Disclosed are an apparatus for monitoring pulsed high-frequency power and a substrate processing apparatus including the same. The apparatus includes an attenuation module configured to attenuate a pulsed high-frequency power signal; a rectifier module configured to convert the pulsed high-frequency power signal into a direct current signal; and a detection module configured to detect a pulse parameter based on the direct current signal.

A hybrid microwave attenuator is constructed by forming a circuit and a housing. The circuit has two ports, a resistive component configured to attenuate some frequencies in an input signal (transmitted signal), and a dispersive component configured to attenuate some frequencies within a frequency range. The resistive component and the dispersive component are arranged in a series configuration relative to one another between the two ports of the circuit. The housing includes a closable structure in which the circuit is positioned, the structure being formed of a material that exhibits at least a threshold level of thermal conductivity, where the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The housing further includes a pair of microwave connectors, the pair of connectors being thermally coupled to the housing.

A hybrid microwave attenuator is constructed by forming a circuit and a housing. The circuit has two ports, a resistive component configured to attenuate some frequencies in an input signal (transmitted signal), and a dispersive component configured to attenuate some frequencies within a frequency range. The resistive component and the dispersive component are arranged in a series configuration relative to one another between the two ports of the circuit. The housing includes a closable structure in which the circuit is positioned, the structure being formed of a material that exhibits at least a threshold level of thermal conductivity, where the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The housing further includes a pair of microwave connectors, the pair of connectors being thermally coupled to the housing.

Disclosed is a directional coupler having a coupler, a forward resistive attenuator, a reflected resistive attenuator, a forward compensation capacitor, and a reflected compensation capacitor. A forward coupler side arm and reflected coupler side arm of the coupler are configured to obtain a sample of forward energy and a sample of reflected energy from the coupler transmission line section. The forward resistive attenuator and reflected resistive attenuator are configured to attenuate the sample of forward energy and the sample of reflected energy. The forward compensation capacitor and the reflected compensation capacitor are configured to receive the attenuated sample of forward energy and the attenuated sample of reflected energy and produce a frequency-compensated sample of forward energy and a frequency-compensated sample of reflected energy.

Disclosed is a directional coupler having a coupler, a forward resistive attenuator, a reflected resistive attenuator, a forward compensation capacitor, and a reflected compensation capacitor. A forward coupler side arm and reflected coupler side arm of the coupler are configured to obtain a sample of forward energy and a sample of reflected energy from the coupler transmission line section. The forward resistive attenuator and reflected resistive attenuator are configured to attenuate the sample of forward energy and the sample of reflected energy. The forward compensation capacitor and the reflected compensation capacitor are configured to receive the attenuated sample of forward energy and the attenuated sample of reflected energy and produce a frequency-compensated sample of forward energy and a frequency-compensated sample of reflected energy.

The technology described herein is directed towards microwave attenuators, and more particularly to a cryogenic microwave attenuator device for quantum technologies. In some embodiments, a device can comprise a cryogenic microwave attenuator device. The cryogenic microwave attenuator device can comprise: a housing component and a microwave attenuator chip, wherein the housing component can have thermal conductivity of about at least 0.1 Watts per meter-Kelvin at 1 degree Kelvin. The cryogenic microwave attenuator device can also comprise a microwave connector comprising a signal conductor that is direct wire coupled to the microwave attenuator chip.

The technology described herein is directed towards microwave attenuators, and more particularly to a cryogenic microwave attenuator device for quantum technologies. In some embodiments, a device can comprise a cryogenic microwave attenuator device. The cryogenic microwave attenuator device can comprise: a housing component and a microwave attenuator chip, wherein the housing component can have thermal conductivity of about at least 0.1 Watts per meter-Kelvin at 1 degree Kelvin. The cryogenic microwave attenuator device can also comprise a microwave connector comprising a signal conductor that is direct wire coupled to the microwave attenuator chip.

Techniques for implementing multiple microwave attenuators on a high thermal conductivity substrate for cryogenic applications to reduce heat and thermal noise during quantum computing are provided. In one embodiment, a device for using in cryogenic environment is provided that comprises a substrate having a thermal conductivity above a defined threshold, a plurality of transmission lines fabricated on the substrate and arranged with a separation gap between the plurality of transmission lines to maintain crosstalk below 50 decibels, and one or more microwave attenuators embedded on the plurality of transmission lines.

Techniques for implementing multiple microwave attenuators on a high thermal conductivity substrate for cryogenic applications to reduce heat and thermal noise during quantum computing are provided. In one embodiment, a device for using in cryogenic environment is provided that comprises a substrate having a thermal conductivity above a defined threshold, a plurality of transmission lines fabricated on the substrate and arranged with a separation gap between the plurality of transmission lines to maintain crosstalk below 50 decibels, and one or more microwave attenuators embedded on the plurality of transmission lines.

Disclosed is a directional coupler having a coupler, a forward resistive attenuator, a reflected resistive attenuator, a forward compensation capacitor, and a reflected compensation capacitor. A forward coupler side arm and reflected coupler side arm of the coupler are configured to obtain a sample of forward energy and a sample of reflected energy from the coupler transmission line section. The forward resistive attenuator and reflected resistive attenuator are configured to attenuate the sample of forward energy and the sample of reflected energy. The forward compensation capacitor and the reflected compensation capacitor are configured to receive the attenuated sample of forward energy and the attenuated sample of reflected energy and produce a frequency-compensated sample of forward energy and a frequency-compensated sample of reflected energy.