Techniques are provided for a transimpedance amplifier (TIA). A TIA implementing the techniques according to an embodiment includes a pre-amplifier stage configured to amplify an input signal. The pre-amplifier stage includes a first P-channel metal oxide semiconductor field effect transistor (MOSFET) (P1), a second P-channel MOSFET (P2), a first N-channel MOSFET (N1), and a second N-channel MOSFET (N2), coupled in series. The gates of P1 and N2 are driven by the input signal. The output of the pre-amplifier stage is provided at a coupling between the drain of P2 and the drain of N1. The pre-amplifier stage also includes an active resistor network configured to provide a variable resistance based on a provided current bias generated from a gain control signal. The active resistor network is coupled between the gate of P1 and the drain of P2. The variable resistance is used to control the gain of the pre-amplifier stage.

Disclosed is a 5G (5.sup.th generation) or pre-5G communication system for supporting a data transmission rate higher than that of a 4G (4.sup.th generation) communication system such as long-term evolution (LTE). A transmission device comprises: a first amplification unit having a common source structure, including cross coupled capacitors, and amplifying an input signal; a second amplification unit, having a common gate structure, for amplifying a signal output from the first amplification unit; and a first removal unit which is connected to output terminals of the first amplification unit and input terminals of the second amplification unit and which removes at least one portion of second harmonics. The first removal unit can offset, with respect to a fundamental frequency, at least some of parasitic capacitance generated from the output terminals of the first amplification unit and the input terminals of the second amplification unit, and can ground a signal having a secondary harmonic frequency with respect to the secondary harmonic frequency.

Techniques are disclosed to compensate for changes in the impedance of stage(s) preceding a trans-impedance amplifier (TIA) that is used within an RF chain. The techniques identify the changes in the source impedance value of the input stage (e.g., the mixers and LNAs) as a result of a gain state change, which alters the signal-to-transfer function (STF) of the TIA during operation and negatively impacts radio performance. The STF is maintained for changes in the source impedance value throughout different gain states without using switchable shunt components by using tunable elements to compensate for the source impedance changes, thus keeping the STF constant.

A distributed envelope tracking (ET) amplifier circuit and related apparatus are provided. The distributed ET amplifier apparatus includes an amplifier circuit configured to amplify a radio frequency (RF) signal based on a modulated voltage. In examples discussed herein, the amplifier circuit is co-located with an ET voltage circuit configured to supply the modulated voltage such that a trace inductance between the amplifier circuit and the ET voltage circuit can be reduced to below a defined threshold. By co-locating the amplifier circuit with the ET voltage circuit to reduce a coupling distance between the amplifier circuit and the ET voltage circuit and thus the trace inductance associated with the coupling distance, it may be possible to reduce degradation in the modulated voltage. As a result, it may be possible to improve efficiency and maintain linearity in the amplifier circuit, particularly when the RF signal is modulated at a higher modulation bandwidth.

A distributed envelope tracking (ET) amplifier circuit and related apparatus are provided. The distributed ET amplifier apparatus includes an amplifier circuit configured to amplify a radio frequency (RF) signal based on a modulated voltage. In examples discussed herein, the amplifier circuit is co-located with an ET voltage circuit configured to supply the modulated voltage such that a trace inductance between the amplifier circuit and the ET voltage circuit can be reduced to below a defined threshold. By co-locating the amplifier circuit with the ET voltage circuit to reduce a coupling distance between the amplifier circuit and the ET voltage circuit and thus the trace inductance associated with the coupling distance, it may be possible to reduce degradation in the modulated voltage. As a result, it may be possible to improve efficiency and maintain linearity in the amplifier circuit, particularly when the RF signal is modulated at a higher modulation bandwidth.

This disclosure describes techniques for selecting one of a plurality of modes in which to operate an amplifier. The techniques include configuring input routing circuitry, coupled to first and second inputs of the amplifier, based on the selected one of the plurality of modes; selectively applying a resistance to an output of the amplifier, using feedback routing circuitry, based on the selected one of the plurality of modes; and selectively applying one of a plurality of reference voltages, using reference voltage routing circuitry, coupled to the first and the second inputs of the amplifier, based on the selected one of the plurality of modes.

This disclosure describes techniques for selecting one of a plurality of modes in which to operate an amplifier. The techniques include configuring input routing circuitry, coupled to first and second inputs of the amplifier, based on the selected one of the plurality of modes; selectively applying a resistance to an output of the amplifier, using feedback routing circuitry, based on the selected one of the plurality of modes; and selectively applying one of a plurality of reference voltages, using reference voltage routing circuitry, coupled to the first and the second inputs of the amplifier, based on the selected one of the plurality of modes.

A variable current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied.

A power amplifier circuit includes a first transistor disposed on a semiconductor substrate; a second transistor that supplies a bias current based on a first current which is a part of a control current to the first transistor; a current output element in which a current flowing therethrough increases in accordance with a rise in temperature; and a wiring portion including a plurality of metal layers that are electrically connected to an emitter of the first transistor and that are stacked one on top of another so as to oppose the semiconductor substrate. At least one metal layer among the plurality of metal layers extends so as to overlap an area extending from at least a part of a first disposition area in which the first transistor is disposed to a second disposition area in which the current output element is disposed in plan view of the semiconductor substrate.

A power amplifier circuit includes a first transistor disposed on a semiconductor substrate; a second transistor that supplies a bias current based on a first current which is a part of a control current to the first transistor; a current output element in which a current flowing therethrough increases in accordance with a rise in temperature; and a wiring portion including a plurality of metal layers that are electrically connected to an emitter of the first transistor and that are stacked one on top of another so as to oppose the semiconductor substrate. At least one metal layer among the plurality of metal layers extends so as to overlap an area extending from at least a part of a first disposition area in which the first transistor is disposed to a second disposition area in which the current output element is disposed in plan view of the semiconductor substrate.