Disclosed is a 5G (5.sup.th generation) or pre-5G communication system for supporting a data transmission rate higher than that of a 4G (4.sup.th generation) communication system such as long-term evolution (LTE). A transmission device comprises: a first amplification unit having a common source structure, including cross coupled capacitors, and amplifying an input signal; a second amplification unit, having a common gate structure, for amplifying a signal output from the first amplification unit; and a first removal unit which is connected to output terminals of the first amplification unit and input terminals of the second amplification unit and which removes at least one portion of second harmonics. The first removal unit can offset, with respect to a fundamental frequency, at least some of parasitic capacitance generated from the output terminals of the first amplification unit and the input terminals of the second amplification unit, and can ground a signal having a secondary harmonic frequency with respect to the secondary harmonic frequency.

A multiple-stage amplifier includes a driver stage die and a final stage die. The driver stage die includes a first type of semiconductor substrate (e.g., a silicon substrate), a first transistor, and an integrated portion of an interstage impedance matching circuit. A control terminal of the first transistor is electrically coupled to an RF signal input terminal of the driver stage die, and the integrated portion of the interstage impedance matching circuit is electrically coupled between a current-carrying terminal of the first transistor and an RF signal output terminal of the driver stage die. The second die includes a III-V semiconductor substrate (e.g., a GaN substrate) and a second transistor. A connection, which is a non-integrated portion of the interstage impedance matching circuit, is electrically coupled between the RF signal output terminal of the driver stage die and an RF signal input terminal of the final stage die.

Apparatus and methods for LNAs with mid-node impedance networks are provided herein. In certain configurations, an LNA includes a mid-node impedance circuit including a resistor and a capacitor electrically connected in parallel, a cascode device electrically connected between an output terminal and the mid-node impedance circuit, and a transconductance device electrically connected between the mid-node impedance circuit and ground. The transconductance device amplifies a radio frequency signal received from an input terminal. The LNA further includes a feedback bias circuit electrically connected between the output terminal and the input terminal and operable to control an input bias voltage of the transconductance device.

A chopper-stabilized current feedback amplifier includes an input buffer having a non-inverting input and an inverting input. A first group of chopper circuits modulate current at the non-inverting and inverting inputs. The current feedback amplifier further includes a plurality of current mirrors coupled to the input buffer. A second group of chopper circuits modulate current in the current mirrors. The current feedback amplifier also includes phase detector circuitry coupled to the current mirrors and configured to detect a transition current in the current mirrors. The current feedback amplifier also includes a switched capacitor filter having an input coupled to the current mirrors. The switched capacitor filter is turned OFF responsive to the detection of the transition current by the phase detector circuitry. The current feedback amplifier also includes an output stage having an input coupled to the switched capacitor filter and is configured to produce an output signal.

A multiple-stage amplifier includes a driver stage die and a final stage die. The driver stage die includes a first type of semiconductor substrate (e.g., a silicon substrate), a first transistor, and an integrated portion of an interstage impedance matching circuit. A control terminal of the first transistor is electrically coupled to an RF signal input terminal of the driver stage die, and the integrated portion of the interstage impedance matching circuit is electrically coupled between a current-carrying terminal of the first transistor and an RF signal output terminal of the driver stage die. The second die includes a III-V semiconductor substrate (e.g., a GaN substrate) and a second transistor. A connection, which is a non-integrated portion of the interstage impedance matching circuit, is electrically coupled between the RF signal output terminal of the driver stage die and an RF signal input terminal of the final stage die.

A Class D amplifier having an integrating primary amplifier with an internal feedback, the amplifier further comprising a feedback loop with a filter of at least second order.

An amplifier circuit with in-band gain degradation compensation is shown. The amplifier circuit has an input-stage amplifier, at least one intermediate-stage amplifier, and an output-stage amplifier cascaded between an input port and an output port of the amplifier circuit. A compensation capacitor is coupled between the output port of the amplifier circuit and an output port of the input-stage amplifier. A high-order damping circuit is coupled to an output port of the intermediate-stage amplifier.

An amplification circuit includes: an amplifier including a transistor that is connected between an input terminal and an output terminal; an input matching network that is connected between the input terminal and an input side of the amplifier and converts an impedance from a low impedance to a high impedance; a limiter circuit that is connected between a node between the input matching network and the input side of the amplifier, and ground and includes two diodes connected in opposite directions to each other; and a capacitor that is connected in series with the limiter circuit between the node and ground.

Apparatus and methods for LNAs with mid-node impedance networks are provided herein. In certain configurations, an LNA includes a mid-node impedance circuit including a resistor and a capacitor electrically connected in parallel, a cascode device electrically connected between an output terminal and the mid-node impedance circuit, and a transconductance device electrically connected between the mid-node impedance circuit and ground. The transconductance device amplifies a radio frequency signal received from an input terminal. The LNA further includes a feedback bias circuit electrically connected between the output terminal and the input terminal and operable to control an input bias voltage of the transconductance device.

A power amplifier apparatus includes a semiconductor substrate, a plurality of first transistors on the semiconductor substrate, a plurality of second transistors, at least one collector terminal electrically connected to collectors of the plurality of first transistors, a first inductor having a first end electrically connected to the collector terminal and a second end electrically connected to a power supply potential, at least one emitter terminal electrically connected to emitters of the plurality of second transistors and adjacent to the collector terminal in a second direction, a second inductor having a first end electrically connected to the emitter terminal and a second end electrically connected to a reference potential, and at least one capacitor having a first end electrically connected to the collectors of the plurality of first transistors and a second end electrically connected to the emitters of the plurality of second transistors.