An on-chip transformer circuit is disclosed. The on-chip transformer circuit comprises a primary winding circuit comprising at least one turn of a primary conductive winding arranged as a first N-sided polygon in a first dielectric layer of a substrate; and a secondary winding circuit comprising at least one turn of a secondary conductive winding arranged as a second N-sided polygon in a second, different, dielectric layer of the substrate. In some embodiments, the primary winding circuit and the secondary winding circuit are arranged to overlap one another at predetermined locations along the primary conductive winding and the secondary conductive winding, wherein the predetermined locations comprise a number of locations less than all locations along the primary conductive winding and the secondary conductive winding.

A power amplifier may comprise: an element for amplifying an electrical signal received through an input terminal, and outputting the amplified electrical signal through an output terminal; a first impedance adjustment circuit connected to the input terminal of the element and adjusting impedance with respect to a frequency of a fundamental component at the input terminal; a second impedance adjustment circuit connected to the input terminal of the element and adjusting impedance with respect to a frequency of a multiplied harmonic component at the input terminal; a third impedance adjustment circuit connected to the output terminal of the element and adjusting impedance with respect to the frequency of the fundamental component at the output terminal; a fourth impedance adjustment circuit connected to the output terminal of the element and adjusting impedance with respect to the frequency of the multiplied harmonic component at the output terminal; a first frequency separation circuit which prevents an impedance change by the first impedance adjustment circuit with respect to the frequency of the multiplied harmonic component at the input terminal, and prevents an impedance change by the second impedance adjustment circuit with respect to the frequency of the fundamental component at the input terminal; and a second frequency separation circuit which prevents an impedance change by the third impedance adjustment circuit with respect to the frequency of the multiplied harmonic component at the output terminal, and prevents an impedance change by the fourth impedance adjustment circuit with respect to the frequency of the fundamental component at the output terminal.

Included is a compensation circuit having one end connected to another end of a first output circuit and another end of a second output circuit and another end grounded, the compensation circuit having an electrical length of 90 degrees at a first operation frequency and an electrical length of 45 degrees at a second operation frequency which is half of the first operation frequency.

An example embodiment relates to a radiofrequency (RF) power amplifier pallet, and further relates to an electronic device that includes such a pallet. The RF power amplifier pallet may include a coupled line coupler that includes a first line segment and a second line segment that is electromagnetically coupled to the first line segment. A first end of the first line segment may be electrically connected to an output of an RF amplifying unit. The RF power amplifier pallet may further include a dielectric filled waveguide having an end section of the first dielectric substrate, an end section of the second dielectric substrate, and a plurality of metal wall segments covering the end sections of the first and second dielectric layers. The plurality of metal wall segments may be arranged spaced apart from the first line segment and electrically connected to a first end of the second line segment.

A bandpass parametric amplifier circuit includes a plurality of unit cells. At least one unit cell includes a first inductor having a first node coupled to a center conductor and a second node coupled to ground. There is a first capacitor having a first node coupled to the center conductor and a second node coupled to ground. There is a second inductor having a first node coupled to the center conductor. A second capacitor has a first node coupled to a second node of the second inductor. The second capacitor and the second inductor are in series with the center conductor.

A Doherty power amplifier having a main power amplification device and an auxiliary power amplification device arranged in parallel with the main power amplification device includes a load modulation circuit having a harmonic injection circuit connected with respective outputs of the main power amplification device and the auxiliary power amplification device. The harmonic injection circuit is arranged to provide a phase shift to simultaneously modulate transfer of second harmonic components generated at the main power amplification device to the auxiliary power amplification device and transfer of second harmonic components generated at the auxiliary power amplification device to the main power amplification device, when the main power amplification device and the auxiliary power amplification device are operated at saturation.

An amplifier includes a transistor, an input circuit coupled between an amplifier input and a transistor input terminal, and an output circuit coupled between a transistor output and a transistor output terminal. The input circuit includes an input-side harmonic termination circuit with a first inductor and a first capacitance in series between the transistor input terminal and ground. The output circuit includes a second inductor, an output-side harmonic termination circuit, and a shunt-L circuit. The second inductor is coupled between the transistor output terminal and the amplifier output. The output-side harmonic termination circuit includes a third inductor and a second capacitance in series between the amplifier output and ground. The shunt-L circuit includes a fourth inductor and a third capacitance connected in series between the amplifier output and ground. The input-side and output-side harmonic termination circuits resonate at a harmonic frequency of a fundamental frequency of operation of the amplifier.

Low-load-modulation, broadband power amplifiers and method of use are described. The amplifiers can include multiple amplifiers connected in parallel to amplify a signal that has been divided into parallel circuit branches. One of the amplifiers can operate as a main amplifier in a first amplification class and the remaining amplifiers can operate as peaking amplifiers in a second amplification class. The main amplifier can see low modulation of its load between the fully-on and fully backed-off states of the amplifier. With lower load modulation, the power amplifiers described herein exhibit better power-handling capability and RF fractional bandwidth as compared to conventional amplifiers.

Embodiments of a method and a device are disclosed. In an embodiment, a Doherty amplifier module includes a substrate including a mounting surface, and further includes a first amplifier die, a second amplifier die, and a third amplifier die on the mounting surface. The first amplifier die is configured to amplify a first radio frequency (RF) signal along a first signal path, the second amplifier die is configured to amplify a second RF signal along a second signal path, and the third amplifier die is configured to amplify a third RF signal along a third signal path. A side of the first amplifier die including a first output terminal faces a side of the second amplifier die including a second output terminal. The second signal path is parallel to the first signal path, and the third signal path is orthogonal to the first and second signal paths.

A communication device includes a power amplifier that generates power signals according to one or more operating bands of communication data, with the amplitude being driven and generated in output stages of the power amplifier. The final stage can include an output passive network that suppresses suppress an amplitude modulation-to-phase modulation (AM-PM) distortion. During a back-off power mode a bias of a capacitive unit of the output power network component can be adjusted to minimize an overall capacitance variation. A output passive network can further generate a flat-phase response between dual resonances of operation.