A crystal device includes a bearing base, an integrated chip and a conductive adhesive unit. The bearing base includes a conductive seat. The integrated chip includes a principal reference plane facing the conductive seat, and having a first major axis. The conductive adhesive unit has a second major axis and an aspect ratio, and is at least partly disposed between the conductive seat and the integrated chip. The aspect ratio ranges from 1.1 to 1.9. The principal reference plane further has a perpendicular projection straight line defined according to the second major axis. A practical angle is included by the first perpendicular projection straight line and the first major axis, and ranges from 0 degree to 90 degrees.

A resonance device that includes a MEMS substrate that includes a resonator, a top cover having a silicon oxide film on a surface thereof that faces the MEMS substrate, and a bonding part that bonds the MEMS substrate and the top cover to each other so as to seal a vibration space of the resonator. The silicon oxide film includes a through hole that is formed along at least part of the periphery of the vibration space when the top cover is viewed in a plan view and that penetrates to a surface of the top cover. The through hole includes a first metal layer.

A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.

An oscillator includes a package having a plurality of external terminals disposed on a mounting surface, a circuit element housed in the package, and a resonator which is housed in the package, and is electrically coupled to the circuit element, wherein the circuit element is electrically coupled to the package with a plurality of pads each of which is bonded to the package via a bump member, the circuit element overlaps at least one of the external terminals in a plan view, and each of the bump members is bonded to the package at a position where at least a part of the bump member does not overlap the plurality of external terminals in the plan view.

An oscillator includes a package having a plurality of external terminals disposed on a mounting surface, a circuit element housed in the package, and a resonator which is housed in the package, and is electrically coupled to the circuit element, wherein the circuit element is electrically coupled to the package with a plurality of pads each of which is bonded to the package via a bump member, the circuit element overlaps at least one of the external terminals in a plan view, and each of the bump members is bonded to the package at a position where at least a part of the bump member does not overlap the plurality of external terminals in the plan view.

A communications module includes a module substrate composed of a plurality of insulating layers, a plurality of wiring layers, and a plurality of wiring vias; and a filter module disposed on the module substrate. At least one of the wiring layers overlaps the filter module in a thickness direction of the module substrate and is connected to a ground potential to function as a ground layer, and an entirety of at least one of the wiring layers and at least one of the wiring vias disposed in a first region in the thickness direction of the module substrate between the filter module and the ground layer are electrically connected to the filter module.

Frequency stabilization is provided in a microelectromechanical systems (MEMS) oscillator via tunable internal resonance (IR). A device comprises a MEMS resonator comprising a stepped-beam structure that is a thin-layer structure. The resonator may be configured to implement IR. The stepped-beam structure may be configured to provide flexibility to adjust modal frequencies into a n:m ratio, wherein n and m are integers. The thin-layer structure provides frequency tunability by controlling the mid-plane stretching effect with an applied DC bias. The thin-layer structure compensates for a frequency mismatch from a n:m ratio due to a fabrication error. The MEMS resonator may be an oscillator.

A package structure that includes a pair of substrates arranged to oppose each other so as to form an internal space; a bonding portion sealing the pair of substrates; an element is sealed in the internal space and surrounded by the pair of substrates; an adsorption layer within the internal space and opposing at least one substrate of the pair of substrates, the adsorption layer constructed to adsorbs at least hydrogen; and a diffusion-inhibiting layer between the at least one substrate and the adsorption layer, and in which hydrogen is more difficult to diffuse compared with in the at least one substrate.

A method for manufacturing a vibrator device including a base portion having a first surface, a support portion protruding from the first surface in a normal direction of the first surface, and a vibrating arm that extends from the support portion along the first surface and that has a gap with the first surface, the method including: preparing a single crystal silicon substrate having a flat plate shape; forming, by dry etching, at least two bottomed long grooves arranged at a predetermined interval on a second surface which is one surface of the silicon substrate; and forming the vibrating arm between the second surface and a bottom surface of the long groove in a thickness direction of the silicon substrate by wet etching side surfaces of the long groove and communicating the two long grooves with each other.

In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.