A common mode filter includes a substrate; an insulating layer disposed on the substrate and including coil patterns, the insulating layer having a cavity disposed in a central portion therein; and a magnetic particle-resin composite layer including a core part filling the cavity and a cover part covering the insulating layer. The core part contains fine magnetic particles having an average particle diameter of 30 m or less, and the cover part contains the fine magnetic particles having the average particle diameter of 30 m or less and coarse magnetic particles having an average particle diameter greater than that of the fine magnetic particles.

A common mode filter includes a first filter and a second filter formed by a magnetic coupling between primary coils and secondary coils, respectively, and connected in series. In the common mode filter, a resonance frequency f1 of the first filter and a resonance frequency f2 of the second filter are different from each other.

A coil component includes a body including coil patterns and a plurality of trenches; and external electrodes electrically connected to the coil patterns. The plurality of trenches include a magnetic material, and at least one edge of a trench disposed outside of an outermost coil pattern among the coil patterns has a same shape as an outside boundary portion of the outermost coil pattern adjacent thereto.

An electronic component includes: a body containing a ceramic material; and an indication part formed on a surface of the body and including a base region and a marking region formed of a non-conductive paste on a portion of the base region.

The technology described in this document can be embodied in an apparatus that includes at least four magnetic cores, wherein each core is for supporting an inductor of a filter circuit. Each of the cores include a first section, and a second section separated from the first section by an adhesive layer. The apparatus also includes an air-core structure to store magnetic energy, the air-core structure including a set of focusing projections that define a hollow cavity. The individual focusing projections of the set are disposed on different sides of the hollow cavity to focus magnetic field from the at least four magnetic cores through the hollow cavity.

Semiconductor chip laminates and inductive, capacitive, and electromagnetic shielding laminate structures that can be integrated together to form electronic circuits for use in systems and devices such as smartphones, tablet computers, notebook computers, wearable electronic devices, portable medical devices, servers, networking equipment, industrial equipment, etc. Fabrications of such integrated laminate structures can be modularized into four (4) types of laminates, namely, inductive laminates, capacitive laminates, electromagnetic shielding laminates, and semiconductor chip laminates, which can be vertically laminated together and/or integrated side-by-side with high density to produce the desired electronic circuits, systems, and devices.

Bride combiners with resonators for radio-frequency applications. A bridge combiner can be implemented as a coupling circuit that includes a common node and configured to couple the common node to a first group of filters through a first path and to couple the common node to a second group of one or more filters through a second path. The coupling circuit can include a resonator such that an impedance provided by each filter of the first group for a signal in each band of the second group results in the signal being sufficiently excluded from the first path, and such that an impedance provided by each filter of the second group for a signal in each band of the first group results in the signal being sufficiently excluded from the second path.

A resonance frequency is adjusted or optimized by shifting the resonance frequency without reducing an impedance function or a withstand voltage characteristic against a high frequency noise, when blocking, by using a multiple parallel resonance characteristic of a distributed constant line, the high frequency noise introduced into a line such as a power feed line or a signal line from an electrical member other than a high frequency electrode within a processing vessel. Regarding winding pitches, each of the solenoid coils 104(1) and 104(2) is divided to multiple sections K.sub.1, K.sub.2, . . . in a coil axis direction, and, a winding pitch p.sub.i in each section K.sub.i (i=1, 2, . . . ) is set independently. Comb teeth M inserted into winding gaps of both solenoid coils 104(1) and 104(2) are formed on inner surfaces of multiple rod-shaped comb-teeth member 114 provided adjacent to the solenoid coils 104(1) and 104(2).

In accordance with an embodiment, a semiconductor component, includes a common mode filter monolithically integrated with a protection device. The common mode filter includes a plurality of coils and the protection device has a terminal coupled to a first coil and another terminal coupled to a second coil.

A common mode filter includes: a coil part including a plurality of coil layers, each coil layer having at least one coil and a lead terminal connected to a first end of the coil, and a conductive via connecting the lead terminals to each other; a first magnetic layer disposed on the coil part; a second magnetic layer disposed below the coil part; and external electrodes connected to the lead terminals and exposed to the surface of the common mode filter.