An integrated circuit is described herein. In accordance with one embodiment the circuit includes a transistor coupled between a supply pin and an output pin, a current output circuit configured to provide a diagnosis current at an current output pin, a current sensing circuit coupled to the transistor and configured to generate a first current sense signal indicative of a load current passing through the transistor and a second current sense signal indicative of the load current. The current output circuit is configured to select, dependent on a control signal, one of the following as diagnosis current: the first current sense signal and the second current sense signal.

A package structure is provided herein, which includes a substrate, an integrated transistor, and an encapsulation structure. The integrated transistor is disposed on the substrate and includes a transistor, a capacitor, a resistor, a first Zener diode, and a second Zener diode. The transistor includes a gate, a drain, and a source. The capacitor is electrically connected to the gate, and the resistor is electrically connected to the gate. The first Zener diode includes a first anode and a first cathode electrically connected to the gate. The second Zener diode includes a second anode electrically connected to the first anode and a second cathode electrically connected to the source. The encapsulation structure encapsulates the integrated transistor. The package structure includes a gate terminal, a drain terminal, and a source terminal.

A package structure is provided herein, which includes a substrate, an integrated transistor, and an encapsulation structure. The integrated transistor is disposed on the substrate and includes a transistor, a capacitor, a resistor, a first Zener diode, and a second Zener diode. The transistor includes a gate, a drain, and a source. The capacitor is electrically connected to the gate, and the resistor is electrically connected to the gate. The first Zener diode includes a first anode and a first cathode electrically connected to the gate. The second Zener diode includes a second anode electrically connected to the first anode and a second cathode electrically connected to the source. The encapsulation structure encapsulates the integrated transistor. The package structure includes a gate terminal, a drain terminal, and a source terminal.

A power distribution system and method has a controller and at least one semiconductor switch. The power distribution system additionally has an on status detector which detects the status of the semiconductor switches, and an overcurrent status circuit which checks for overcurrent conditions.

A power distribution system and method has a controller and at least one semiconductor switch. The power distribution system additionally has an on status detector which detects the status of the semiconductor switches, and an overcurrent status circuit which checks for overcurrent conditions.

A device includes a driver circuit and diagnostic circuitry coupled to the driver circuit. The diagnostic circuitry includes an on-state diagnostic circuit and an off-state diagnostic circuit. The diagnostic circuitry, in operation: generates a configuration signal associated with an operative condition of the driver circuit based on a comparator output of the off-state diagnostic circuit; diagnoses conditions associated with the driver circuit; and controls operation of the on-state diagnostic circuit based on the configuration signal.

A device includes a driver circuit and diagnostic circuitry coupled to the driver circuit. The diagnostic circuitry includes an on-state diagnostic circuit and an off-state diagnostic circuit. The diagnostic circuitry, in operation: generates a configuration signal associated with an operative condition of the driver circuit based on a comparator output of the off-state diagnostic circuit; diagnoses conditions associated with the driver circuit; and controls operation of the on-state diagnostic circuit based on the configuration signal.

The present disclosure mainly provides a clamping circuit, coupled to a first end and a second end of a switching transistor through a first node and a second node, comprising: an RCD circuit, comprising a first resistor and a first capacitor connected in parallel between the second node and a third node, and a diode having a negative electrode coupled to the third node; and a first stabilivolt diode, having a negative electrode coupled to the first node and a positive electrode coupled to a positive electrode of the diode at a fourth node.

The present disclosure mainly provides a clamping circuit, coupled to a first end and a second end of a switching transistor through a first node and a second node, comprising: an RCD circuit, comprising a first resistor and a first capacitor connected in parallel between the second node and a third node, and a diode having a negative electrode coupled to the third node; and a first stabilivolt diode, having a negative electrode coupled to the first node and a positive electrode coupled to a positive electrode of the diode at a fourth node.

A power semiconductor circuit is provided for clamping the voltage across the circuit when a power semiconductor switch is opened (i.e., turned off). The circuit may include a first surge arrester and a first semiconductor switch coupled in parallel with the power semiconductor switch. The first semiconductor switch is coupled in series with the first surge arrester. A second surge arrester may be coupled to the gate of the first semiconductor switch to control current flow through the first semiconductor switch and the first surge arrester.