A first primary line has a first node at one end and a third node at another end and transmits a radio-frequency signal between the first node and the third node. A second primary line has a second node at one end and a fourth node at another end and transmits a radio-frequency signal between the second node and the fourth node. A first secondary line has a portion connected to the second node and is electromagnetically coupled to the first primary line. The second secondary line has a portion connected to the first node and has another end connected to a portion of the first secondary line. The second secondary line is electromagnetically coupled to the second primary line. A first capacitor is connected in parallel to a portion of the second primary line or a portion of the second secondary line.

A musical instrument preamplifier includes a n-type JFET and a pnp current mirror connected to the drain side of the JFET. The pnp current mirror includes two pnp transistors. The current mirror is configured to control the current to independently set the operating point of the JFET and the output. An npn transistor is connected to one of the pnp transistors of the current mirror to form an inverted Sziklai pair. An auto-bias network is connected between the npn and pnp transistors that form the Sziklai pair.

A front end module (FEM) integrated circuit (IC) architecture that uses the same LNA in each of several frequency bands extending over a wide frequency range. In some embodiments, switched impedance circuits distributed throughout the front end circuit allow selection of the frequency response and impedances that are optimized for particular performance parameters targeted for a desired device characteristic. Such switched impedance circuits tune the output and input impedance match and adjust the gain of the LNA for specific operating frequencies and gain targets. In addition, adjustments to the bias of the LNA can be used to optimize performance trade-offs between the total direct current (DC) power dissipated versus radio frequency (RF) performance. By selecting appropriate impedances throughout the circuit using switched impedance circuits, the LNA can be selectively tuned to operate optimally at a selected bias for operation within selected frequency bands.

A TX/RX switch includes a power amplifier (PA), a Low Noise Amplifier (LNA), and an antenna connection. The PA is connected to a PA matching network that has a PA network impedance and a common PA-LNA impedance connected in one or more series-parallel combinations in different embodiments in a transmitting mode. The LNA is connected to a LNA matching network that has a LNA network impedance and the same common PA-LNA impedance connected in one or more series-parallel combinations in a receive mode. A mode switch can connect the common PA-LNA impedance in different configurations to enable the transmitting and receiving mode respectively. In some embodiments, the mode switch can short or open circuit the connection of the PA matching circuit or the LNA matching circuit to the antenna. In some embodiments, the mode switch can also turn power on or off to the PA or the LNA when the switch is in a mode where the respective amplifier is not selected. Accordingly, with specific design limitations on the common PA-LNA impedance combined with different mode switch configurations of the TX/RX switch components in either the TX or RX mode, the TX/RX switch operates within a design bandwidth without transmission lines embedded in the TX/RX switch circuitry and provides optimum power transfer from/to the antenna at the antenna connection with reduced noise.

Temperature compensation circuits and methods for adjusting one or more circuit parameters of a power amplifier (PA) to maintain approximately constant Gain versus time during pulsed operation sufficient to substantially offset self-heating of the PA. Some embodiments compensate for PA Gain “droop” due to self-heating using a Sample and Hold (S&H) circuit. The S&H circuit samples and holds an initial temperature of the PA at commencement of a pulse. Thereafter, the S&H circuit generates a continuous measurement that corresponds to the temperature of the PA during the remainder of the pulse. A Gain Control signal is generated that is a function of the difference between the initial temperature and the operating temperature of the PA as the PA self-heats for the duration of the pulse. The Gain Control signal is applied to one or more adjustable or tunable circuits within a PA to offset the Gain droop of the PA.

The integrated circuit includes a power amplifier, an antenna, and a matching and filtering network including a direct current power supply stage on an output node of the power amplifier, a first section, and a second section. The direct current power supply stage and the two sections include inductor-capacitor “LC” arrangements configured to have an impedance that is matched to the output of the power amplifier in the fundamental frequency band. The LC arrangements of the direct current power supply stage and of the first section are furthermore configured to have resonant frequencies that are respectively adapted to attenuate harmonic frequency bands of the fundamental frequency band.

A dual-drive power amplifier (PA) where the PA core includes a differential pair of transistors M1 and M2 that are driven by a coupling network having two transmission-line couplers, where a first transmission line section of a coupler is configured to transmit an input signal Vin through to drive a gate of the opposite transistor, while the second transmission line section is grounded at one end and coupled with the first transmission line section such that a coupled portion αVin of the input signal Vin drives the source terminal of a corresponding transistor. The arrangement of the coupling network allows the source terminals to be driven below ground potential. Embodiments disclosed here further provide an input matching network, a driver, an inter-stage matching network, and an output network for practical implementation of the PA core.

An electronic device may include wireless circuitry with processor circuitry, a transceiver circuit, a front-end module, and an antenna. The front-end module may include amplifier circuitry such as low noise amplifier circuitry for amplifying received radio-frequency signals. The amplifier circuitry may include an amplifier having an input and an output, an adjustable load component coupled to the input, and an adjustable feedback component coupled across the input and output. A control circuit may simultaneously adjust the load and feedback components to tune the gain of the amplifier circuitry while maintaining the input resistance at a desired target level. The load and feedback components can be the same or different types of adjustable passive components.

The present disclosure generally relates to techniques and apparatus for implementing an envelope-tracking power supply for a radio frequency (RF) power amplifier. One aspect includes an amplification system. The amplification system may include a first amplifier configured to generate an amplifier output voltage, a second amplifier having an output coupled to a supply node for the first amplifier, a voltage regulator having an output coupled to a supply node for the second amplifier, and control circuitry configured to control the voltage regulator to generate a supply voltage at the supply node for the second amplifier based on an indication associated with the amplifier output voltage. In some aspects, the control circuitry may be configured to control the voltage regulator through at least providing an updated control setting for the voltage regulator with a periodicity associated with a power control period.

Embodiments of RF amplifiers and packaged RF amplifier devices each include an amplification path with a transistor die, and an output-side impedance matching circuit having a T-match circuit topology. The output-side impedance matching circuit includes a first inductive element connected between the transistor output terminal and a quasi RF cold point node, a second inductive element connected between the quasi RF cold point node and an output of the amplification path, and a first capacitance connected between the quasi RF cold point node and a ground reference node. The RF amplifiers and devices also include a baseband termination circuit connected to the quasi RF cold point node, which includes a third inductive element, a resistor, and a second capacitance in series between the quasi RF cold point node and the ground reference node and a third capacitance between a baseband termination circuit node and the ground reference node.