H03F2200/417

Apparatus and methods for envelope tracking systems with automatic mode selection

Apparatus and methods for envelope tracking systems with automatic mode selection are provided herein. In certain configurations, a power amplifier system includes a power amplifier that amplifies a radio frequency signal and that receives power from a power amplifier supply voltage. The power amplifier system further includes an envelope tracker that generates the power amplifier supply voltage based on an envelope signal corresponding to an envelope of the radio frequency signal. The envelope tracker includes a signal bandwidth detection circuit that processes the envelope signal to generate a detected bandwidth signal, and a mode control circuit that controls a mode of the error amplifier based on the detected signal bandwidth.

APPARATUS AND METHODS FOR ENVELOPE TRACKING SYSTEMS

Apparatus and methods for envelope tracking systems are provided. In certain configurations, an envelope tracking system includes a digital filter that generates a filtered envelope signal based on a digital envelope signal representing an envelope of a radio frequency signal, a buck converter controllable by the filtered envelope signal and including an output electrically connected to a power amplifier supply voltage, a digital-to-analog converter module including an output electrically connected to the output of the buck converter and that provides an output current, and a digital shaping and delay circuit configured to generate a shaped envelope signal based on shaping the filtered envelope signal. The shaped envelope signal controls a magnitude of the output current, and the digital shaping and delay circuit controls a delay of the shaped envelope signal to align the output of the digital-to-analog converter module and the output of the buck converter.

Integrated CMOS transmit/receive switch in a radio frequency device
10103695 · 2018-10-16 · ·

Embodiments of radio frequency (RF) systems include a transmit/receive switch integrated with one or more power amplifiers and/or other components. The power amplifiers can have transformer-based architectures, and a power amplifier and switch can be integrated onto a single complementary metal oxide semiconductor die.

Class D amplifier

A class D amplifier output stage including an input for receiving an input signal, an output for providing an output signal to a load, serially coupled upper and lower switching devices configured to provide an output signal to the output, a driver circuit configured to receive the input signal, and to derive therefrom first and second drive signals for driving the upper and lower switching devices alternately from a conducting state into a non-conducting state and vice versa, such that the conducting state periods of the upper switching device with respect to those of the lower switching device are mutually exclusive and separated by dead time intervals during which both upper and lower output transistors are non-conducting. To reduce distortion and more particularly, total harmonic distortion (THD), the amplifier output stage includes a substantially linear circuit configured to provide a bidirectional current sink for residual currents from the load occurring during at least part of each dead time interval.

PHOTOELECTRIC CONVERSION DEVICE
20180241357 · 2018-08-23 ·

A photoelectric conversion device is provided. The device comprises a light receiving element, first and second transimpedance amplifiers configured to receive a signal of the light receiving element and output a voltage, a differential operation amplifier configured to perform a differential amplification for outputs of the first and second transimpedance amplifiers and a switching unit. The switching unit includes an output switching unit configured to switch connections between a first state where the light receiving element and the first transimpedance amplifier are connected and a second state where the light receiving element and the second transimpedance amplifier are connected, and a capacitance adjusting unit connected to an input terminal of each of the first and second transimpedance amplifiers and configured to adjust a capacitance value of the first and transimpedance amplifier and/or a capacitance value of the second transimpedance amplifier.

Tracker module, power amplifier module, radio frequency module, and communication device

A tracker module is provided that includes a second substrate that is separate from a first substrate, a tracker component, and a low pass filter. A power amplifier is disposed on or in the first substrate. Moreover, the tracker component supplies a power supply voltage to the power amplifier. The low pass filter is disposed on a path between an output terminal of the tracker component and the power amplifier. The tracker component and the low pass filter are disposed on or in the second substrate.

SEMICONDUCTOR INTEGRATED CIRCUIT, SENSOR READER, AND SENSOR READOUT METHOD

In a sensor reader, an IC chip has a function for amplifying and outputting a sensor signal from each sensor element included in a sensor array, and includes a plurality of channel amplifiers connected each of the sensor elements. When an output switch is closed and the IC chip is in the outputting state, channel switches operate sequentially, and sensor amplification signals are output sequentially from the channel amplifiers. When the output switch is open and the IC chip is in the non-outputting state, a bias current of an operational amplifier of the channel amplifier is decreased, the IC chip is set to a low power consumption state, and gain of the operational amplifier is decreased.

DYNAMIC AMPLIFIER AND CHIP USING THE SAME
20180183394 · 2018-06-28 ·

A dynamic amplifier with a bypass design. An input pair of transistors receives a pair of differential inputs Vip and Vin and further provides first, second and third terminals. A load circuit provides a pair of differential outputs Vop and Von with the load circuit connected at a common mode terminal. In an amplification phase, a driver for amplification is coupled to the first terminal and the load circuit is coupled to the second and third terminals. A bypassing circuit is specifically provided. The bypassing circuit is coupled to the second and third terminals during a bypass period within the amplification phase.

PROCESS OF USING A SUBMERGED COMBUSTION MELTER TO PRODUCE HOLLOW GLASS FIBER OR SOLID GLASS FIBER HAVING ENTRAINED BUBBLES, AND BURNERS AND SYSTEMS TO MAKE SUCH FIBERS
20180170792 · 2018-06-21 ·

Processes and systems for producing glass fibers having regions devoid of glass using submerged combustion melters, including feeding a vitrifiable feed material into a feed inlet of a melting zone of a melter vessel, and heating the vitrifiable material with at least one burner directing combustion products of an oxidant and a first fuel into the melting zone under a level of the molten material in the zone. One or more of the burners is configured to impart heat and turbulence to the molten material, producing a turbulent molten material comprising a plurality of bubbles suspended in the molten material, the bubbles comprising at least some of the combustion products, and optionally other gas species introduced by the burners. The molten material and bubbles are drawn through a bushing fluidly connected to a forehearth to produce a glass fiber comprising a plurality of interior regions substantially devoid of glass.

LNA with Programmable Linearity
20180175807 · 2018-06-21 ·

A receiver front end capable of receiving and processing intraband non-contiguous carrier aggregate (CA) signals using multiple low noise amplifiers (LNAs) is disclosed herein. A cascode having a common source input stage and a common gate output stage can be turned on or off using the gate of the output stage. A first switch is provided that allows a connection to be either established or broken between the source terminal of the input stage of each cascode. Further switches used for switching degeneration inductors, gate/sources caps and gate to ground caps for each legs can be used to further improve the matching performance of the invention.