Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.

Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.

A method is provided for adjusting the resonance frequency of a resonance circuit included in an electronic pen. The method uses adjusting means for adjusting the capacitance of an internal capacitor array and measuring means for measuring an alternating magnetic field generated by the resonance circuit. The method includes (1) a step of changing the state of a predetermined portion of multiple capacitive elements constituting the internal capacitor array, and (2) a step of changing, according to reference resonance frequency variations of the resonance circuit before and after the state change, the state of a portion or all of at least one capacitive element constituting the inner capacitor array other than said predetermined portion of the capacitive elements.

A method is provided for adjusting the resonance frequency of a resonance circuit included in an electronic pen. The method uses adjusting means for adjusting the capacitance of an internal capacitor array and measuring means for measuring an alternating magnetic field generated by the resonance circuit. The method includes (1) a step of changing the state of a predetermined portion of multiple capacitive elements constituting the internal capacitor array, and (2) a step of changing, according to reference resonance frequency variations of the resonance circuit before and after the state change, the state of a portion or all of at least one capacitive element constituting the inner capacitor array other than said predetermined portion of the capacitive elements.

Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.

Described are concepts related to the field of programmable interconnect substrates used in packaging electronics, and to stacked integrated circuits produced for application in low power and small form factor designs with fast prototyping and short mass-production cycle times. The concepts facilitate the dynamic reconfiguration of routing resources in the presence of an active system, and the tuning of routing paths to meet power and performance metrics.

A tunable impedance multiplier with high multiplication factor is described. A single externally connected resistor is used and the multiplier is free of passive elements. The circuit can realize a positive or a negative impedance multiplier. Applications of the design to low and high pass filters are also presented. The simulation and experimental results show that the new design enjoys a multiplication factor above 400 at 2 Hz-to 7 MHz.

A tunable impedance multiplier with high multiplication factor is described. A single externally connected resistor is used and the multiplier is free of passive elements. The circuit can realize a positive or a negative impedance multiplier. Applications of the design to low and high pass filters are also presented. The simulation and experimental results show that the new design enjoys a multiplication factor above 400 at 2 Hz-to 7 MHz.

A wirelessly powered resistive sensor is presented. The sensor includes: an antenna; a parametric resonator and a resistive loop circuit. The parametric resonator is configured to receive a pumping signal from the antenna and operable to oscillate at two frequencies. The resistive loop circuit is inductively coupled to the parametric resonator, such that oscillation frequency of the parametric resonator changes (e.g., linearly) with changes in resistance of the resistance loop circuit. The resistance of the resistor in the resistive loop circuit approximately equals the impedance of the resistive loop circuit at one resonance frequency of the parametric resonator. The resistive sensor may further include a resonator enhancer circuit arranged adjacent to the parametric resonator and operates to resonate at frequency of the pumping signal.

A wirelessly powered resistive sensor is presented. The sensor includes: an antenna; a parametric resonator and a resistive loop circuit. The parametric resonator is configured to receive a pumping signal from the antenna and operable to oscillate at two frequencies. The resistive loop circuit is inductively coupled to the parametric resonator, such that oscillation frequency of the parametric resonator changes (e.g., linearly) with changes in resistance of the resistance loop circuit. The resistance of the resistor in the resistive loop circuit approximately equals the impedance of the resistive loop circuit at one resonance frequency of the parametric resonator. The resistive sensor may further include a resonator enhancer circuit arranged adjacent to the parametric resonator and operates to resonate at frequency of the pumping signal.