Improvement in heat dissipation capability is intended. A radio-frequency module includes a mounting substrate, a plurality of transmission filters, a resin layer, and a shield layer. The mounting substrate has a first major surface and a second major surface opposite to each other. The plurality of transmission filters is mounted on the first major surface of the mounting substrate. The resin layer is disposed on the first major surface of the mounting substrate and covers at least part of an outer peripheral surface of each of the plurality of transmission filters. The shield layer covers the resin layer and at least part of each of the plurality of transmission filters. At least part of a major surface of each of the plurality of transmission filters on an opposite side to the mounting substrate side is in contact with the shield layer.

An envelope tracking power management circuit is disclosed. An envelope tracking power management circuit includes a first envelope tracking amplifier(s) and a second envelope tracking amplifier(s), each configured to amplify a respective radio frequency (RF) signal(s) based on a respective supply voltage. A power management circuit can determine that a selected envelope tracking amplifier, which can be either the first envelope tracking amplifier(s) or the second envelope tracking amplifier(s), receives the respective supply voltage lower than a voltage required to amplify the respective RF signal(s) to a predetermined voltage. In response, the power management circuit provides a boosted voltage, which is no less than the required voltage, to the selected envelope tracking amplifier. As such, it is possible to enable the selected envelope tracking amplifier to amplify the respective RF signal(s) to the predetermined voltage without increasing cost, footprint, and power consumption of the envelope tracking power management circuit.

A circuit and method for providing high-voltage radio-frequency (RF) energy to an instrument at multiple frequencies includes a plurality of inputs each configured to receive an RF voltage signal oscillating at a corresponding frequency, and a step-up circuit for generating magnified RF voltage signals based on the received RF voltage signals. The step-up circuit includes an LC network operable to isolate the RF voltage signals at the plurality inputs from one another while preserving a voltage magnification from each input to a common output at each of the corresponding frequencies.

In some embodiments, a power amplification system can comprise a current source, an input switch configured to alternatively feed current from the current source to a high-power circuit path and a low-power circuit path, and a band switch including a switch arm for switching between a plurality of bands. Each of the high-power circuit path and the low-power circuit path can be connected to the switch arm.

A multi-bit digital signal that is generated by modulating a baseband signal by a modulation circuit and includes components in a radio frequency band is amplified by switch-mode amplifiers (100-1, 100-2) on a bit-by-bit basis, amplified signals are band-limited by frequency-variable variable band limiting units (201-1, 201-2) and thereafter subjected to voltage-to-current conversion by voltage/current source conversion units (202-1, 202-2) provided with variable capacitances, the signals converted to current are synthesized at a synthesis point X, and a resultant signal is impedance-corrected by an impedance correction unit (203) and output as a transmission signal to an antenna of a load (300). Consequently, the present invention provides a transmitter capable of synthesizing output signals from a plurality of switch-mode amplifiers and transmitting a resultant signal while maintaining an impedance characteristic with respect to a plurality of transmit frequencies without increasing a circuit size.

A radio frequency module has a substrate, a first chip inductor, an integrated circuit, and a first amplifier connected to the first chip inductor. The first chip inductor is on a first main surface of the substrate and the integrated circuit is on a second main surface of the substrate, the second main surface being opposite the first main surface. The integrated circuit includes the first amplifier. When the substrate is viewed from a direction perpendicular to the first main surface of the substrate, the first chip inductor at least partially overlaps the integrated circuit.

A tunable passband filter including a signal input port for receiving an input radio frequency (RF) signal, a signal output port for transmitting a filtered output RF signal, a first high-pass section having a first tunable microelectromechanical system (MEMS) switch array to receive the input RF signal from the signal input port, a second high-pass section having a second tunable MEMS switch array to transmit the output RF signal to the signal output port, and a low pass section operatively coupled between the first high-pass section and the second high-pass section, and having each of a first tunable MEMS bridge array, a second tunable MEMS bridge array, and a high impedance line. The tunable passband filter is configured to filter the input RF signal to yield the filtered output RF signal.

Doherty power amplifier combiner with tunable impedance termination circuit. A signal combiner can include a balun transformer circuit having a first coil and a second coil. The first coil can be implemented between a first port and a second port. The second coil can be implemented between a third port and a fourth port. The first port and the third port can be coupled by a first capacitor. The second port and fourth port can be coupled by a second capacitor. The first port can be configured to receive a first signal. The fourth port can be configured to receive a second signal. The second port can be configured to yield a combination of the first signal and the second signal. The signal combiner can include a termination circuit that couples the third port to a ground. The termination circuit can include a tunable impedance circuit.

RF circuitry, which includes a first passive voltage-gain network and a first MOS-based RF receive amplifier, is disclosed. The first passive voltage-gain network provides a first passive RF receive signal using a first RF receive signal, such that an energy of the first passive RF receive signal is obtained entirely from the first RF receive signal by the first passive voltage-gain network. A voltage of the first passive RF receive signal is greater than a voltage of the first RF receive signal. The first MOS-based RF receive amplifier receives and amplifies the first passive RF receive signal to provide a first amplified RF receive signal.

A device and method for amplifying signals is provided. The device can have an input to receive an input signal having a first desired signal on a first carrier, a second desired signal on a second carrier, and one or more interfering signals. The device can have a first carrier aggregation (CA) chain for use with the first desired signal and a second CA chain for use with the second desired signal. The first and second CA chains can be coupled to the input. The first and second CA chains can have a plurality of transconductance stages. Each of the transconductance stages can be configured as a high impedance stage or a low impedance stage. The transconductance stages can be selectively activated to incrementally adjust the transconductance, and therefore the input impedance, of each of the CA chains.