H03F2200/318

LINEARIZING CIRCUIT AND METHOD FOR AMPLIFIER
20170026000 · 2017-01-26 ·

Linearizing circuit and method for amplifier. In some embodiments, a biasing circuit assembly for an amplifier can include a biasing circuit configured to provide a first bias signal or a second bias signal through a common node and a ballast to an input path of an amplifying transistor for operation in a first mode or a second mode, respectively. The biasing circuit assembly can further include a linearizing circuit implemented to couple the common node and a node along the input path. The linearizing circuit can be configured to improve linearity of the amplifying transistor operating in the first mode while allowing the ballast to be sufficiently robust for the amplifying transistor operating in the second mode.

Power amplifier circuit

A power amplifier circuit includes a differential amplifier circuit configured to amplify a radio-frequency signal, a transformer disposed on an output side with respect to the differential amplifier circuit and including a primary winding and a secondary winding, and a dispersion circuit coupled to a midpoint of the primary winding of the transformer and configured to operate as an adjustment circuit. The dispersion circuit is configured to adjust, based on a supply voltage controlled in accordance with the envelope of the radio-frequency signal, a bias (bias current or bias voltage) to be supplied to the differential amplifier circuit.

Multiband RF switch ground isolation

A radio frequency (RF) switch semiconductor die and an RF supporting structure are disclosed. The RF switch semiconductor die is attached to the RF supporting structure. The RF switch semiconductor die has a first edge and a second edge, which may be opposite from the first edge. The RF supporting structure has a group of alpha supporting structure connection nodes, which is adjacent to the first edge; a group of beta supporting structure connection nodes, which is adjacent to the second edge; and an alpha AC grounding supporting structure connection node, which is adjacent to the second edge. When the group of alpha supporting structure connection nodes and the alpha AC grounding supporting structure connection node are active, the group of beta supporting structure connection nodes are inactive.

Hybrid power amplifier having electrical and thermal conduction path

A heterojunction bipolar transistor (HBT) hybrid type RF (radio frequency) power amplifier includes a first device including an input terminal for receiving an RF signal, a pre-driver stage for amplifying the received RF signal, and an output terminal, the input terminal, the pre-driver stage and the output terminal being disposed in or over a first substrate; and a second device having a main stage having an HBT amplifier circuit disposed in or over a second substrate to further amplify the RF signal amplified by the pre-driver stage. The RF signal further amplified by the main stage is output through the output terminal of the first device.

PROCESS-COMPENSATED HBT POWER AMPLIFIER BIAS CIRCUITS AND METHODS

The present disclosure relates to a system for biasing a power amplifier. The system can include a first die that includes a power amplifier circuit and a passive component having an electrical property that depends on one or more conditions of the first die. Further, the system can include a second die including a bias signal generating circuit that is configured to generate a bias signal based at least in part on measurement of the electrical property of the passive component of the first die.

INTEGRATED RF FRONT END SYSTEM
20170018607 · 2017-01-19 ·

Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.

POWER AMPLIFICATION MODULE

Provided is a power amplification module that includes: an amplification transistor that has a constant power supply voltage supplied to a collector thereof, a bias current supplied to a base thereof and that amplifies an input signal input to the base thereof and outputs an amplified signal from the collector thereof; a first current source that outputs a first current that corresponds to a level control voltage that is for controlling a signal level of the amplified signal; and a bias transistor that has the first current supplied to a collector thereof, a bias control voltage connected to a base thereof and that outputs the bias current from an emitter thereof.

Apparatus and methods for capacitive load reduction of an envelope tracker
09548702 · 2017-01-17 · ·

Apparatus and methods for capacitive load reduction are disclosed. In one embodiment, a power amplifier system includes a plurality of power amplifiers and an envelope tracking module for generating a supply voltage for the power amplifiers. The power amplifier system further includes a switch and a decoupling capacitor operatively associated with a first power amplifier of the system. The switch is configured to electrically float an end of the decoupling capacitor when the first power amplifier is disabled so as to reduce capacitive loading of the envelope tracker and to operate as a dampening resistor when the power amplifier is enabled so as to improve the stability of the system.

APPARATUS AND METHODS FOR TUNABLE POWER AMPLIFIERS
20170012588 · 2017-01-12 ·

A power amplifier is described. The power amplifier including at least a first amplifier stage, and at least a first tunable matching network. The first tunable matching network is configured to couple between a first impedance and a second impedance. The first matching network including at least one first set of metal oxide semiconductor variable capacitor arrays.

Broadband power amplifier systems and methods
09537452 · 2017-01-03 · ·

Disclosed are systems, devices, and methodologies to reduce harmonics in a radio frequency output signal. A power amplifier system comprises a power amplifier and a tunable output matching network electrically connected between the output of the power amplifier and an output of the tunable output matching network. The tunable output matching network reduces second-order harmonics in an amplified radio frequency signal when the power amplifier operates in a low frequency mode. The tunable output matching network includes traps such as a series inductor and a first capacitor in series with a first switch, a second capacitor in series with a second switch, and a third capacitor in series with a third switch, where the traps are tuned to selected harmonic frequencies when the power amplifier operates in the low frequency band of the operating band of frequencies.