Processes and systems for producing glass fibers having regions devoid of glass using submerged combustion melters, including feeding a vitrifiable feed material into a feed inlet of a melting zone of a melter vessel, and heating the vitrifiable material with at least one burner directing combustion products of an oxidant and a first fuel into the melting zone under a level of the molten material in the zone. One or more of the burners is configured to impart heat and turbulence to the molten material, producing a turbulent molten material comprising a plurality of bubbles suspended in the molten material, the bubbles comprising at least some of the combustion products, and optionally other gas species introduced by the burners. The molten material and bubbles are drawn through a bushing fluidly connected to a forehearth to produce a glass fiber comprising a plurality of interior regions substantially devoid of glass.

A circuit for driving a capacitive load includes an amplifier for driving the load based on an input signal, the amplifier comprising at least a boost converter, a dynamic model configured to track a capacitance of the load and a voltage of the source for powering at least parts of the circuit, an adaptive filter, configured to filter the input signal based on an output of the dynamic model.

The disclosed technology provides a system for transmitting wireless power for charging electronic devices, e.g., smartphones, medical appliances, industrial equipment, and robotics. Some embodiments include parallel tuned resonant LC networks, load networks, and impedance matching networks for Class D and E, single-ended or differential, amplifier topologies for wireless power transfer in resonant inductive systems.

An amplifier circuit includes an input terminal used to receive an input signal, an output terminal used to output an output signal, an amplification unit, and a phase adjustment unit. The amplification unit includes an input terminal coupled to the input terminal of the amplifier circuit, an output terminal coupled to the output terminal of the amplifier circuit, a first terminal coupled to a first voltage terminal, and a second terminal coupled to a second voltage terminal. The phase adjustment unit is coupled to the amplification unit. When the amplifier circuit is operated in a first mode, the output signal has a first phase, and when the amplifier circuit is operated in a second mode, the output signal has a second phase. A difference between the first phase and the second phase is within a predetermined range.

Example embodiments relate to push-pull class E amplifiers. One example push-pull class E amplifier includes an input configured for receiving a signal to be amplified. The push-pull class E amplifier also includes an output configured for outputting the signal after amplification. Additionally, the push-pull class E amplifier includes a printed circuit board having a first dielectric layer and a second dielectric layer. Further, the push-pull class E amplifier includes a first amplifying unit and a second amplifying unit. Yet further, the push-pull class E amplifier includes a balun, a capacitive unit, a first line segment, a second line segment, a third line segment, and a fourth line segment. The first line segment and the second line segment are arranged on the first dielectric layer. A combined length of the third line segment and the fourth line segment corresponds to a quarter wavelength of an operational frequency of the amplifier.

In some implementations, there is provided an apparatus comprising a resonant amplifier circuit including a first inductor having a first inductive input and a first inductive output; a second inductor having a second inductive input and a second inductive output; a first switch coupled to the first inductive output; and a second switch coupled to the second inductive output, wherein the first switch and the second switched are driven out of phase, wherein the first inductor is configured to be resonant with a first capacitance associated with the first switch, and wherein the second inductor is configured to be resonant with a second capacitance associated with the second switch. Related systems and articles of manufacture are also provided.

A transistor stack can include a combination of floating and body tied devices. Improved performance of the RF amplifier can be obtained by using a single body tied device as the input transistor of the stack, or as the output transistor of the stack, while other transistors of the stack are floating transistors. Transient response of the RF amplifier can be improved by using all body tied devices in the stack.

A power amplifier including: a main power amplification device having an output; an auxiliary power amplification device having an output; a load modulation circuit operably connected to the output of the main power amplification device and the output of the auxiliary power amplification device; and a post-matching circuit operably connected to load modulation circuit. The load modulation circuit is arranged to enable fundamental frequency load modulation and to enable modulated harmonic terminations of at least the second and third harmonic frequencies. The modulated harmonic terminations may include drain terminations.

Bias circuits and methods for silicon-based amplifier architectures that are tolerant of supply and bias voltage variations, bias current variations, and transistor stack height, and compensate for poor output resistance characteristics. Embodiments include power amplifiers and low-noise amplifiers that utilize a cascode reference circuit to bias the final stages of a cascode amplifier under the control of a closed loop bias control circuit. The closed loop bias control circuit ensures that the current in the cascode reference circuit is approximately equal to a selected multiple of a known current value by adjusting the gate bias voltage to the final stage of the cascode amplifier. The final current through the cascode amplifier is a multiple of the current in the cascode reference circuit, based on a device scaling factor representing the relative sizes of the transistor devices in the cascode amplifier and in the cascode reference circuit.

Example embodiments relate to push-pull class E amplifiers. One example push-pull class E amplifier includes an input configured for receiving a signal to be amplified. The push-pull class E amplifier also includes an output configured for outputting the signal after amplification. Additionally, the push-pull class E amplifier includes a printed circuit board having a first dielectric layer and a second dielectric layer. Further, the push-pull class E amplifier includes a first amplifying unit and a second amplifying unit. Yet further, the push-pull class E amplifier includes a balun, a capacitive unit, a first line segment, a second line segment, a third line segment, and a fourth line segment. The first line segment and the second line segment are arranged on the first dielectric layer. A combined length of the third line segment and the fourth line segment corresponds to a quarter wavelength of an operational frequency of the amplifier.