A modulator, a manufacturing method, and a transmitting apparatus are provided, applied to the field of wireless communication technologies. The modulator includes a first modulation circuit. The first modulation circuit includes a diode and a first microstrip. The first microstrip includes a first metal wire, a second metal wire, and an intermediate medium. The first metal wire and the second metal wire are disposed in parallel on a first surface of the intermediate medium along a first straight line. A first end of the first metal wire is opposite to a second end of the second metal wire, and a first spacing area with a spacing distance equal to a first value exists between the first end of the first metal wire and the second end of the second metal wire. A second end of the first metal wire is coupled to an anode of the diode.

Embodiments of the present application provide a display screen and a wireless communication device. The display screen includes: a substrate including a modulation circuit; a functional layer provided on the substrate and including a plurality of reflecting units, where the reflecting unit is configured to reflect a wireless signal and is connected to the modulation circuit, and the modulation circuit is configured to adjust at least one of an amplitude and a phase of an electrical signal on the reflecting unit; and a shielding layer provided on a side of the functional layer facing the substrate.

In various aspects, a device for reversibly modulating electromagnetic radiation may be provided. The device may include a base substrate. The device may include a patterned metal layer disposed over the base substrate. The patterned metal layer may include a plurality of electrodes separated by a gap and at least one additional metal pattern separated from the plurality of electrodes. The gap may define an active area through which radiation is passed. The device may include an organic layer disposed over at least the plurality of electrodes, and base substrate, and within the gap. The organic layer may include a conducting polymer. The device may include an ion gel disposed over the conducting polymer, the patterned metal layer, and the base substrate. The device may be configured to allow ions from the ion gel layer to transport into the conducting polymer.