Patent classifications
H03F2200/48
Cascode amplifier bias circuits
Bias circuits and methods for silicon-based amplifier architectures that are tolerant of supply and bias voltage variations, bias current variations, and transistor stack height, and compensate for poor output resistance characteristics. Embodiments include power amplifiers and low-noise amplifiers that utilize a cascode reference circuit to bias the final stages of a cascode amplifier under the control of a closed loop bias control circuit. The closed loop bias control circuit ensures that the current in the cascode reference circuit is approximately equal to a selected multiple of a known current value by adjusting the gate bias voltage to the final stage of the cascode amplifier. The final current through the cascode amplifier is a multiple of the current in the cascode reference circuit, based on a device scaling factor representing the relative sizes of the transistor devices in the cascode amplifier and in the cascode reference circuit.
Wideband low noise amplifier (LNA) with a reconfigurable bandwidth for millimeter-wave 5G communication
According to one embodiment, a low noise amplifier (LNA) circuit includes a first stage which includes: a first transistor; a second transistor coupled to the first transistor; a first inductor coupled in between an input port and a gate of the first transistor; and a second inductor coupled to a source of the first transistor, where the first inductor and the second inductor resonates with a gate capacitance of the first transistor for a dual-resonance. The LNA circuit includes a second stage including a third transistor; a fourth transistor coupled between the third transistor and an output port; and a passive network coupled to a gate of the third transistor. The LNA circuit includes a capacitor coupled in between the first and the second stages, where the capacitor transforms an impedance of the passive network to an optimal load for the first amplifier stage.
High efficiency switching power amplifier
A power amplifier and method for operating the same is disclosed. The amplifier includes a number of transistors coupled in series between a power node and a ground node. These transistors include a first transistor having a source terminal coupled to the power node, and a second transistor having its source terminal coupled to a ground node. A subset of transistors is also coupled in series between the first and second transistors. During operation in a first mode, the first and second transistors act as switching transistors, switching according to data received thereby. The subset of transistors, during the first mode, act as cascode transistors. During a second mode of operation, the transistors of the subset act as switching transistors, switching in accordance with the received data.
LINEARITY ENHANCEMENT OF HIGH POWER AMPLIFIERS
A radio frequency (RF) amplifier circuit includes a field effect transistor (FET) (e.g., a FET belonging to a III-V FET enhancement group), where the FET includes a gate terminal coupled to an RF input node. The circuit further includes a prematch and biasing network coupled between a bias voltage node and the RF input node. The prematch and biasing network includes a nonlinear gate current blocking device configured to block a current from flowing between the bias voltage node and the RF input node.
High Efficiency Switching Power Amplifier
A power amplifier and method for operating the same is disclosed. The amplifier includes a number of transistors coupled in series between a power node and a ground node. These transistors include a first transistor having a source terminal coupled to the power node, and a second transistor having its source terminal coupled to a ground node. A subset of transistors is also coupled in series between the first and second transistors. During operation in a first mode, the first and second transistors act as switching transistors, switching according to data received thereby. The subset of transistors, during the first mode, act as cascode transistors. During a second mode of operation, the transistors of the subset act as switching transistors, switching in accordance with the received data.
Differential amplifier schemes for sensing memory cells
Methods, systems, and devices for differential amplifier schemes for sensing memory cells are described. In one example, a memory apparatus may include a differential amplifier having a first input node configured to be coupled with a memory cell and having an output node configured to be coupled with a sense component. In some examples, the memory apparatus may also include a capacitor having a first node coupled with the first input node, and a first switching component configured to selectively couple a second node of the capacitor with the output node. The differential amplifier may configured such that a current at the output node is proportional to a difference between a voltage at the first input node of the differential amplifier and a voltage at the second input node of the differential amplifier.
SELF-BIASING AND SELF-SEQUENCING OF DEPLETION-MODE TRANSISTORS
A transistor circuit includes a transistor having a gate terminal and first and second conduction terminals, a first circuit configured to convert an AC input signal of the transistor circuit to a gate bias voltage and to apply the gate bias voltage to the gate terminal of the transistor, a second circuit configured to convert the AC input signal of the transistor circuit to a control voltage, and a switching circuit configured to apply a first voltage to the first conduction terminal of the transistor in response to the control voltage.
Complementary variable gain amplification
An apparatus is disclosed for complementary variable gain amplification. In an example aspect, the apparatus includes a variable gain amplifier that includes multiple amplifiers. The multiple amplifiers include at least one first amplifier and at least one second amplifier cascaded together in series. The first amplifier includes a first set of transistors having a first doping type. At least a portion of the first set of transistors is configured to implement a first current mirror. The second amplifier includes a second set of transistors having a second doping type. At least a portion of the second set of transistors is configured to implement a second current mirror. The second current mirror is coupled to the first current mirror.
Source Switched Split LNA
A receiver front end capable of receiving and processing intraband non-contiguous carrier aggregate (CA) signals using multiple low noise amplifiers (LNAs) is disclosed herein. A cascode having a common source configured input FET and a common gate configured output FET can be turned on or off using the gate of the output FET. A first switch is provided that allows a connection to be either established or broken between the source terminal of the input FET of each LNA. Further switches used for switching degeneration inductors, gate capacitors and gate to ground caps for each legs can be used to further improve the matching performance of the invention.
RF amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereof
An amplifier includes a semiconductor substrate. A first conductive feature partially covers the bottom substrate surface to define a conductor-less region of the bottom substrate surface. A first current conducting terminal of a transistor is electrically coupled to the first conductive feature. Second and third conductive features may be coupled to other regions of the bottom substrate surface. A first filter circuit includes an inductor formed over a portion of the top substrate surface that is directly opposite the conductor-less region. The first filter circuit may be electrically coupled between a second current conducting terminal of the transistor and the second conductive feature. A second filter circuit may be electrically coupled between a control terminal of the transistor and the third conductive feature. Conductive leads may be coupled to the second and third conductive features, or the second and third conductive features may be coupled to a printed circuit board.