A multi-band power amplifier module includes at least one transmission input terminal, at least one power amplifier circuit that receives a first transmission signal and a second transmission signal through the at least one transmission input terminal, a first filter circuit that allows the first transmission signal to pass therethrough, a second filter circuit that allows the second transmission signal to pass therethrough, at least one transmission output terminal through which the first and second transmission signals output from the first and second filter circuits are output, a transmission output switch that outputs each of the first and second transmission signals output from the at least one power amplifier circuit to the first filter circuit or the second filter circuit, and a first tuning circuit that adjusts impedance matching between the at least one power amplifier circuit and the at least one transmission output terminal.

A system for split-frequency amplification, preferably including: one or more primary-band amplification stages, one or more secondary-band amplification stages, one or more band-splitting filters, and/or one or more signal couplers. An analog canceller including one or more split-frequency amplifiers. A mixer including one or more split-frequency amplifiers. A voltage-controlled oscillator including one or more split-frequency amplifiers. A method for split-frequency amplification, preferably including: receiving an input signal, separating the input signal into signal portions, and/or amplifying the signal portions, and optionally including combining the amplified signal portions and/or providing one or more output signals.

An integrated circuit is disclosed comprising at least one first field effect transistor, having at least one first source contact and at least one first drain contact and at least one first gate contact, and at least one second field effect transistor, having at least one second source contact and at least one second drain contact and at least one second gate contact, wherein the first drain contact is connected to the second drain contact, and the first source contact is coupled to the second gate contact, wherein the first source contact, the first drain contact, the first gate contact, the second source contact, the second drain contact and the second gate contact are implemented as structured metallization layers on a single substrate, and the first and second drain contacts share at least one single dedicated surface area on said substrate.

A system for split-frequency amplification, preferably including: one or more primary-band amplification stages, one or more secondary-band amplification stages, one or more band-splitting filters, and/or one or more signal couplers. An analog canceller including one or more split-frequency amplifiers. A mixer including one or more split-frequency amplifiers. A voltage-controlled oscillator including one or more split-frequency amplifiers. A method for split-frequency amplification, preferably including: receiving an input signal, separating the input signal into signal portions, and/or amplifying the signal portions, and optionally including combining the amplified signal portions and/or providing one or more output signals.

A system for split-frequency amplification, preferably including: one or more primary-band amplification stages, one or more secondary-band amplification stages, one or more band-splitting filters, and/or one or more signal couplers. An analog canceller including one or more split-frequency amplifiers. A mixer including one or more split-frequency amplifiers. A voltage-controlled oscillator including one or more split-frequency amplifiers. A method for split-frequency amplification, preferably including: receiving an input signal, separating the input signal into signal portions, and/or amplifying the signal portions, and optionally including combining the amplified signal portions and/or providing one or more output signals.

A multi-band power amplifier module includes at least one transmission input terminal, at least one power amplifier circuit that receives a first transmission signal and a second transmission signal through the at least one transmission input terminal, a first filter circuit that allows the first transmission signal to pass therethrough, a second filter circuit that allows the second transmission signal to pass therethrough, at least one transmission output terminal through which the first and second transmission signals output from the first and second filter circuits are output, a transmission output switch that outputs each of the first and second transmission signals output from the at least one power amplifier circuit to the first filter circuit or the second filter circuit, and a first tuning circuit that adjusts impedance matching between the at least one power amplifier circuit and the at least one transmission output terminal.

A multi-band power amplifier module includes at least one transmission input terminal, at least one power amplifier circuit that receives a first transmission signal and a second transmission signal through the at least one transmission input terminal, a first filter circuit that allows the first transmission signal to pass therethrough, a second filter circuit that allows the second transmission signal to pass therethrough, at least one transmission output terminal through which the first and second transmission signals output from the first and second filter circuits are output, a transmission output switch that outputs each of the first and second transmission signals output from the at least one power amplifier circuit to the first filter circuit or the second filter circuit, and a first tuning circuit that adjusts impedance matching between the at least one power amplifier circuit and the at least one transmission output terminal.

Exemplary impedance matching circuit for an amplifier device comprises a broadband impedance transformer configured to transform, over a fundamental frequency range, an impedance associated with an input port or an output port of the impedance matching circuit; and to transmit RF signals having a fundamental frequency within the fundamental frequency range. The impedance matching circuit also includes a phase shifter circuit configured to transmit, with substantially matched impedance, the RF signals having a fundamental frequency within the fundamental frequency range, and to phase-shift higher-order harmonics of the RF signals. The impedance matching circuit also includes a high-pass impedance transformer configured to match an impedance of the RF signals having a fundamental frequency within the fundamental frequency range; and to transmit, with low reflection, second-order harmonics of the RF signals. Exemplary embodiments also include amplifier circuits comprising an RF amplifier and embodiments of the impedance matching circuit.

A broadband low noise amplifier (LNA) structure (10) includes a main LNA (12), an offset LNA (14), an input splitter (16), and an output combiner (18). The input splitter (16) is configured to split a radio frequency (RF) input signal into a first RF input signal and a second RF input signal with difference phases, which are fed to the main LNA (12) and the offset LNA (14), respectively. Based on the first RF input signal, the main LNA (12) is configured to provide a first RF output signal, and based on the second RF input signal, the offset LNA (14) is configured to provide a second RF output signal. The output combiner (18) is configured to realign the first RF output signal and the second RF output signal, and configured to combine the first and second RF output signals to provide a combined RF output signal.

An apparatus including an inner conductor and an outer conductor. The inner conductor may comprise a cylindrical portion, a tapered end and a plurality of blades. The blades may be arranged around the cylindrical portion and extend along a length of the cylindrical portion with a predetermined shape. The shape may have a probe at a first end and a second end of the shape may meet the cylindrical portion. The tapered end may have an input/output (I/O) transition. The outer conductor may comprise a cavity, a first connector and a plurality of second connectors. The inner conductor may be within the cavity. The first connector may be connected to the I/O transition. Each of the second connectors may be connected to the probe of one of the blades. The shape of each of the blades may be configured to provide a low-loss transition for a microwave signal.