Disclosed is a multi-layer electric shock protection EMI filter device and a manufacturing method thereof. The multi-layer electric shock protection EMI filter device is formed by cofiring a laminated ceramic dielectric material layer, and includes: a lower capacitor, an electric shock protection device, and a upper capacitor; wherein the electric shock protection device is disposed between the lower capacitor and the upper capacitor, and isolated from the lower capacitor and the upper capacitor by a ceramic dielectric material layer, and a tripping layer is provided between two wires in the electric shock protection device, and formed by a mix of SiC and glass. After the main body is stacked and a low temperature cofire process is performed, the tripping layer becomes a compound structure of a SiC body and an air gap. Accordingly, an integrated electric shock protection EMI filter device can be manufactured to prevent electromagnetic interference, filter, and electric shock.

Semiconductor chip laminates and inductive, capacitive, and electromagnetic shielding laminate structures that can be integrated together to form electronic circuits for use in systems and devices such as smartphones, tablet computers, notebook computers, wearable electronic devices, portable medical devices, servers, networking equipment, industrial equipment, etc. Fabrications of such integrated laminate structures can be modularized into four (4) types of laminates, namely, inductive laminates, capacitive laminates, electromagnetic shielding laminates, and semiconductor chip laminates, which can be vertically laminated together and/or integrated side-by-side with high density to produce the desired electronic circuits, systems, and devices.

Bride combiners with resonators for radio-frequency applications. A bridge combiner can be implemented as a coupling circuit that includes a common node and configured to couple the common node to a first group of filters through a first path and to couple the common node to a second group of one or more filters through a second path. The coupling circuit can include a resonator such that an impedance provided by each filter of the first group for a signal in each band of the second group results in the signal being sufficiently excluded from the first path, and such that an impedance provided by each filter of the second group for a signal in each band of the first group results in the signal being sufficiently excluded from the second path.

Apparatus and methods for high voltage variable capacitors are provided herein. In certain configurations, an integrated circuit (IC) includes a variable capacitor array and a bias voltage generation circuit that biases the variable capacitor array to control the array's capacitance. The variable capacitor array includes a plurality of variable capacitor cells electrically connected in parallel between a radio frequency (RF) input and an RF output of the IC. Additionally, each of the variable capacitor cells can include a cascade of two or more pairs of anti-series metal oxide semiconductor (MOS) capacitors between the RF input and the RF output. The pairs of anti-series MOS capacitors include a first MOS capacitor and a second MOS capacitor electrically connected in anti-series. The bias voltage generation circuit generates bias voltages for biasing the MOS capacitors of the variable capacitor cells.

A high power, low passive inter-modulation capacitor is presented, which is formed using metal clad substrates, which are broad-side coupled through a thin air gap. Each substrate may include metal layers affixed on both sides which are electrical coupled together to form a single capacitor plate, or each substrate may have only a single metal layer on the surface adjacent to the air gap. The capacitor has particular application in low cost RF and microwave filters, which may be used in communication equipment and communication test equipment such a diplexers, for low PIM applications.

Apparatus and methods for high voltage variable capacitors are provided herein. In certain configurations, an integrated circuit (IC) includes a variable capacitor array and a bias voltage generation circuit that biases the variable capacitor array to control the array's capacitance. The variable capacitor array includes a plurality of variable capacitor cells electrically connected in parallel between a radio frequency (RF) input and an RF output of the IC. Additionally, each of the variable capacitor cells can include a cascade of two or more pairs of anti-series metal oxide semiconductor (MOS) capacitors between the RF input and the RF output. The pairs of anti-series MOS capacitors include a first MOS capacitor and a second MOS capacitor electrically connected in anti-series. The bias voltage generation circuit generates bias voltages for biasing the MOS capacitors of the variable capacitor cells.

A system that incorporates teachings of the present disclosure may include, for example, a first solid electrode, a second electrode separated into subsections, and a dielectric medium separating the subsections from the first solid electrode, where the subsections of the second electrode include a first group of subsections and a second group of subsections, where the first group of subsections are connectable with a first terminal for receiving an input signal, and where the second group of subsections is connectable with a second terminal for providing an output signal. Other embodiments are disclosed.

A noise filter includes: a ground-side power supply line detecting circuit that is connected to each of a power supply line and a power supply line and detects a power supply line connected to an electrode from among the power supply line and the power supply line; and a control circuit that determines whether the power supply line connected to the electrode is the power supply line or the power supply line on the basis of a detection result by the ground-side power supply line detecting circuit, controls a relay to short-circuit between a Y capacitor and an electrical device ground when determining that the power supply line connected to the electrode is the power supply line, and controls a relay to short-circuit between a Y capacitor and the electrical device ground when determining that the power supply line connected to the electrode is the power supply line.

A radio-frequency architecture can include a first circuit configured to support a first frequency range, and a second circuit configured to support a second frequency range. The first circuit can be further configured to provide an impedance at or near a short circuit impedance for a signal in the second frequency range, the second circuit can be further configured to provide an impedance at or near a short circuit impedance for a signal in the first frequency range. The architecture can further include a coupling circuit having a common node and configured to couple the common node to the first circuit and to couple the common node to the second circuit. The coupling circuit can include a resonator such that the signal in the second frequency range is sufficiently excluded from the first circuit, and the signal in the first frequency range is sufficiently excluded from the second circuit.

In some embodiments, an architecture can include a first group of filters each configured to support a band such that a first frequency range covers the respective bands, and a second group of one or more filters each configured to support a band such that a second frequency range covers the respective one or more bands. Each filter of the first group can be configured to provide an impedance at or near a short circuit impedance for a signal in each band of the second group, and each filter of the second group can be configured to provide an impedance at or near a short circuit impedance for a signal in each band of the first group. The filters of the first and second groups can be implemented as one or more multiplexers. The architecture can further include a coupling circuit having a common node and configured to couple the common node to the one or more multiplexers through a first path and a second path. The coupling circuit can be further configured such that the impedance provided by each filter of the first group for the signal in each band of the second group results in the signal being sufficiently excluded from the first path, and such that the impedance provided by each filter of the second group for the signal in each band of the first group results in the signal being sufficiently excluded from the second path.