A surface acoustic wave device including a piezoelectric layer, an interdigital transducer electrode over the piezoelectric layer, and a polymeric roof layer arranged over the piezoelectric layer and interdigital transducer electrode. The polymeric roof layer is spaced apart from the piezoelectric layer to define a cavity to accommodate the interdigital transducer electrode. The polymeric roof layer is supported along a span of the polymeric roof layer by at least one pillar. The thermal conductivity of the pillar is greater than the thermal conductivity of the polymeric roof layer. Related wafer-level packages, radio frequency modules and wireless communication devices are also provided.

A multi-frequency low noise amplifier includes an input matching network, an amplifying circuit and an output matching network. The input matching network includes a first out-of-band rejection circuit and a first frequency band selection circuit. The output matching network includes a second out-of-band rejection circuit and a second frequency band selection circuit. The first out-of-band rejection circuit can reject signal of any frequency band in the radio frequency signals so that signals of the remaining frequency bands can pass through. The first frequency band selection circuit can screen out the signals of reference frequency spots from the remaining frequency bands. The second frequency band selection circuit can screen out the signals of partial frequency spots from the amplified signals of reference frequency spots. The second out-of-band rejection circuit can reject the signal of any frequency spot in the signals of partial frequency spots.

A system and method for multi-band digital pre-distortion (DPD) for a non-linear system. The system includes a DPD circuitry configured to perform multi-band DPD on a multi-band input signal to compensate for a non-linearity of a non-linear system. The multi-band input signal includes input signals of multiple frequency bands and the DPD circuitry is configured to perform DPD on an input signal of each frequency band per frequency band. The DPD circuitry is configured to perform the DPD using a combination of a look-up table (LUT) that evaluates a non-linear function and computation of terms of a non-linear polynomial of one or more variables representing the input signals of multiple frequency bands. Both the non-linear function and the non-linear polynomial are in a reduced dimension lower than a dimension of the multi-band input signal.

Devices and methods for operating a charge pump. In some implementations, a charge pump module includes a clock circuit configured generate to a first clock signal and a second clock signal, the first clock signal having a lower frequency than the second clock signal. The charge pump module also includes a driving circuit configured to generate a first set of clock signals based on the first clock signal and a second set of clock signals based on the second clock signal, the driving circuit coupled to the clock circuit. The charge pump module further includes a charge pump core including a set of capacitances, the charge pump core configured to charge the set of capacitances based the first set of clock signals and the second set of clock signals.

An acoustic wave device includes a silicon support substrate that includes first and second main surfaces opposing each other, a piezoelectric structure provided on the first main surface and including the piezoelectric layer, an IDT electrode provided on the piezoelectric layer, a support layer provided on the first main surface of the silicon support substrate and surrounding the piezoelectric layer, a cover layer provided on the support layer, a through-via electrode that extending through the silicon support substrate and the piezoelectric structure, and a first wiring electrode connected to the through-via electrode and electrically connected to the IDT electrode. The piezoelectric structure includes at least one layer having an insulating property, the at least one layer including the piezoelectric layer. The first wiring electrode is provided on the layer having an insulating property in the piezoelectric structure.

Methods and devices used in mobile receiver front end to support multiple paths and multiple frequency bands are described. The presented devices and methods provide benefits of scalability, frequency band agility, as well as size reduction by using one low noise amplifier per simultaneous outputs. Based on the disclosed teachings, variable gain amplification of multiband signals is also presented.

Disclosed is a filter bank die that includes a first acoustic wave (AW) filter having a first antenna terminal coupled to the antenna port terminal and a first filter terminal, wherein the first AW filter is configured to have a filter skirt with a slope that spans at least a 100 MHz gap between adjacent passbands, and a second AW filter having a second filter terminal, and a second antenna terminal coupled to the first antenna terminal to effectively diplex signals that pass through the first AW filter and the second AW filter.

A multiplexer includes a transmission filter and a reception filter connected to a common terminal, a first inductor connected to the common terminal, and a multilayer substrate on which the transmission filter and the reception filter are mounted and which includes dielectric layers. The transmission filter includes a parallel-arm resonator connected to a path between the common terminal and a transmission terminal and a parallel-arm terminal, and a second inductor connected to the parallel-arm terminal and ground. The first inductor includes a first coil pattern on a first dielectric layer and a second coil pattern on a second dielectric layer. The second inductor includes a third coil pattern on the first dielectric layer and that is magnetically coupled to the first coil pattern. The inductance value of the second coil pattern is greater than that of the first coil pattern.

A radio-frequency module includes a mounting board, a first electronic component, and a second electronic component. The second electronic component is lower in height than the first electronic component. The mounting board includes dielectric layers, conductive layers, and via-conductors. In the mounting board, the dielectric layers and the conductive layers are stacked in the thickness direction of the mounting board. The mounting board has a first region and a second region. The first region overlaps the first electronic component and extends from a first major surface to a second major surface. The second region overlaps the second electronic component and extends from the first major surface to the second major surface. In the mounting board, the conductive layers in the first region are fewer than the conductive layers in the second region. In the mounting board, the first region is thinner than the second region.

The present disclosure facilitates impedance matching between a power amplifier and filters. A radio-frequency circuit includes a power amplifier, a plurality of transmit filters, a switch, a plurality of first matching networks, and a second matching network. The switch switches the plurality of transmit filters to be coupled to the power amplifier. The plurality of first matching networks are coupled between the plurality of transmit filters and the switch. The second matching network is coupled between the power amplifier and the switch. The second matching network includes a transmission line transformer.