A quadrature modulator and the transmission unit output a modulated wave obtained by performing quadrature modulation on a carrier wave using a first I signal and a first Q signal and wirelessly transmit the modulated wave. A reception unit and the quadrature detector detect a received signal corresponding to a wireless signal transmitted from the wireless tag using the carrier wave and to output a second I signal and a second Q signal. A filter and the amplification unit amplify a frequency component higher than a cutoff frequency in the second I signal and the second Q signal. A detector and the decoding unit decode data based on a detection signal obtained by detecting the amplified second I signal and the amplified second Q signal. A generation unit generates the first I signal and the first Q signal such that the modulated wave is a signal obtained by shifting a frequency of the carrier wave by a frequency shift amount more than the cutoff frequency and to input the first I signal and the first Q signal to the quadrature modulator.

A band-switching network includes a dual-band balun and a switch network. The dual-band balun includes a first output and a second output. The switch network includes a first switch and a second switch in which an input to the first switch is coupled to the first output and an input to the second switch is coupled to the second balanced output. The dual-band balun further includes a primary coil, a first secondary coil and a second secondary coil in which the first secondary coil is coupled to the first balanced output and the second secondary coil is coupled to the second balanced output. In one embodiment, the primary coil and the first secondary coil are coupled by a first coupling factor k.sub.1, and the primary coil and the second secondary coil are coupled by a second coupling factor k.sub.2 that is different from the first coupling factor k.sub.1.

A Radio Frequency (RF) circuit including a receive path, a transmit path, a switching circuit, and an output configured to receive RF signals from an antenna in a receive mode of operation, and to provide RF signals to the antenna in a transmit mode of operation. The receive path is configured to be coupled between a low-noise amplifier and the output. The switching circuit is located in the receive path and is configured, in the receive mode, to selectively couple the low-noise amplifier to the output and to pass the received RF signals from the output to the low-noise amplifier. The transmit path is configured to be coupled between a power amplifier and the output, to provide, in the transmit mode, signals from the power amplifier to the output, bypassing the switching circuit, and to have, in receive mode of operation, an off-state impedance of at least 200+j*13 Ohm.

The disclosed technology includes device, systems, techniques, and methods for amplifying a complex modulated signal with a broadband power amplifier. A broadband power amplifier may include an input network connected a long an input signal path, a driver stage, an interstage matching network stage, a power amplification stage, and a broadband matching output network. The broadband matching output network may include two coupled transmission lines and a compensation line connected between the two coupled transmission lines. Further, the broadband matching output network may include a capacitor connected with a secondary winding and a capacitor connected to each of the primary windings. The disclosed technology further includes transmission systems incorporating the broadband power amplifier.

A semiconductor device includes first member that includes a switch made of a semiconductor element made from an elemental semiconductor. The first member is joined to a second member including a radio-frequency circuit including a semiconductor element made from a compound semiconductor. The switch and the radio-frequency circuit are connected by a path. The path includes an inter-member connection wire made of a metal pattern arranged on an interlayer insulating film extending from a surface of the second member to a surface of the first member or a conductive member allowing a current to flow in a direction crossing an interface where the first member and the second member are joined.

A band-switching network includes a dual-band balun and a switch network. The dual-band balun includes a first output and a second output. The switch network includes a first switch and a second switch in which an input to the first switch is coupled to the first output and an input to the second switch is coupled to the second balanced output. The dual-band balun further includes a primary coil, a first secondary coil and a second secondary coil in which the first secondary coil is coupled to the first balanced output and the second secondary coil is coupled to the second balanced output. In one embodiment, the primary coil and the first secondary coil are coupled by a first coupling factor k.sub.1, and the primary coil and the second secondary coil are coupled by a second coupling factor k.sub.2 that is different from the first coupling factor k.sub.1.

A power amplifier system is disclosed having a first amplifier with a high-power input and a high-power output. A second amplifier has a low-power input and a low-power output. A reconfigurable mode switch network has a first series switch branch coupled between the high-power output and an RF output, a first shunt branch is coupled between the RF output and a fixed voltage node, and a second series switch branch is coupled between the low-power output and a shared node of the first shunt branch. The shared node separates the first shunt branch into a first shared section that is between the RF output and the shared node and a second shared section that is between the shared node and the fixed voltage node.

An electronic circuit includes a differential output circuit that produces a differential output signal at a differential output. A primary winding of a balun has a first balun terminal coupled to a first differential output terminal, and a second balun terminal coupled to a second differential output terminal. A configurable harmonic reduction circuit includes first and second configurable shunt capacitance circuits coupled between the first differential output terminal or the second differential output terminal, respectively, and a ground reference node. A control circuit receives tuning data associated with a calibrated tuning state. The tuning data indicates a first and second calibrated capacitance values, which are unequal, for the first and second configurable shunt capacitance circuits, respectively. The control circuit controls the first configurable shunt capacitance circuit to have the first calibrated capacitance value, and controls the second configurable shunt capacitance circuit to have the second calibrated capacitance value.

The present invention discloses a matching circuit with switchable load lines, a load line switching method and a power amplifier. The matching circuit matches the output impedance of the power amplifier, which amplifies an input signal and outputs an amplified signal. The matching circuit comprises a filter circuit and a switch group for load line selection, the output end of the filter circuit is connected to the switch group. The switch group comprises at least two independent switches, each switch independently constitutes a signal line, and each switch is configured with an external control signal to control on/off. The matching circuit provided by the invention adopts a switch group composed of at least two independent switches, and each independent switch forms a signal line to connect loads, so that multiple loads can be connected at the same time.

A balun is disclosed and includes a dielectric substrate defining a first surface and a second surface. The balun includes a first output port including a first output ground portion and first output power portion; a second output port including a second output ground portion and a second output power portion; and an input port including an input ground portion and input power portion. The first output ground portion, the second output ground portion, and the input ground portion are coupled at a ground junction portion. The first output power portion, the second output power portion, and the input power portion are coupled at a power junction portion. The first output power portion, the second output power portion, and the input power portion are positioned on the first surface. The first output ground portion, the second output ground portion, and the input ground portion are positioned on the second surface.