A high frequency termination device includes a printed circuit board. A ground pad having a first predetermined inductive reactance at a resonant frequency can be mounted on the printed circuit board. A resistor landing pad having a second predetermined inductive reactance at the resonant frequency can be mounted on the printed circuit board. The resistor landing pad can be selectively positioned adjacent to the ground pad to create a desired capacitive reactance at the resonant frequency to cancel at least part of the first predetermined inductive reactance and the second predetermined inductive reactance. A terminating resistor can be coupled with the resistor landing pad. An impedance of the termination device is dominated by a resistance value of the terminating resistor at the resonant frequency due to cancellation of at least part of the first predetermined inductive reactance and the second predetermined inductive reactance at the resonant frequency.

A high frequency termination device includes a printed circuit board. A ground pad having a first predetermined inductive reactance at a resonant frequency can be mounted on the printed circuit board. A resistor landing pad having a second predetermined inductive reactance at the resonant frequency can be mounted on the printed circuit board. The resistor landing pad can be selectively positioned adjacent to the ground pad to create a desired capacitive reactance at the resonant frequency to cancel at least part of the first predetermined inductive reactance and the second predetermined inductive reactance. A terminating resistor can be coupled with the resistor landing pad. An impedance of the termination device is dominated by a resistance value of the terminating resistor at the resonant frequency due to cancellation of at least part of the first predetermined inductive reactance and the second predetermined inductive reactance at the resonant frequency.

An inductor component includes a plurality of conductive elements, each formed as an individual patch of conductive material, with the conductive elements arranged in a vertical stack and tightly coupled to one another. Dielectric is disposed between more adjacent conductive elements, the dielectric has a permittivity and is sufficiently thin so as to provide a mutual inductance factor of at least one-half or greater between adjacent ones of the conductive elements. The dielectric is typically thinner than the adjacent conductors.