A Communication System includes a first power supply channel including a first impedance and a second impedance, and configured to transfer electrical power from a first power source to a first load. The first power supply channel is configured to electrically couple to the first power source via a first common mode choke. The communication system also includes a second power supply channel comprising a third impedance and a fourth impedance, and configured to transfer electrical power from a second power source to a second load. The second power supply channel is configured to electrically couple to the second power source via a second common mode choke. The communication system further includes a first transceiver comprising a first output pin electrically coupled to the first power supply channel and a second output pin electrically coupled to the second power supply channel at a first end of the communication system.

A high-frequency amplifier for an active EMI filter with a symmetric class B emitter-follower output stage driven by a driver stage, with a sense output resistor. Both terminals of the sense resistor are brought to the noninverting, respecting inverting input of the driver stage through two dividers of the same ratio, in a global voltage feedback loop. The amplifier is configured to provide a high output impedance at 10 kHz and up to 100 MHz, a peak-to-peak output current of 2-10 ampere and a low quiescent current of less than 400 mA. The invention includes EMI filters with such a high-frequency current source, for example in the current-sense current-inject feedback configuration.

A filter unit according to the present invention includes a substrate, capacitors mounted on the substrate, and two inductors. The inductors each include a wire and a core. The core includes two core bodies. The core bodies each have a ring shape and include a wiring hole. The capacitors are disposed between the two core bodies. An opposed section extends from the respective two core bodies to a position opposed to the capacitors C. The opposed section is opposed to all of the plurality of capacitors.

An EMI/energy dissipating filter for an active implantable medical device (AIMD) comprises a first gold braze sealing an insulator to the ferrule of a glass-to-metal seal (GTMS) and a lead wire that is sealed in a passageway through the insulator by a second gold braze. A circuit board is disposed adjacent to the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization connected to its active electrode plates and a ground end metallization connected to its ground electrode plates. A ground electrical path extends from the ground end metallization of the chip capacitor, through a circuit board ground plate disposed on or within the circuit board, and to the ferrule. An active electrical path extends from the active end metallization of the chip capacitor to the lead wire of the GTMS.

A transient noise reduction filter comprises a cable including one or more twisted pairs of conductors and one or more common mode chokes (CMCs). The one or more CMCs a formed from respective pluralities of turns of the cable. Each of the CMCs may be a magnetic CMC wherein the plurality of turns of the cable are wrapped around a magnetic core, or an air-core CMC wherein the plurality of turns of the cable are not wrapped around a magnetic core but are instead disposed around a non-magnetic material (such as air)

An electromagnetic interference shielding configuration of an electronic device includes a housing, a connecting circuit board, at least one EMI filter, and a shielding component. The housing has an accommodating space and a shielding space. A mainboard is disposed in the accommodating space, and a connecting circuit board is disposed in the shielding space and electrically conducted to the mainboard. The at least one EMI filter is disposed on the connecting circuit board and electrically conducted to the mainboard through the connecting circuit board. The shielding component combines with the housing and covers the EMI filter. Thus the EMI filter will not have electromagnetic interferences with external electronic components and provide a stable operation of the electronic device.

A multilayer electronic component includes: a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body, wherein the body includes a capacitor part comprising at least one among the plurality of internal electrodes and at least one among the coil portions with at least one of the ceramic layers or magnetic layers interposed therebetween.

A multilayer helical wave filter having a primary resonance at a selected RF diagnostic or therapeutic frequency or frequency range, includes an elongated conductor forming at least a portion of an implantable medical lead. The elongated conductor includes a first helically wound segment having at least one planar surface, a first end and a second end, which forms a first inductive component, and a second helically wound segment having at least one planar surface, a first end and a second end, which forms a second inductive element. The first and second helically wound segments are wound in the same longitudinal direction and share a common longitudinal axis. Planar surfaces of the helically wound segments face one another, and a dielectric material is disposed between the facing planar surfaces of the helically wound segments and between adjacent coils of the helically wound segments, thereby forming a capacitance.

The present invention concerns a line filter (1), which is configured to be installed onto a system cable (2), wherein the line filter (1) comprises a magnetic component (4), wherein the line filter (1) defines a cable path (6) through the line filter (1), wherein the line filter (1) is configured to allow a placement of the system cable (2) along the cable path (6) at the time of an installation, thereby providing a magnetic coupling of the system cable (2) to the magnetic component (4), and wherein the line filter (1) comprises an insulation displacement connector (16) and a shunt component (5) wherein the insulation displacement connector (16) is configured to be tightened at the time of the installation, thereby providing a galvanic connection of the system cable (2) to the shunt component (5). Further, the present invention concerns a method of installing a line filter (1) onto a system cable (2).

Provided is a noise filter that can enhance noise removal performance with a simple configuration. A noise filter (10) includes a connector (20) that houses a terminal fitting (22) connected to an input/output wire (WH) in a state in which the input/output wire (WH) is lead out from the connector (20). The noise filter (10) includes a coil (40) that is connected to the input/output wire (WH), a capacitor (30) that is electrically connected to the coil (40), and a magnetic member (50). The noise filter (10) includes a case (60) that houses the capacitor (30), the coil (40), and the magnetic member (50), and a holding member (70) that holds the magnetic member (50) in a state in which the magnetic member (50) is positioned with respect to the coil (40).