A power amplifier circuit amplifies a radio-frequency signal in a transmit frequency band. The power amplifier circuit includes an amplifier, a bias circuit, and an impedance circuit. The amplifier amplifies power of a radio-frequency signal and outputs an amplified signal. The impedance circuit is connected between a signal input terminal of the amplifier and a bias-current output terminal of the bias circuit and has frequency characteristics in which attenuation is obtained in the transmit frequency band. The impedance circuit includes first and second impedance circuits. The first impedance circuit is connected to the signal input terminal. The second impedance circuit is connected between the first impedance circuit and the bias-current output terminal.

A semiconductor integrated circuit device includes a first terminal arranged to accept an external input of an analog input signal, an amplifier configured to amplify the analog input signal to generate an amplified signal, a logic unit configured to generate a digital output signal that is in accordance with the amplified signal, and a second terminal arranged to externally output an analog output signal that is in accordance with the amplified signal. The first terminal is disposed at a first side of a package, and the second terminal is disposed at a second side which is different from the first side.

Processes and systems for producing glass fibers having regions devoid of glass using submerged combustion melters, including feeding a vitrifiable feed material into a feed inlet of a melting zone of a melter vessel, and heating the vitrifiable material with at least one burner directing combustion products of an oxidant and a first fuel into the melting zone under a level of the molten material in the zone. One or more of the burners is configured to impart heat and turbulence to the molten material, producing a turbulent molten material comprising a plurality of bubbles suspended in the molten material, the bubbles comprising at least some of the combustion products, and optionally other gas species introduced by the burners. The molten material and bubbles are drawn through a bushing fluidly connected to a forehearth to produce a glass fiber comprising a plurality of interior regions substantially devoid of glass.

A linear amplifier of an envelope tracking supply modulator includes a pre-driver stage circuit and an output stage circuit. The pre-driver stage circuit receives an envelope input, and generates a pre-driver output according to the envelope input. The output stage circuit receives the pre-driver output, and generates an amplifier output according to the pre-driver output. The amplifier output is involved in setting a modulated supply voltage of a power amplifier. The output stage circuit has a plurality of amplifiers, including a first amplifier and a second amplifier. When the power amplifier has a first output power level, the first amplifier is involved in setting the amplifier output, and the second amplifier is not involved in setting the amplifier output. When the power amplifier has a second output power level different from the first output power level, the first amplifier and the second amplifier are involved in setting the amplifier output.

An amplifier circuit includes an input terminal used to receive an input signal, an output terminal used to output an output signal, an amplification unit, and a phase adjustment unit. The amplification unit includes an input terminal coupled to the input terminal of the amplifier circuit, an output terminal coupled to the output terminal of the amplifier circuit, a first terminal coupled to a first voltage terminal, and a second terminal coupled to a second voltage terminal. The phase adjustment unit is coupled to the amplification unit. When the amplifier circuit is operated in a first mode, the output signal has a first phase, and when the amplifier circuit is operated in a second mode, the output signal has a second phase. A difference between the first phase and the second phase is within a predetermined range.

A device that includes a substrate and a power amplifier coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects, and a capacitor configured to operate as an output match element, where the capacitor is defined by a plurality of capacitor interconnects. The power amplifier is coupled to the capacitor. The capacitor is configured to operate as an output match element for the power amplifier. The substrate includes an inductor coupled to the capacitor, where the inductor is defined by at least one inductor interconnect. The capacitor and the inductor are configured to operate as a resonant trap or an output match element.

A transistor stack can include a combination of floating and body tied devices. Improved performance of the RF amplifier can be obtained by using a single body tied device as the input transistor of the stack, or as the output transistor of the stack, while other transistors of the stack are floating transistors. Transient response of the RF amplifier can be improved by using all body tied devices in the stack.

An amplifying circuit includes a first reconfigurable amplifier configured to selectively operate in a cascode mode or a non-cascode mode, wherein an input of the first reconfigurable amplifier is coupled to a first input of the amplifying circuit, and an output of the first reconfigurable amplifier is coupled to an output of the amplifying circuit. The amplifying circuit also includes a second reconfigurable amplifier configured to selectively operate in the cascode mode or the non-cascode mode, wherein an input of the second reconfigurable amplifier is coupled to a second input of the amplifying circuit, and an output of the second reconfigurable amplifier is coupled to the output of the amplifying circuit.

One aspect of this disclosure is a power amplifier module that includes a power amplifier, a semiconductor resistor, a tantalum nitride terminated through wafer via, and a conductive layer electrically connected to the power amplifier. The semiconductor resistor can include a resistive layer that includes a same material as a layer of a bipolar transistor of the power amplifier. A portion of the conductive layer can be in the tantalum nitride terminated through wafer via. The conductive layer and the power amplifier can be on opposing sides of a semiconductor substrate. Other embodiments of the module are provided along with related methods and components thereof.

Reducing a sensitivity of an electromechanical sensor is presented herein. The electromechanical sensor comprises a sensitivity with respect to a variation of a mechanical-to-electrical gain of a sense element of the electromechanical sensor; and a voltage-to-voltage converter component that minimizes the sensitivity by coupling, via a defined feedback capacitance, a positive feedback voltage to a sense electrode of the sense element—the sense element electrically coupled to an input of the voltage-to-voltage converter component. In one example, the voltage-to-voltage converter component minimizes the sensitivity by maintaining, via the defined feedback capacitance, a constant charge at the sense electrode. In another example, the electromechanical sensor comprises a capacitive sense element comprising a first node comprising the sense electrode. Further, a bias voltage component can apply a bias voltage to a second node of the electromechanical sensor. In yet another example, the electromechanical sensor comprises a piezoelectric sense element.