H03F2200/273

ISOLATION CIRCUIT
20180342989 · 2018-11-29 · ·

An isolation circuit and a method for providing isolation between two dies are provided. The isolation circuit includes: an isolation module, configured to generate an isolation signal based on an input signal from a first die and to provide isolation between the first die and a second die, where the isolation signal is smaller than the input signal in amplitude, and the first die is coupled with the second die; a latch module, configured to latch the isolation signal at a certain level and output a latched signal; an amplifier module, configured to amplify the latched signal. In the isolation circuit, a modulation module and a demodulation module can be saved.

GALVANICALLY ISOLATED AMPLIFIERS AND RELATED METHODS

A Galvanically Isolated Amplifier (GIA) includes an isolation barrier to galvanically isolate high voltage circuitry from low voltage circuitry. The high voltage circuitry has at least two voltage supply rails, with the voltage supply rail closest to ground potential at a first potential relative to the ground potential. The low voltage circuitry has at least two voltage supply rails, with the voltage supply rail closest to the ground potential at a second potential, the second potential being smaller than the first potential. A Radio Frequency (RF) carrier is digitally Phase Shift Keying (PSK) modulated for transmission across the isolation barrier. The unmodulated RF carrier could also be transmitted across the isolation barrier. PSK modulation could be applied to the RF carrier based on a test waveform to generate a PSK-modulated test signal for transmission while a voltage transient is applied between the high voltage circuitry and the low voltage circuitry.

ENVELOPE FREQUENCY AND HARMONICS TERMINATION FOR RF AMPLIFIERS
20250070724 · 2025-02-27 ·

Methods and devices for termination of an envelope frequency and harmonics in an RF amplifier are presented. A multifunctional filter is coupled to an RF node of the RF amplifier to provide first and second conduction paths between the RF node and first/second low impedance nodes. The first conduction path provides a low impedance at the envelope frequency and high impedances at an operating frequency of the RF amplifier and corresponding higher order harmonics. The second conduction path provides a low impedance at the higher order harmonics and high impedances at the envelope frequency and at the operating frequency. The multifunctional filter includes first/second inductors in series connection between the RF node and the first low impedance node. According to one aspect, the first/second inductors are coupled to first/second capacitors to respectively form a tank circuit and a trap circuit operating at the frequencies of the harmonics.

PRE-DISTORTION TRAINING FEEDBACK VIA INDUCTIVE COUPLING
20250247057 · 2025-07-31 ·

Certain aspects of the present disclosure provide techniques for pre-distortion training feedback via inductive coupling. An example apparatus includes a receive path; a transmit path comprising an amplifier having a first output that is inductively coupled to the receive path; a memory; and a processor coupled to the memory. The processor is configured to cause the apparatus to obtain a first signal, based on a second signal output by the amplifier, via the receive path being inductively coupled to the first output of the amplifier; determine a parameter for pre-distortion associated with the amplifier based at least in part on the first signal; pre-distort a third signal based at least in part on the parameter; amplify the pre-distorted third signal via the amplifier; and transmit the amplified third signal.