Front-end circuitry for a wireless communication device is disclosed. In some embodiments, the radio frequency (RF) front-end circuitry includes various transceiver chains. The transceiver chains may each include a bulk acoustic wave (BAW) filter. The BAW filter in each of the transceiver chains may each have the same filter design with various exposed external pins, such as input pins, output pins, and ground pins. With respect to the transceiver chains, a different combination of the external pins are hardwired depending on a desired placement of a passband. In this manner, switches and control circuitry for the switches are not needed in order to place the passband. Furthermore, BAW filters with the same filter design can be used in the different transceiver chains, thereby simplifying the manufacturing process of the front-end circuitry.

Front-end circuitry for a wireless communication device is disclosed. In some embodiments, the radio frequency (RF) front-end circuitry includes various transceiver chains. The transceiver chains may each include a bulk acoustic wave (BAW) filter. The BAW filter in each of the transceiver chains may each have the same filter design with various exposed external pins, such as input pins, output pins, and ground pins. With respect to the transceiver chains, a different combination of the external pins are hardwired depending on a desired placement of a passband. In this manner, switches and control circuitry for the switches are not needed in order to place the passband. Furthermore, BAW filters with the same filter design can be used in the different transceiver chains, thereby simplifying the manufacturing process of the front-end circuitry.

A filter device having a reduced sensitivity to production tolerances comprises a multilayer panel with integrated wiring, a piezoelectric substrate mounted to the panel. A first filter circuit (FC.sub.1) and a signal path (SP) comprising a second filter circuit are realized on the substrate and connected to a common antenna terminal (AT) as well as to a common node (CN) located on top of the piezoelectric substrate. A first matching circuit (MC.sub.1) and further matching circuits (MC.sub.2) are realized by the wiring in the multilayer panel.

A filter device having a reduced sensitivity to production tolerances comprises a multilayer panel with integrated wiring, a piezoelectric substrate mounted to the panel. A first filter circuit (FC.sub.1) and a signal path (SP) comprising a second filter circuit are realized on the substrate and connected to a common antenna terminal (AT) as well as to a common node (CN) located on top of the piezoelectric substrate. A first matching circuit (MC.sub.1) and further matching circuits (MC.sub.2) are realized by the wiring in the multilayer panel.

A ladder type acoustic wave filter is disclosed. The acoustic wave filter can include a plurality of parallel arm resonators and a plurality of series arm resonators, in which an electromechanical coupling coefficient of a parallel arm resonator closest to an input node of the acoustic wave filter among the plurality of parallel arm resonators can be smaller than an electromechanical coupling coefficient of a series arm resonator closest to the input node among the plurality of series arm resonators.

A ladder type acoustic wave filter is disclosed. The acoustic wave filter can include a plurality of parallel arm resonators and a plurality of series arm resonators, in which an electromechanical coupling coefficient of a parallel arm resonator closest to an input node of the acoustic wave filter among the plurality of parallel arm resonators can be smaller than an electromechanical coupling coefficient of a series arm resonator closest to the input node among the plurality of series arm resonators.

A filter package is provided. The filter package includes a plurality of metal layers stacked in a vertical direction, a plurality of acoustic wave filters connected in parallel, the plurality of acoustic wave filters being located at one of the plurality of metal layers, power dividing and combining components connected with the plurality of acoustic wave filters, and heat dissipating components.

A filter package is provided. The filter package includes a plurality of metal layers stacked in a vertical direction, a plurality of acoustic wave filters connected in parallel, the plurality of acoustic wave filters being located at one of the plurality of metal layers, power dividing and combining components connected with the plurality of acoustic wave filters, and heat dissipating components.

Front-end circuitry for a wireless communication device is disclosed. In some embodiments, the radio frequency (RF) front-end circuitry includes various transceiver chains. The transceiver chains may each include a bulk acoustic wave (BAW) filter. The BAW filter in each of the transceiver chains may each have the same filter design with various exposed external pins, such as input pins, output pins, and ground pins. With respect to the transceiver chains, a different combination of the external pins are hardwired depending on a desired placement of a passband. In this manner, switches and control circuitry for the switches are not needed in order to place the passband. Furthermore, BAW filters with the same filter design can be used in the different transceiver chains, thereby simplifying the manufacturing process of the front-end circuitry.

Front-end circuitry for a wireless communication device is disclosed. In some embodiments, the radio frequency (RF) front-end circuitry includes various transceiver chains. The transceiver chains may each include a bulk acoustic wave (BAW) filter. The BAW filter in each of the transceiver chains may each have the same filter design with various exposed external pins, such as input pins, output pins, and ground pins. With respect to the transceiver chains, a different combination of the external pins are hardwired depending on a desired placement of a passband. In this manner, switches and control circuitry for the switches are not needed in order to place the passband. Furthermore, BAW filters with the same filter design can be used in the different transceiver chains, thereby simplifying the manufacturing process of the front-end circuitry.