A LNA comprises an input, a transformer structure and a first transistor and a second transistor, each having gate, source, and drain terminals. The transformer structure has a first winding pair, a second winding pair and a third winding pair. Each winding of the first winding pair connects to the input node and one source terminals of the transistors. The second winding pair is proximate the first winding pair. The second winding pair connects to a ground node and the transistor source terminals. The third winding pair is proximate the first winding pair and it connects to a bias signal source and a gate terminal of the transistors. An output connects to the transistor drain terminals. The windings of the first and second winding pairs are offset and rotated 180 degrees with respect to the other winding in the pair. The third winding pair performs a Gm boost function.

According to certain aspects, a chip includes a pad, a power amplifier, a transformer coupled between an output of the power amplifier and the pad, a transistor coupled between the transformer and a ground, and a first clamp circuit coupled between a gate of the transistor and a drain of the transistor.

Size reduction is enabled. A power amplifying circuit includes a splitter, a first amplifier, a second amplifier, and a third amplifier. The splitter splits an input signal into a first signal and a second signal. The first amplifier has a first input terminal and a first output terminal, amplifies the first signal, and outputs a first amplified signal. The second amplifier has a second input terminal and a second output terminal, amplifies the second signal, and outputs a second amplified signal. The third amplifier has a third input terminal and a third output terminal, amplifies the first signal, and outputs a third amplified signal. The first output terminal and the second output terminal are connected to each other, the third input terminal is connected to the first input terminal, and the third output terminal is connected to the second output terminal.

Disclosed is a bidirectional amplifier. The bidirectional amplifier includes a first matching circuit, a second matching circuit, an amplifier circuit connected between the first matching circuit and the second matching circuit, that amplifies a first input signal received from the first matching circuit to output the amplified first input signal to the second matching circuit, and that amplifies a second input signal received from the second matching circuit to output the amplified first input signal to the first matching circuit, and the first and second matching circuits have a symmetrical structure and operate complementary to each other.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.

To provide a high-frequency circuit and a communication device by which a harmonic component in differential amplification can be attenuated. The high-frequency circuit includes a differential amplifier circuit. The differential amplifier circuit includes a first amplifying element, a second amplifying element, first wiring, second wiring, and a series circuit. The first amplifying element includes a first input terminal and a first output terminal. The second amplifying element includes a second input terminal and a second output terminal. The first wiring is connected to the first output terminal. The second wiring is connected to the second output terminal. The series circuit is connected between the first wiring and the second wiring. The series circuit includes a first inductor, a second inductor, and a capacitor.

A distributed active transformer includes an input transformer set and an output transformer set. Active stages are coupled between a transformer in the input transformer set and a transformer in the output transformer set. The input and output transformer sets are each configured as a slab transformer. The input slab transformer includes a single primary slab and many secondary slabs. The output slab transformer includes many primary slabs and a single secondary slab.

An electronic device may include wireless circuitry with a processor, a transceiver, an antenna, and a front-end module coupled between the transceiver and the antenna. The front-end module may include one or more power amplifiers for amplifying a signal for transmission through the antenna. Radio-frequency power amplifier circuitry may include an amplifier, an input transformer for coupling radio-frequency input signals to the amplifier, an active inductor load coupled to the input transformer, and a second order intermodulation generation circuit configured to generate and inject a second order intermodulation product into the input transformer. The injected second order intermodulation product can be used to cancel out unwanted third order intermodulation products generated by the amplifier, which reduces intermodulation distortion experienced by the amplifier circuitry.

A power amplifier module includes a first substrate and a second substrate, at least part of the second substrate being disposed in a region overlapping the first substrate. The second substrate includes a first amplifier circuit and a second amplifier circuit. The first substrate includes a first transformer including a primary winding having a first end and a second end and a secondary winding having a first end and a second end; a second transformer including a primary winding having a first end and a second end and a secondary winding having a first end and a second end; and multiple first conductors disposed in a row between the first transformer and the second transformer, each of the multiple first conductors extending from the wiring layer on a first main surface to the wiring layer on a second main surface of the substrate.

A high frequency amplifier circuit includes a transistor including a drain, a gate, and a source, an inductance-capacitor (LC) tank connected to the drain, and a transformer connected to the gate and the source.