The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.

An integrated common mode and differential mode inductor can include a first core including a first center leg, a second core including a second center leg, a first center winding on the first center leg, and a second center winding on the second center leg. The first center leg can be spaced apart from the second center leg, for example by a center air gap. The integrated common mode and differential mode inductor can further include a left winding on a first left leg of the first core and a second left leg of the second core, as well as a right winding on a first right leg of the first core and a second right leg of the second core.

Disclosed are a DC terminal multi-stage filter structure, a motor controller and a vehicle. The DC terminal multi-stage filter structure is fixed on a controller enclosure. A head end of a DC terminal is provided with a high voltage bus and a tail end of the DC terminal is provided with a film capacitor. The DC terminal multi-stage filter structure includes a primary filter holder assembly and a secondary filter holder assembly. The primary filter holder assembly and the secondary filter holder assembly are provided inside the controller enclosure in a line along a length direction of the controller enclosure.

An electronic device includes an electromagnetic interference shield having a layer of conductive material covering at least a portion of the electronic device and having a skin depth of less than 2 μm for electromagnetic signals having frequencies in a kilohertz range.

A feedthrough for an AIMD is described. The feedthrough includes an electrically conductive ferrule having a ferrule sidewall defining a ferrule opening. The ferrule sidewall has a height. At least one recessed pocket has a depth extending part-way through the height of the ferrule. An oxide-resistant pocket-pad is nested in the recessed pocket. An electrical connection material is supported on the pocket-pad for making an oxide-resistant electrical connection to the ferrule. An insulator is hermetically sealed to the ferrule in the ferrule opening. At least one active via hole extends through the insulator with an active conductive pathway residing in and hermetically sealed to the insulator in the active via hole.

The present disclosure relates to a broadband filter for confining or attenuating electromagnetic interference noise from one or more electrical signal sources, In an embodiment, the broadband filter comprises one or more filter stages electrically coupled by galvanic or by electromagnetic means to the one or more electrical signal sources for confining or attenuating conducted electromagnetic interference noise; one or more conductive shields electrically coupled by galvanic or by electromagnetic means to the electrical signal sources wherein the shields encapsulate the filter stages for confining or attenuating conducted and/or radiated electromagnetic interference noise; and one or more conductive partition layers to encapsulate the one or more filter stages such that the partition layers electromagnetically couple adjacent filter stages for a selected frequency range of the electromagnetic interference noise. The thickness of the conductive partition layers is chosen to control the degree of coupling.

Disclosed is a device and methods for making same. In one aspect, a device includes a package having at least four pins, and, within the package, a die that includes a filter circuit electrically coupled to the four pins. The filter can: receive, from a first pin, an input signal comprising first and second frequency components, produce, at a second pin, a first output signal of the first frequency component, and produce, at a third and fourth pin, a second output signal of the second frequency component; and/or receive, from a second pin, a first input signal comprising the first frequency component, receive, from a third or fourth pin, a second input signal comprising the second frequency component, and produce, at a first pin, an output signal comprising the first and second frequency components. The second pin is interposed between the third and fourth pins on the package.

The present disclosure is generally directed to utilizing capacitors stacks with capacitors mounted in a terminal-to-terminal mounting orientation to reduce overall footprint of capacitor arrays for bypass filtering circuits. In an embodiment, each capacitor stack includes at least a first capacitor, a second capacitor, and a ground plane interconnect. The first capacitor includes first and second terminals disposed opposite each other. The first terminal provides a mating surface to couple to the second capacitor, the second terminal couples to a ground plane. The second capacitor includes first and second terminals disposed opposite each other. The first terminal provides a mounting surface to electrically couple to and support the first capacitor, and the second terminal provides a mating surface to electrically and physically couple to the ground plane. Accordingly, the first capacitor can be inverted and mounted atop the second capacitor to eliminate the necessity of wire bonds, for example.

A common mode filter is disposed on a circuit board. A signal layer of the circuit board has a differential signal wire pair. The common mode filter has a slot structure and a filtering frequency adjusting device. The slot structure is formed on a reference voltage layer of the circuit board, wherein the slot structure surrounds the differential signal wire pair. The filtering frequency adjusting device is disposed on a corner part of the slot structure, wherein the filtering frequency adjusting device includes at least one of at least one capacitor and at least one inductor, and is disposed on the circuit board across the differential signal wire pair.

A common mode filter is disposed on a circuit board. A signal layer of the circuit board has a differential signal wire pair. The common mode filter has a slot structure and a filtering frequency adjusting device. The slot structure is formed on a reference voltage layer of the circuit board, wherein the slot structure surrounds the differential signal wire pair. The filtering frequency adjusting device is disposed on a corner part of the slot structure, wherein the filtering frequency adjusting device includes at least one of at least one capacitor and at least one inductor, and is disposed on the circuit board across the differential signal wire pair.