H03F2200/318

OUTPUT MATCHING CIRCUIT AND POWER AMPLIFIER CIRCUIT
20220182025 · 2022-06-09 ·

An output matching circuit includes: a converter electrically connected to an output end of a power amplifier element to convert an impedance of the output end to an impedance higher than the impedance of the output end by magnetic coupling; and a first filter circuit electrically connected between the output end of the power amplifier element and the converter to make a short circuit in a frequency band different from a predetermined transmission frequency band.

POWER AMPLIFIER WITH A POWER TRANSISTOR AND AN ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT ON SEPARATE SUBSTRATES

An amplifier includes a semiconductor die and a substrate that is distinct from the semiconductor die. The semiconductor die includes a first RF signal input terminal, a first RF signal output terminal, and a transistor. The transistor has a control terminal electrically coupled to the first RF signal input terminal, and a current-carrying terminal electrically coupled to the first RF signal output terminal. The substrate includes a second RF signal input terminal, a second RF signal output terminal, circuitry coupled between the second RF signal input terminal and the second RF signal output terminal, and an electrostatic discharge (ESD) protection circuit. The amplifier also includes a connection electrically coupled between the ESD protection circuit and the control terminal of the transistor. The substrate may be another semiconductor die (e.g., with a driver transistor and/or impedance matching circuitry) or an integrated passive device.

Switched Capacitor Modulator

A switched capacitor modulator (SCM) includes a RF power amplifier. The RF power amplifier receives a rectified voltage and a RF drive signal and modulates an input signal in accordance with the rectified voltage to generate a RF output signal to an output terminal. A reactance in parallel with the output terminal is configured to vary in response to a control signal to vary an equivalent reactance in parallel with the output terminal. A controller generates the control signal and a commanded phase. The commanded phase controls the RF drive signal. The reactance is at least one of a capacitance or an inductance, and the capacitance or the inductance varies in accordance with the control signal.

Amplification apparatus and method

Amplification device and processes capable of miniaturization in a device for performing linear amplification and switching amplification operations on incoming signals are provided. The amplifying device includes a first amplifying unit for amplifying an input signal and outputting a first output signal, the input switch unit connected in parallel with the first amplifying unit for performing a switching operation by an input signal and outputting a switch output signal, and a second amplifying unit for amplifying a first output signal or a switch output signal and outputting a second output signal, and the first amplifying unit or the input switch unit operates based on the type of the input signal.

AMPLIFIER WITH STACKED TRANSCONDUCTING CELLS IN CURRENT MODE COMBINING
20220166386 · 2022-05-26 ·

An amplifier with stacked transconducting cells in “current mode combining” is disclosed herein. In one or more embodiments, a method for operation of a high-voltage signal amplifier comprises inputting, into each transconducting cell of a plurality of transconducting cells, a direct current (DC) supply current (Idc), an alternating current (AC) radio frequency (RF) input current (I.sub.RF_IN), and an RF input signal (RF.sub.IN). The method further comprises outputting, by each of the transconducting cells of the plurality of transconducting cells, the DC supply current (Idc) and an AC RF output current (I.sub.RF_OUT). In one or more embodiments, the transconducting cells are connected together in cascode for the DC supply current, and are connected together in cascade for the AC RF input and output currents.

Semiconductor device and amplifier having bonding wire and conductive member
11342279 · 2022-05-24 · ·

A semiconductor device includes a ground plane, a capacitor disposed on the ground plane and having a first top surface, a semiconductor chip disposed on the ground plane and having a second top surface, a bonding wire connecting the first top surface and the second top surface, and a conductive member disposed on the ground plane. The conductive member is electrically connected to the ground plane. The bonding wire extends in a first direction in a planar view normal to the ground plane. The conductive member is positioned apart from the bonding wire in a second direction orthogonally intersecting in the planar view with the first direction.

WIDEBAND DOHERTY POWER AMPLIFIER
20220158591 · 2022-05-19 ·

The present invention provides a wideband Doherty power amplifier comprising: a main power amplification device; an auxiliary power amplification device arranged in parallel with the main power amplification device; and a coupled phase compensation network configured for compensating a phase shift between the main power amplification device and the auxiliary power amplification device. The phase compensation network comprising a first transmission line section; a second transmission line section extending substantially collinearly with the first transmission line section; and two pairs of end-connected coupled transmission lines connected in parallel between the first transmission line section and the second transmission line section. The provided Doherty power amplifier demonstrated operation at 6 dB back-off between 1.3-2.3 GHz with efficiency in excess of 41%, which can be used in modern and future wireless communication systems which require power amplifiers operating over a wide frequency range.

Doherty amplifier arrangement

The present disclosure relates to an amplifier arrangement comprising a first amplifier, a second amplifier and an output combiner arranged to combine respective output signals of the first amplifier and the second amplifier into an output signal of the amplifier arrangement. An amplifier arrangement input signal is arranged as input signal to the first amplifier, and a difference signal, representing a difference between the amplifier arrangement input signal and a scaled output signal of the first amplifier, is arranged as input to the second amplifier. The output combiner is arranged to modulate the loads of the first amplifier and the second amplifier in dependence of the output signal of the second amplifier.

Power amplifier circuit

A power amplifier circuit includes a power amplifier that amplifies an input signal and outputs the amplified signal from an output terminal thereof, a first filter circuit that has a frequency characteristic that attenuates an Nth-order harmonic of the amplified signal, N that is an integer greater than or equal to 2, and a second filter circuit that has a frequency characteristic that attenuates the Nth-order harmonic of the amplified signal. The first filter circuit includes a first capacitor and a first inductor. The first capacitor and the first inductor are connected in series between the output terminal and ground. The second filter circuit includes a second capacitor and a second inductor. The second capacitor and the second inductor are connected in series between the output terminal and ground.

Amplifier

An amplifier is configured in such a way that a first capacitor resonates at the frequency of a second harmonic wave included in a signal outputted from an amplifying element, a circuit including a second transmission line, the first capacitor, and a second capacitor resonates at the frequency of a third harmonic wave included in the signal outputted from the amplifying element, and also matches the impedance for a fundamental wave together with an impedance matching circuit.