Embodiments of the disclosure relate to optimizing power efficiency of a power amplifier circuit to reduce power consumption in a remote unit in a wireless distribution system (WDS). A power amplifier circuit is provided in the remote unit to amplify a received input signal associated with a signal channel(s) to generate an output signal at an aggregated peak power. In this regard, a control circuit is configured to analyze at least one physical property related to the signal channel(s) to determine a maximum output power of the power amplifier circuit. Accordingly, the control circuit configures the power amplifier circuit according to the determined maximum output power. By configuring the maximum output power based on the signal channel(s) in the input signal, it may be possible to optimize the power efficiency of the power amplifier circuit, thus helping to reduce the power consumption of the remote unit.

Apparatus and methods for orienting power amplifiers are disclosed herein. In certain implementations, a method of determining the physical orientation of power amplifiers laid out on a printed circuit board (PCB) is provided. The method includes determining an amount of emissions radiated by a first power amplifier die that is positioned in a first orientation on the PCB. The method further includes determining an amount of emissions radiated by a second power amplifier die that is positioned in a second orientation on the PCB. The method further includes determining a third orientation of the second power amplifier die different than the second orientation, such that when the second power amplifier die is in the third orientation, the amount of emissions radiated by the first power amplifier die and the amount of emissions radiated by the second power amplifier die are distributed in different directions.

Aspects of the present disclosure generally relate to a RF high power amplifier designed for resonance mitigation. A method for resonance mitigation in RF high power amplifier enclosure and an enclosure for RF high power amplifier designed to mitigate resonance is provided. In an aspect, the enclosure can be configured with a metallic post or a grounded metallic post positioned at a suitable location with RF high power amplifier circuit to dampen and shift out resonance. In an aspect, the metallic post can be placed between printed circuit board (PCB) substrate and enclosure lid. Proposed metallic post solution eliminates the need of RF absorber in the design.

There is provided an amplifier module which includes a plurality of input terminals; a plurality of amplifier circuits configured to amplify a plurality of input signals which are input from each of the plurality of input terminals and output a plurality of amplified signals; and at least one speaker which is directly connected to at least one output terminals from among the plurality of amplifier circuits, wherein the amplifier module may output the plurality of amplified signals to the at least one speaker based on a number of the at least one speaker.

A Doherty amplifier module includes first and second amplifier die. The first amplifier die includes one or more first power transistors configured to amplify, along a first signal path, a first input RF signal to produce an amplified first RF signal. The second amplifier die includes one or more second power transistors configured to amplify, along a second signal path, a second input RF signal to produce an amplified second RF signal. A phase shift and impedance inversion element is coupled between the outputs of the first and second amplifier die. A shunt inductance circuit is coupled to the output of either or both of the first and/or second amplifier die. Each shunt inductance circuit at least partially resonates out the output capacitance of the amplifier die to which it is connected to enable the electrical length of the phase shift and impedance inversion element to be increased.

An embodiment of a Doherty amplifier module includes a substrate, a first amplifier die, and a second amplifier die. The first amplifier die includes one or more first power transistors configured to amplify, along a first signal path, a first input RF signal to produce an amplified first RF signal. The second amplifier die includes one or more second power transistors configured to amplify, along a second signal path, a second input RF signal to produce an amplified second RF signal. The first and second amplifier die each also include an elongated output pad that is configured to enable a pluralities of wirebonds to be connected in parallel along the length of the elongated output pad so that the pluralities of wirebonds extend in perpendicular directions to the first and second signal paths.

The embodiments described herein use resonant circuits to provide isolation between closely proximate conductors. For example, these resonant circuits can be used to reduce unwanted electromagnetic coupling and minimize crosstalk energy between package leads, bonding wires, and circuit board traces on radio frequency (RF) electronic devices, including RF power amplifiers. To facilitate a reduction in electromagnetic coupling, the resonant circuit is configured resonate with the closely proximate conductors at a selected frequency f.sub.0, and when resonating at the selected frequency f.sub.0 the resonant circuit provides a path to ground for the crosstalk energy. This path to ground reduces the crosstalk energy that would otherwise be shared between the two closely proximate conductors, and thus provides the electromagnetic isolation between the conductors.

A method for ramping a switched capacitor power amplifier is disclosed, where the switched capacitor power amplifier comprises a plurality of capacitors in a capacitor bank, and where a number of the capacitors in the capacitor bank are activated. The method comprises changing the number of capacitors in the capacitor bank that are activated, maintaining the changed number of activated capacitors in the capacitor bank for a period of time, and repeating the changing and maintaining, where a length of the period of time is varied between at least two repetitions of the maintaining.

Apparatus and methods for orienting power amplifiers are disclosed herein. In certain implementations, a method of determining the physical orientation of power amplifiers laid out on a printed circuit board (PCB) is provided. The method includes determining an amount of emissions radiated by a first power amplifier die that is positioned in a first orientation on the PCB. The method further includes determining an amount of emissions radiated by a second power amplifier die that is positioned in a second orientation on the PCB. The method further includes determining a third orientation of the second power amplifier die different than the second orientation, such that when the second power amplifier die is in the third orientation, the amount of emissions radiated by the first power amplifier die and the amount of emissions radiated by the second power amplifier die are distributed in different directions.

Embodiments of the disclosure relate to optimizing power efficiency of a power amplifier circuit to reduce power consumption in a remote unit in a wireless distribution system (WDS). A power amplifier circuit is provided in the remote unit to amplify a received input signal associated with a signal channel(s) to generate an output signal at an aggregated peak power. In this regard, a control circuit is configured to analyze at least one physical property related to the signal channel(s) to determine a maximum output power of the power amplifier circuit. Accordingly, the control circuit configures the power amplifier circuit according to the determined maximum output power. By configuring the maximum output power based on the signal channel(s) in the input signal, it may be possible to optimize the power efficiency of the power amplifier circuit, thus helping to reduce the power consumption of the remote unit.