A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.

A first conductive pattern made from a conductive material is formed on a first surface that is one surface of a flexible film made from a dielectric material. An adhesive layer is disposed on a second surface opposite to the first surface of the flexible film. A pair of first outer electrodes generates an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and causes an electric current to flow through the first conductive pattern.

Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.

The present disclosure relates to a broadband filter for confining or attenuating electromagnetic interference noise from one or more electrical signal sources, In an embodiment, the broadband filter comprises one or more filter stages electrically coupled by galvanic or by electromagnetic means to the one or more electrical signal sources for confining or attenuating conducted electromagnetic interference noise; one or more conductive shields electrically coupled by galvanic or by electromagnetic means to the electrical signal sources wherein the shields encapsulate the filter stages for confining or attenuating conducted and/or radiated electromagnetic interference noise; and one or more conductive partition layers to encapsulate the one or more filter stages such that the partition layers electromagnetically couple adjacent filter stages for a selected frequency range of the electromagnetic interference noise. The thickness of the conductive partition layers is chosen to control the degree of coupling.

A self-tuning impedance-matching microelectromechanical (MEMS) circuit, methods for making and using the same, and circuits including the same are disclosed. The MEMS circuit includes a tunable reactance element connected to a first mechanical spring, a separate tunable or fixed reactance element, and an AC signal source configured to provide an AC signal to the tunable reactance element(s). The reactance elements comprise a capacitor and an inductor. The AC signal source creates an electromagnetically energy favorable state for the tunable reactance element(s) at resonance with the AC signal. The method of making generally includes forming a first MEMS structure and a second mechanical or MEMS structure in/on a mechanical layer above an insulating substrate, and coating the first and second structures with a conductor to form a first tunable reactance element and a second tunable or fixed reactance element, as in the MEMS circuit.

A filter with three phases comprising for each phase an input terminal, an output terminal and a capacitor, wherein for each of the three phases the input terminal is electrically connected via a connection point to the output terminal, wherein the connection points of the three phases are electrically connected via the three capacitors in star and/or delta form, wherein the filter comprises a housing containing two coil blocks, wherein the housing comprises a first side and a second side opposite the first side, wherein the two coil blocks are arranged along a line between the first side and the second side, wherein a fan for cooling the two coil blocks is arranged on the first side of the housing, wherein the larger of the two coil blocks is arranged between the fan and the smaller of the two coil blocks.

A packaged module for use in a wireless communication device has a substrate supporting a crystal assembly and a first die that implements at least a portion of a radio frequency baseband subsystem. The crystal assembly, positioned between the first die and the substrate, includes a crystal, an input terminal configured to receive a first signal, an output terminal configured to output a second signal, a conductive pillar, and an enclosure configured to enclose the crystal, where the conductive pillar is formed at least partially within a side of the enclosure and extends from a top surface to a bottom surface of the enclosure. The conductive pillar conducts a third signal distinct from the first and second signals.

A band-pass filter includes a main body formed of a dielectric, a plurality of resonators, a shield, and a partition formed of a conductor. Each of the plurality of resonators includes a resonator conductor portion. The resonator conductor portion has a first end and a second end opposite to each other in the longitudinal direction. The first end is connected to a ground, and the second end is open. The partition extends to pass through between the respective resonator conductor portions of two resonators, and is electrically connected to the shield.

A filter feedthrough for an AIMD includes an electrically conductive ferrule. An insulator hermetically seals a ferrule opening with either a first gold braze, a ceramic seal, a glass seal or a glass-ceramic seal. At least one conductive pathway is hermetically sealed to and disposed through the insulator body in non-conductive relationship with the ferrule. A feedthrough capacitor includes at least one active and ground electrode plate disposed within a capacitor dielectric and electrically connected to a capacitor active metallization and a capacitor ground metallization, respectively. At least a first edge of the feedthrough capacitor extends beyond a first outermost edge of the ferrule. At least a second edge of the feedthrough capacitor does not extend beyond a second outermost edge of the ferrule, or said differently, the second edge is either aligned with or setback from the second outermost edge of the ferrule.

Wireless communication circuitry is disclosed. The wireless communication circuitry includes an antenna terminal and an electrically conductive path between a first port terminal and the antenna terminal through a second port terminal. Also included is a bulk acoustic wave filter configured to filter and pass a desired radio frequency signal between the first port terminal and the second port terminal. Further included is a first magnetic coupling component that is electrically connected to the electrically conductive path and a resonant circuit made up of a capacitor and a second magnetic coupling component that is magnetically coupled to the first magnetic coupling component. The resonant circuit is tuned to suppress an undesired desired radio frequency signal that in some embodiments is the second harmonic of the desired radio frequency signal.