A speed-up circuit is configured to be provided between a power supply terminal and a gate of a semiconductor switching element. An impedance element is configured to be provided between a signal input terminal and a node, the node being between the speed-up circuit and the gate of the semiconductor switching element. In the speed-up circuit, a second field effect transistor is connected in series to a first field effect transistor and is configured to be connected to the gate of the semiconductor switching element. The impedance element has an impedance higher than an impedance of the speed-up circuit when both the first field effect transistor and the second field effect transistor are in an ON state.

Some demonstrative embodiments include a Metal-Oxide-Semiconductor (MOS) transistor including a split-gate structure. For example, an Integrated Circuit (IC) may include a MOS including a body; a source; a drain; and a split-gate structure including a control gate and at least one voltage-controlled Field-Plate (FP), the control gate is between the source and the voltage-controlled FP, the voltage-controlled FP is between the control gate and the drain, the control gate configured to switch the MOS transistor between an on state and an off state according to a switching voltage; and a voltage controller configured to apply a variable control voltage to the voltage-controlled FP, the variable control voltage based on at least one control parameter, the at least one control parameter including at least one of a load current driven by the MOS transistor or a switching frequency of the switching voltage.

Some demonstrative embodiments include a Metal-Oxide-Semiconductor (MOS) transistor including a split-gate structure. For example, an Integrated Circuit (IC) may include a MOS including a body; a source; a drain; and a split-gate structure including a control gate and at least one voltage-controlled Field-Plate (FP), the control gate is between the source and the voltage-controlled FP, the voltage-controlled FP is between the control gate and the drain, the control gate configured to switch the MOS transistor between an on state and an off state according to a switching voltage; and a voltage controller configured to apply a variable control voltage to the voltage-controlled FP, the variable control voltage based on at least one control parameter, the at least one control parameter including at least one of a load current driven by the MOS transistor or a switching frequency of the switching voltage.

A common gate resistor bypass arrangement for a stacked arrangement of FET switches, the arrangement including a series combination of an nMOS transistor and a pMOS transistor connected across a common gate resistor. During at least a transition portion of the transition state of the stacked arrangement of FET switches, the nMOS transistor and the pMOS transistor are both in an ON state and bypass the common gate resistor. On the other hand, during at least a steady state portion of the ON steady state and the OFF steady state of the stacked arrangement of FET switches, one of the nMOS transistor and the pMOS transistor is in an OFF state and the other of the nMOS transistor and the pMOS transistor is in an ON state, thus not bypassing the common gate resistor.

A gate driver system includes a gate driver circuit coupled to a gate terminal of a transistor and configured to generate an on-current during a plurality of turn-on switching events to turn on the transistor, wherein the gate driver circuit includes a first driver configured to source a first portion of the on-current to the gate terminal to charge a first portion of the gate voltage and a second driver configured to, during a first boost interval, source a second portion of the on-current to the gate terminal to charge a second portion of the gate voltage; a measurement circuit configured to measure a transistor parameter indicative of an oscillation of a load current for a turn-on switching event; and a controller configured to receive the measured transistor parameter and regulate a length of the first boost interval based on the measured transistor parameter.

Embodiments of the invention provide IGBT circuit modules with increased efficiencies. These efficiencies can be realized in a number of ways. In some embodiments, the gate resistance and/or voltage can be minimized. In some embodiments, the IGBT circuit module can be switched using an isolated receiver such as a fiber optic receiver. In some embodiments, a single driver can drive a single IGBT. And in some embodiments, a current bypass circuit can be included. Various other embodiments of the invention are disclosed.

A radio frequency signal transmission circuit includes a direct current blocking unit, a biasing impedance circuit, and a radio frequency element. The direct current blocking unit has a first terminal for receiving an input signal, and a second terminal coupled to a first bias voltage terminal. The biasing impedance circuit has a first terminal coupled to the first bias voltage terminal for providing a first bias voltage, and a second terminal coupled to a second bias voltage terminal for receiving a second bias voltage. The radio frequency element is coupled to the first bias voltage terminal, and receives and processes the input signal. When the biasing impedance circuit operates in a first mode, the biasing impedance circuit provides a first impedance. When the biasing impedance circuit operates in a second mode, the biasing impedance circuit provides a second impedance greater than the first impedance.

A radio frequency signal transmission circuit includes a direct current blocking unit, a biasing impedance circuit, and a radio frequency element. The direct current blocking unit has a first terminal for receiving an input signal, and a second terminal coupled to a first bias voltage terminal. The biasing impedance circuit has a first terminal coupled to the first bias voltage terminal for providing a first bias voltage, and a second terminal coupled to a second bias voltage terminal for receiving a second bias voltage. The radio frequency element is coupled to the first bias voltage terminal, and receives and processes the input signal. When the biasing impedance circuit operates in a first mode, the biasing impedance circuit provides a first impedance. When the biasing impedance circuit operates in a second mode, the biasing impedance circuit provides a second impedance greater than the first impedance.

A switch for a radio frequency signal switch assembly including a first node coupled to one of an input and an output of the switch assembly and a second node coupled to a reference voltage, a control node, a common resistor coupled to the control node, a plurality of transistors coupled between the first and second nodes, each transistor of the plurality of transistors having a gate, a drain, and a source, and a plurality of gate resistors coupled between the common resistor and the gates of the plurality of transistors, the plurality of gate resistors having a scaled arrangement of values selected based on a voltage differential across each of the plurality of gate resistors to improve switching speed.

An analog switch includes an input terminal, an output terminal, a common gate, and a common source. The switch includes a current source which has a first input coupled to a first voltage supply, a control input coupled to receive a gate boost signal, and an output coupled to the common gate. The current source supplies a boost gate current to the common gate during a boost period and supplies a reduced gate current during a second period different than the boost period. The switch includes a clamp circuit which has a first terminal coupled to the common gate, a second terminal coupled to the common source, and a third terminal. The switch includes a Vgs detection circuit which provides the gate boost signal responsive to a conduction of current through the clamp circuit.