Patent classifications
H03F2200/165
Power amplifier module, frontend circuit, and communication device
A PA module includes: a multilayer substrate having a ground pattern layer connected to a ground of a power source; amplifier transistors disposed on the multilayer substrate; a bypass capacitor having one end connected to the collector of the amplifier transistor; a first wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a second wiring line connecting the emitter of the amplifier transistor and the ground pattern layer to each other; a third wiring line connecting the other end of the bypass capacitor and the ground pattern layer to each other; and a fourth wiring line formed between the amplifier transistor and the ground pattern layer and between the bypass capacitor and the ground pattern layer and connecting the first wiring line and the third wiring line to each other.
Method for improving die area and power efficiency in high dynamic range digital microphones
Exemplary multipath digital microphones described herein can comprise exemplary embodiments of automatic gain control and multipath digital audio signal digital signal processing chains, which allow low power and die size to be achieved as described herein, while still providing a high DR digital microphone systems. Further non-limiting embodiments can facilitate switching between multipath digital audio signal digital signal processing chains while minimizing audible artifacts associated with either the change in the gain automatic gain control amplifiers switching between multipath digital audio signal digital signal processing chains.
Radio-frequency module and communication device
A radio-frequency module includes: a transmitting circuit disposed on a mounting substrate to process a radio-frequency signal input from a transmission terminal and to output a resultant signal to a common terminal; a receiving circuit disposed on the mounting substrate to process a radio-frequency signal input from the common terminal and to output a resultant signal to a reception terminal; a first inductor included in a first transmitting circuit; and a bonding wire connected to the ground and bridging over the first inductor.
Digital power amplifier with RF sampling rate and wide tuning range
A switching power amplifier includes logic circuitry that generates first and second components of a differential signal, based on received amplitude code and a delayed version of the same. The amplitude code includes a sign and a magnitude. When the sign is positive, a first logic path is configured to generate the first component based on the received amplitude code and the second logic path is configured to generate the second component based on the delayed amplitude code. When the sign is negative, the first logic path is configured to generate the first component based on the delayed amplitude code and the second logic path is configured to generate the second component based on the received amplitude code. The switching power amplifier further includes a differential-to-single ended conversion circuit configured to generate a single-ended signal based on the differential signal.
INPUT CURRENT TRIM FOR CHOPPER OPERATIONAL AMPLIFIER
In examples of a chopper operational amplifier, a current control circuit comprises a pair of voltage sources, each of which may be varied to generate a voltage signal of a particular value, and multiple inverters, each of which is configured to receive either a clock signal or its complement signal and one of the voltage signals. Based on these inputs, each inverter generates a control signal that is delivered to a corresponding switch in the input stage of the chopper operational amplifier to control the gate voltage of that switch. Based on the difference between the values of the voltage signals, the current control circuit operates to reduce the amplitudes of base currents induced by charge injection at the input terminals of the chopper operational amplifier.
POWER SPECTRAL SHAPING FOR IN-BAND EMISSION CONTROL
It is described a transmitter device (100) and a method for transmitting an analog signal (251, 261) via an electric cable (192). The transmitter device (100) comprises (a) a signal generation circuit (210) for generating a digital transmit signal (211) comprising a sequence of transmit symbols; (b) a filter circuit (230) for spectrally shaping the generated digital transmit signal (211, 221) and for outputting a filtered digital transmit signal (231); (c) a switching unit (240) comprising (c1) a first input terminal (242) for receiving the filtered digital transmit signal (231), (c2) a second input terminal (244) for receiving another digital transmit signal (297), (c3) an output terminal (246) for outputting a digital transmit output signal (241), wherein the digital transmit output signal (241) is based on, depending on a switching state of the switching unit (240), the filtered digital transmit signal (231) or the another digital transmit signal (297), and (c4) a control terminal (248) for receiving a control signal (285) from a control circuit (280), the control signal (285) being indicative for the switching state. The transmitter device (100) further comprises the control circuit (280); and a digital to analog converter (250) for receiving the digital transmit output signal (241) and for converting the received digital transmit output signal (241) to the analog signal (251, 261).
METHODS AND APPARATUS TO IMPLEMENT COMPENSATION CIRCUITRY IN AN ENVELOPE DETECTOR
An example apparatus includes: a compensation circuit including: a current compensation output, a first transistor with a first current terminal and a first control terminal, the first current terminal coupled to the current compensation output, and a resistor ladder with a tap terminal coupled to the first control terminal, a current mirror circuit having a mirror input and a mirror output, the mirror input coupled to the current compensation output, and a rectification circuit having an input coupled to the mirror output.
Cascode amplifier bias circuits
Bias circuits and methods for silicon-based amplifier architectures that are tolerant of supply and bias voltage variations, bias current variations, and transistor stack height, and compensate for poor output resistance characteristics. Embodiments include power amplifiers and low-noise amplifiers that utilize a cascode reference circuit to bias the final stages of a cascode amplifier under the control of a closed loop bias control circuit. The closed loop bias control circuit ensures that the current in the cascode reference circuit is approximately equal to a selected multiple of a known current value by adjusting the gate bias voltage to the final stage of the cascode amplifier. The final current through the cascode amplifier is a multiple of the current in the cascode reference circuit, based on a device scaling factor representing the relative sizes of the transistor devices in the cascode amplifier and in the cascode reference circuit.
RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
Improvement in heat dissipation capability is intended. A radio-frequency module includes a mounting substrate, a first transmission filter, a second transmission filter, a resin layer, and a shield layer. The second transmission filter is higher in power class than the first transmission filter. The resin layer covers at least part of an outer peripheral surface of the first transmission filter and covers at least part of an outer peripheral surface of the second transmission filter. The shield layer overlaps at least part of the second transmission filter in plan view in a thickness direction of the mounting substrate. At least part of a major surface of the second transmission filter on an opposite side to the mounting substrate side is in contact with the shield layer.
HIGH-FREQUENCY CIRCUIT AND COMMUNICATION DEVICE
A high-frequency circuit includes a power amplifier for a communication band A, and a power amplifier for a communication band B. Transmission in the communication band A, transmission in the communication band B, and reception in the communication band C can be simultaneously used. A frequency range of intermodulation distortion generated between a second harmonic wave of a transmission signal of the communication band A and a fundamental wave of a transmission signal of the communication band B, overlaps with at least part of a reception band of the communication band C. The power amplifier includes amplifying elements and an output trans including coils. One end of the coil is connected with an output of the amplifying element, the other end of the coil is connected with an output of the amplifying element, and one end of the coil is connected with an output terminal of the power amplifier.