A package includes a redistribution portion, a first portion, and a second portion. The first portion is coupled to the redistribution portion. The first portion includes a first switch comprising a plurality of switch interconnects, and a first encapsulation layer that at least partially encapsulates the first switch. The second portion is coupled to the first portion. The second portion includes a first plurality of filters. Each filter includes a plurality of filter interconnects. The second portion also includes a second encapsulation layer that at least partially encapsulates the first plurality of filters. The first portion includes a second switch positioned next to the first switch, where the first encapsulation layer at least partially encapsulates the second switch. The second portion includes a second plurality of filters positioned next to the first plurality of filters, where the second encapsulation layer at least partially encapsulates the second plurality of filters.

A high frequency circuit includes a first demultiplexing circuit including a first high pass filter and a low pass filter and a second demultiplexing circuit including a band elimination filter and a band pass filter, the second demultiplexing circuit being connected in series with the first demultiplexing circuit. At least one of the band elimination filter and the band pass filter includes an elastic wave resonator. An attenuation band of the band elimination filter and a pass band of the band pass filter is located between a pass band of the first high pass filter and a pass band of the low pass filter.

A filter radio frequency module packaging structure and a method for manufacturing same is disclosed. A first filter chip of the filter radio frequency module packaging structure comprises a chip main body and a wall structure. The wall structure, the functional surface, and a substrate together define a closed cavity, or the wall structure and the functional surface together define a closed cavity. An encapsulation material wraps the first filter chip.

A packaged module for use in a wireless communication device has a substrate supporting a crystal assembly and a first die that implements at least a portion of a radio frequency baseband subsystem. The crystal assembly, positioned between the first die and the substrate, includes a crystal, an input terminal configured to receive a first signal, an output terminal configured to output a second signal, a conductive pillar, and an enclosure configured to enclose the crystal, where the conductive pillar is formed at least partially within a side of the enclosure and extends from a top surface to a bottom surface of the enclosure. The conductive pillar conducts a third signal distinct from the first and second signals.

A filter arrangement for filtering parasitic induction currents may include an electrically conductive housing part that at least partly surrounds a cavity, an electric ground connection on the housing part for establishing an electric connection to an electric ground, a busbar in the cavity, and at least one electric filter component electrically connected between the busbar and the housing part and mechanically secured to the housing part and to the busbar. A voltage converter may include at least one such filter arrangement.

A composite electronic component includes a substrate with a first main surface and a side end surface, a first electronic component including external electrodes and mounted on the first main surface of the substrate, a second electronic component including external electrodes and being different in electrical function from the first electronic component mounted on the first main surface of the substrate, and a conductive pattern on the first main surface of the substrate, electrically connecting the first electronic component and the second electronic component to each other, and including one end reaching a side of one side end of the substrate, one external electrode of the first electronic component and one external electrode of the second electronic component being located on the side of the one side end of the substrate, another external electrode of the first electronic component and another external electrode of the second electronic component being connected to the conductive pattern, and the composite electronic component being mounted such that a surface of the substrate on the side of the one side end is opposed to a first main surface of a mount substrate.

The disclosure provides a quadrature hybrid. The quadrature hybrid has a first, second, third and fourth ports. The quadrature hybrid comprises: a substrate having a plurality of dielectric layers; a first, second and third capacitors, each capacitor having a first predetermined number of layers each being arranged on one of the plurality of dielectric layers; and a first, second, third and fourth inductors, each inductor having a second predetermined number of layers each being arranged on one of the plurality of dielectric layers.

A capacitor element includes a plurality of flexible base material layers that are stacked upon each other, and conductor patterns that are provided on the flexible base material layers and that define a capacitor. The capacitor element also includes a flexible portion, and a rigid portion having a larger number of stacked flexible base material layers than the flexible portion. Conductor pattern pairs that define the capacitor are provided in both the flexible portion and the rigid portion. The conductor pattern pair that is provided in the rigid portion is connected in series with the conductor pattern pair that is provided in the flexible portion. The conductor pattern pair that is provided in the rigid portion has a larger number of tiers than the conductor pattern pair that is provided in the flexible portion.

A resonance circuit complex electronic component includes a first circuit element and a second circuit element defining a resonance circuit, an external connection terminal connected to outside, and a plurality of routing conductors connecting an external terminal of the first circuit element and an external terminal of the second circuit element to the external connection terminal, respectively. At least one of the plurality of routing conductors includes an inductor conductor extending in a direction not in parallel with a mounting surface.

A flat cable high-frequency filter includes a dielectric substrate extending in a transmission direction of a high-frequency signal. The dielectric substrate includes dielectric layers stacked on each other. Elongated conductor patterns are provided on a flat surface of one dielectric layer which faces another dielectric layer. The conductor patterns are as wide as possible in the dielectric substrate in accordance with a desired inductance. A capacitive coupling conductor pattern opposes one conductor pattern by a predetermined area with a dielectric layer therebetween. By using a connecting conductor, the capacitive coupling conductor pattern is connected to the conductor pattern which does not oppose the capacitive coupling conductor pattern.