RF amplifiers are provided that include a submount such as a thermally conductive flange. A dielectric substrate is mounted on an upper surface of the submount, the dielectric substrate having a first outer sidewall, a second outer sidewall that is opposite and substantially parallel to the first outer sidewall, and an interior opening. An RF amplifier die is mounted on the submount within the interior opening of the dielectric substrate, where a longitudinal axis of the RF amplifier die defines a first axis. The RF amplifier die is positioned so that a first angle defined by the intersection of the first axis with the first outer sidewall is between 5 and 45. The dielectric substrate may be a ceramic substrate or a dielectric layer of a printed circuit board.

CRLH lines including left-handed shunt inductors and left-handed series capacitors are provided on gate side transmission lines of a plurality of FETs.

According to one embodiment, a low noise amplifier (LNA) circuit includes a first stage which includes: a first transistor; a second transistor coupled to the first transistor; a first inductor coupled in between an input port and a gate of the first transistor; and a second inductor coupled to a source of the first transistor, where the first inductor and the second inductor resonates with a gate capacitance of the first transistor for a dual-resonance. The LNA circuit includes a second stage including a third transistor; a fourth transistor coupled between the third transistor and an output port; and a passive network coupled to a gate of the third transistor. The LNA circuit includes a capacitor coupled in between the first and the second stages, where the capacitor transforms an impedance of the passive network to an optimal load for the first amplifier stage.

The present disclosure relates to a power amplifier (PA) system provided in a semiconductor device and having feed forward gain control. The PA system comprises a transmit path and control circuitry. The transmit path is configured to amplify an input radio frequency (RF) signal and comprises a first tank circuit and a PA stage. The control circuitry is configured to detect a power level associated with the input RF signal and control a first bias signal provided to the PA stage based on a first function of the power level and control a quality factor (Q) of the first tank circuit based on a second function of the power level.

Embodiments of RF amplifiers and packaged RF amplifier devices each include a transistor with a drain-source capacitance that is relatively low, an input impedance matching circuit, and an input-side harmonic termination circuit. The input impedance matching circuit includes a harmonic termination circuit, which in turn includes a first inductance (a first plurality of bondwires) and a first capacitance coupled in series between the transistor output and a ground reference node. The input impedance matching circuit also includes a second inductance (a second plurality of bondwires), a third inductance (a third plurality of bondwires), and a second capacitance coupled in a T-match configuration between the input lead and the transistor input. The first and second capacitances may be metal-insulator-metal capacitors in an integrated passive device.

A Doherty amplifier includes: a carrier amplifier to amplify a first high frequency signal having a first higher harmonic and a second higher harmonic; a peak amplifier to amplify a second high frequency signal having the first higher harmonic and the second higher harmonic; a first series resonant circuit connected between an output end of the carrier amplifier and a ground, and configured to resonate at the frequency of the first higher harmonic; a second series resonant circuit connected between an output end of the peak amplifier and the ground, and configured to resonate at the frequency of the first higher harmonic; a first parallel resonant circuit configured to resonate at the frequency of the second higher harmonic; and a second parallel resonant circuit configured to resonate at the frequency of the second higher harmonic.

According to one embodiment, a low noise amplifier (LNA) circuit includes a first stage which includes: a first transistor; a second transistor coupled to the first transistor; a first inductor coupled in between an input port and a gate of the first transistor; and a second inductor coupled to a source of the first transistor, where the first inductor and the second inductor resonates with a gate capacitance of the first transistor for a dual-resonance. The LNA circuit includes a second stage including a third transistor; a fourth transistor coupled between the third transistor and an output port; and a passive network coupled to a gate of the third transistor. The LNA circuit includes a capacitor coupled in between the first and the second stages, where the capacitor transforms an impedance of the passive network to an optimal load for the first amplifier stage.

Embodiments of RF amplifiers and packaged RF amplifier devices each include a transistor with a drain-source capacitance that is relatively low, an input impedance matching circuit, and an input-side harmonic termination circuit. The input impedance matching circuit includes a harmonic termination circuit, which in turn includes a first inductance (a first plurality of bondwires) and a first capacitance coupled in series between the transistor output and a ground reference node. The input impedance matching circuit also includes a second inductance (a second plurality of bondwires), a third inductance (a third plurality of bondwires), and a second capacitance coupled in a T-match configuration between the input lead and the transistor input. The first and second capacitances may be metal-insulator-metal capacitors in an integrated passive device.

A logarithmic detector amplifying (LDA) system is provided for use as a high sensitivity receive booster or replacement for a low noise amplifier in a receive chain of a communication device. The LDA system includes an amplifying circuit configured to receive an input signal having a first frequency and generate an oscillation based on the input signal, a sampling circuit coupled to the amplifying circuit and configured to terminate the oscillation based on a predetermined threshold to periodically clamp and restart the oscillation to generate a series of pulses modulated by the oscillation and by the input signal, and one or more resonant circuits coupled with the amplifying circuit and configured to establish a frequency of operation and to generate an output signal having a second frequency, the second frequency being substantially the same as the first frequency.

A communication module includes a first input terminal to which a first signal of a first frequency band is input, a second input terminal to which a second signal of a second frequency band is input, an amplifier that outputs an amplified signal which is obtained by amplifying the first signal, a diplexer that receives the amplified signal and/or the second signal and that outputs an output signal of the first and/or second frequency band, and a harmonic termination circuit that short-circuits a harmonic of the second signal. The harmonic termination circuit has an end connected between the second input terminal and the diplexer, and another end grounded at a ground position. A distance in plan view between the first input terminal and the ground position of the harmonic termination circuit is longer than a distance in plan view between the first input terminal and the second input terminal.