. A second count value is obtained by counting a scan signal of the oscillation module, and a first cycle ratio is obtained based on the first count value and the second count value. It is determined whether the first clock signal has a frequency deviation by comparing the first cycle ratio with a reference cycle ratio. A frequency division coefficient of the oscillation module is adjusted when the first clock signal has the frequency deviation, so that the oscillation module divides a frequency of the first clock signal according to the adjusted frequency division coefficient, thereby obtaining the calibrated second clock signal.

An oscillator system includes a first oscillator structure configured to oscillate about a first rotation axis at a first oscillation frequency; a second oscillator structure configured to oscillate about a second rotation axis at a second oscillation frequency; a driver circuit configured to generate a first driving signal to drive an oscillation of the first oscillator structure with a first oscillation phase and the first oscillation frequency and generate a second driving signal to drive an oscillation of the second oscillator structure with a second oscillation phase and the second oscillation frequency. The first oscillation frequency and the second oscillation frequency have a variable frequency ratio with respect to each other that varies over time. The driver circuit is configured to modulate at least one of the first oscillation phase or the second oscillation phase to modulate the variable frequency ratio.

An oscillator system includes a first oscillator structure configured to oscillate about a first rotation axis at a first oscillation frequency; a second oscillator structure configured to oscillate about a second rotation axis at a second oscillation frequency; a driver circuit configured to generate a first driving signal to drive an oscillation of the first oscillator structure with a first oscillation phase and the first oscillation frequency and generate a second driving signal to drive an oscillation of the second oscillator structure with a second oscillation phase and the second oscillation frequency. The first oscillation frequency and the second oscillation frequency have a variable frequency ratio with respect to each other that varies over time. The driver circuit is configured to modulate at least one of the first oscillation phase or the second oscillation phase to modulate the variable frequency ratio.

A resonator device includes a base substrate including a principal surface, a side surface, and an inclined surface that couples the principal surface to the side surface and that is inclined with respect to the principal surface and the side surface, a resonator element arranged on the principal surface of the base substrate, and a lid that is bonded to the principal surface of the base substrate and accommodates the resonator element between the lid and the base substrate. A bonding area in which the base substrate and the lid are bonded is positioned inside an outer edge of the principal surface.

A resonator device includes a base substrate including a principal surface, a side surface, and an inclined surface that couples the principal surface to the side surface and that is inclined with respect to the principal surface and the side surface, a resonator element arranged on the principal surface of the base substrate, and a lid that is bonded to the principal surface of the base substrate and accommodates the resonator element between the lid and the base substrate. A bonding area in which the base substrate and the lid are bonded is positioned inside an outer edge of the principal surface.

The temperature-dependent resistance of a MEMS structure is compared with an effective resistance of a switched CMOS capacitive element to implement a high performance temperature sensor.

The temperature-dependent resistance of a MEMS structure is compared with an effective resistance of a switched CMOS capacitive element to implement a high performance temperature sensor.

This invention provides electromechanical resonators based on metal chalcogenide nanotubes. The invention further provides methods of fabrication of electromechanical resonators and methods of use of such electromechanical resonators.

This invention provides electromechanical resonators based on metal chalcogenide nanotubes. The invention further provides methods of fabrication of electromechanical resonators and methods of use of such electromechanical resonators.