Disclosed are various embodiments of a terahertz wave modulator. The wave modulator can include one or more layers of piezoelectric/ferroelectric single crystal or polycrystalline material. The crystalline material can be configured to resonate when a low-energy external excitation is applied. An incident terahertz waveform can be dynamically controlled when the incident terahertz waveform interacts with the at least one layer of piezoelectric crystalline material while the at least one layer of piezoelectric crystalline material is resonating. The dynamic control of the incident terahertz waveform can be with respect to at least one of a phase shift and an amplitude modulation of the waveform.

A method includes depositing a first metal layer on a semiconductor substrate; etching the first metal layer to form a first electrode having a first lead; depositing a piezoelectric layer on the semiconductor substrate and first electrode; etching the piezoelectric layer to a shape of the gyrator to be formed within the circulator; depositing a second metal layer on the piezoelectric layer; etching the second metal layer to form a second electrode having a second lead, the second electrode being positioned opposite the first electrode, wherein the first lead and the second lead form an electrical port; depositing a magnetostrictive layer on the second electrode; etching the magnetostrictive layer to approximately the shape of the piezoelectric layer; depositing a third metal layer on the magnetostrictive layer; and etching the third metal layer to form a metal coil that has a gap on one side to define a magnetic port.

A method includes depositing a first metal layer on a semiconductor substrate; etching the first metal layer to form a first electrode having a first lead; depositing a piezoelectric layer on the semiconductor substrate and first electrode; etching the piezoelectric layer to a shape of the gyrator to be formed within the circulator; depositing a second metal layer on the piezoelectric layer; etching the second metal layer to form a second electrode having a second lead, the second electrode being positioned opposite the first electrode, wherein the first lead and the second lead form an electrical port; depositing a magnetostrictive layer on the second electrode; etching the magnetostrictive layer to approximately the shape of the piezoelectric layer; depositing a third metal layer on the magnetostrictive layer; and etching the third metal layer to form a metal coil that has a gap on one side to define a magnetic port.

An integrated circuit is a layered device, on a semiconductor substrate, which contains metal electrodes that sandwich a piezoelectric layer, followed by a magnetostrictive layer and a metal coil. The metal electrodes define an electrical port across which to receive an alternating current (AC) voltage, which is applied across the piezoelectric layer to cause a time-varying strain in the piezoelectric layer. The magnetostrictive layer is to translate the time-varying strain, received by way of a vibration mode from interaction with the piezoelectric layer, into a time-varying electromagnetic field. The metal coil, disposed on the magnetostrictive layer, includes a magnetic port at which to induce a current based on exposure to the time-varying electromagnetic field generated by the magnetostrictive layer.

An integrated circuit is a layered device, on a semiconductor substrate, which contains metal electrodes that sandwich a piezoelectric layer, followed by a magnetostrictive layer and a metal coil. The metal electrodes define an electrical port across which to receive an alternating current (AC) voltage, which is applied across the piezoelectric layer to cause a time-varying strain in the piezoelectric layer. The magnetostrictive layer is to translate the time-varying strain, received by way of a vibration mode from interaction with the piezoelectric layer, into a time-varying electromagnetic field. The metal coil, disposed on the magnetostrictive layer, includes a magnetic port at which to induce a current based on exposure to the time-varying electromagnetic field generated by the magnetostrictive layer.

Disclosed are various embodiments of a terahertz wave modulator. The wave modulator can include one or more layers of piezoelectric/ferroelectric single crystal or polycrystalline material. The crystalline material can be configured to resonate when a low-energy external excitation is applied. An incident terahertz waveform can be dynamically controlled when the incident terahertz waveform interacts with the at least one layer of piezoelectric crystalline material while the at least one layer of piezoelectric crystalline material is resonating. The dynamic control of the incident terahertz waveform can be with respect to at least one of a phase shift and an amplitude modulation of the waveform.

Disclosed are various embodiments of a terahertz wave modulator. The wave modulator can include one or more layers of piezoelectric/ferroelectric single crystal or polycrystalline material. The crystalline material can be configured to resonate when a low-energy external excitation is applied. An incident terahertz waveform can be dynamically controlled when the incident terahertz waveform interacts with the at least one layer of piezoelectric crystalline material while the at least one layer of piezoelectric crystalline material is resonating. The dynamic control of the incident terahertz waveform can be with respect to at least one of a phase shift and an amplitude modulation of the waveform.

Disclosed are various embodiments of a terahertz wave modulator. The wave modulator can include one or more layers of piezoelectric/ferroelectric single crystal or polycrystalline material. The crystalline material can be configured to resonate when a low-energy external excitation is applied. An incident terahertz waveform can be dynamically controlled when the incident terahertz waveform interacts with the at least one layer of piezoelectric crystalline material while the at least one layer of piezoelectric crystalline material is resonating. The dynamic control of the incident terahertz waveform can be with respect to at least one of a phase shift and an amplitude modulation of the waveform.

Disclosed are various embodiments of a terahertz wave modulator. The wave modulator can include one or more layers of piezoelectric/ferroelectric single crystal or polycrystalline material. The crystalline material can be configured to resonate when a low-energy external excitation is applied. An incident terahertz waveform can be dynamically controlled when the incident terahertz waveform interacts with the at least one layer of piezoelectric crystalline material while the at least one layer of piezoelectric crystalline material is resonating. The dynamic control of the incident terahertz waveform can be with respect to at least one of a phase shift and an amplitude modulation of the waveform.

To realize a compact device that detects phase or controls phase or an amplitude with high sensitivity, a signal controller includes: a linear conductor having a first end fixed to a negative electrode and a second end serving as a free end; a positive electrode facing the free end with a small gap therebetween; a first signal source that applies a voltage between the negative electrode and the positive electrode, the voltage applied being variable; a driving electrode that applies an electric field to a space around the conductor, the electric field having a component perpendicular to the lengthwise direction of the conductor; and a second signal source that applies an AC signal to the driving electrode. The signal processor can be a device for controlling or modulating phase or amplitude.