An RF amplifier utilizes first and second main amplifiers in a balanced amplifier configuration with first and second auxiliary amplifiers connected in parallel across the first and second main amplifiers, respectively. The main and the auxiliary amplifiers are biased such that the third-order nonlinearity components in the combined output current are reduced. A common or independent bias control circuit(s) control(s) the DC operating bias of the auxiliary amplifiers and establishes DC operating points on curves representing third-order nonlinear components within the drain current having a positive slope (opposite to the corresponding slope of the main amplifiers). This results in reduction of overall third-order nonlinear components in combined currents at the output. In another embodiment, a phase shift of an input to one auxiliary amplifier is used to provide a peak in minimization at a frequency associated with the phase shift.

An amplifier may include multiple stages, with the multiple stages arranged in a fan-out configuration. The fan-out configuration provides multiple amplified signals at multiple amplifier output nodes, which may be coupled to a shared set of downconverters. The shared downconverters may support processing of only a smaller bandwidth than the largest possible bandwidth of an input RF signal input to the amplifier. For example, the downconverters may support a bandwidth matching a smallest bandwidth of a supported RF signal. For example, when the amplifier is intended to support 5G mmWave RF signals and 5G sub-6 GHz RF signals, the downconverters may each individually support a bandwidth of carriers in the 5G sub-6 GHz RF signals but not individually support the entire bandwidth of a possible 5G mmWave RF signal.

In one embodiment, an integrated circuit includes: a first radio frequency (RF) circuit configured to receive and process a first RF signal having a sub-gigahertz (GHz) frequency to output a first lower frequency signal and to transmit RF signals having the sub-GHz frequency; a second RF circuit configured to receive and process a second RF signal having a frequency of at least substantially 2.4 GHz to output a second lower frequency signal and to transmit RF signals at the at least substantially 2.4 GHz; shared analog circuitry coupled to the first RF circuit and the second RF circuit, the shared analog circuitry to receive at least one of the first RF signal or the second RF signal and output a digital output signal; and a digital circuit coupled to the shared analog circuit, the digital circuit to recover message information from the digital output signal.

A radio frequency circuit includes: a first power amplifier capable of amplifying a first radio frequency signal and a second radio frequency signal each having a different frequency; and a second power amplifier capable of amplifying the second radio frequency signal. In a case where the first radio frequency signal and the second radio frequency signal are simultaneously transmitted, (i) under a condition that a sum of a bandwidth of the first radio frequency signal and a bandwidth of the second radio frequency signal is broader than or equal to a predetermined bandwidth, the first radio frequency signal is amplified by the first power amplifier, and the second radio frequency signal is amplified by the second power amplifier, and (ii) under a condition that the sum is narrower than the predetermined bandwidth, the first radio frequency signal and the second radio frequency signal are amplified by the first power amplifier.

A radio frequency module includes: a module board including first and second principal surfaces; first and second power amplifiers on the first principal surface; external-connection terminals on the second principal surface; and first and second via conductors connecting the first and second principal surfaces. The first and second via conductors are spaced apart in the module board, one end of the first via conductor is connected to a first ground electrode of the first power amplifier, the other end of the first via conductor is connected to a first external-connection terminal, one end of the second via conductor is connected to a second ground electrode of the second power amplifier, the other end of the second via conductor is connected to a second external-connection terminal, and the first and second via conductors each penetrate through the module board in a direction normal to the first and second principal surfaces.

Aspects of the disclosure include a wireless device comprising a module input to receive an input signal, a module output to provide an amplified output signal, a low-noise amplifier including an input amplification stage coupled to the input, and a plurality of output amplification stages switchably coupled to the input amplification stage, and a plurality of impedance-matching circuits, each impedance-matching circuit of the plurality of impedance-matching circuits having an input coupled to a respective output amplification stage and an output coupled to the module output.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying circuit element; a second amplifying circuit element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying circuit element. Another end of the primary coil is connected to an output terminal of the second amplifying circuit element. An end of the secondary coil is connected to an output terminal of the power amplifier. The first amplifying circuit element and the second amplifying circuit element are disposed on the first principal surface. The first circuit component is disposed on the second principal surface.

A radio-frequency module includes a module substrate, a power amplifier, and a control circuit configured to control the power amplifier. The control circuit includes a temperature sensor. The power amplifier and the control circuit are stacked one on top of another on a principal surface of the module substrate.

An output switch includes; a plurality of input terminals and output terminals each of the plurality of input terminals is electrically connected to at least one of the plurality of output terminals; a first low noise amplifier that amplifies a signal of a predetermined frequency band input through an antenna and outputs a first signal to a first input terminal among the plurality of input terminals, and a second low noise amplifier that amplifies a signal of a predetermined frequency band input through an antenna and outputs a second signal to a second input terminal different from the first input terminal among the plurality of input terminals. A filter that attenuates a signal of a frequency band higher than a frequency band of the second signal is electrically connected between the second input terminal and the second low noise amplifier.

A digital pre-distortion method for a multiband signal, an electronic device and a non-transitory computer-readable storage medium are disclosed. The digital pre-distortion method may include: determining a possible power amplifier distortion according to configuration of a signal issued by a cell; selecting a basis function of pre-distortion according to the possible power amplifier distortion; solving, according to a pre-collected reference multiband signal and a corresponding feedback signal, the selected basis function to obtain a pre-distortion parameter; and processing an input multiband signal according to the selected basis function and the pre-distortion parameter to generate a pre-distortion signal.