A switching device 1 includes a SiC semiconductor chip 11 which has a gate pad 14, a source pad 13 and a drain pad 12 and in which on-off control is performed between the source and the drain by applying a drive voltage between the gate and the source in a state where a potential difference is applied between the source and the drain, a sense source terminal 4 electrically connected to the source pad 13 for applying the drive voltage, and an external resistance (source wire 16) that is interposed in a current path between the sense source terminal 4 and the source pad 13, is separated from sense source terminal 4, and has a predetermined size.

A superconducting DC switch system is provided. The superconducting DC switch system comprises one or more Josephson junctions (JJs), and a magnetic field generator that is configured to switch from inducing a magnetic field in a plane of the one or more JJs, and providing no magnetic field in the plane of the one or more JJs. A DC input signal applied at an input of the one or more JJs is passed through to an output the one or more JJs in the absence of an induced magnetic field, and the DC input signal is substantially suppressed at the output of the one or more JJs in the presence of the magnetic field.

A switching device 1 includes a SiC semiconductor chip 11 which has a gate pad 14, a source pad 13 and a drain pad 12 and in which on-off control is performed between the source and the drain by applying a drive voltage between the gate and the source in a state where a potential difference is applied between the source and the drain, a sense source terminal 4 electrically connected to the source pad 13 for applying the drive voltage, and an external resistance (source wire 16) that is interposed in a current path between the sense source terminal 4 and the source pad 13, is separated from sense source terminal 4, and has a predetermined size.

A switch circuit electrically connected to a power source and a first control source and including a plurality of switch bridge arms is provided. Each of the plurality of switch bridge arms includes a first switch and a second switch electrically connected in series. A loop formed by the first switch, the second switch and the power source is defined as a power loop. A loop formed by the first control source and the first switch is defined as a first control loop. A first mutual inductance is formed between the power loop and the first control loop. Among all the first switches, the first switch with the longer power loop has the smaller first mutual inductance.

A switching device 1 includes a SiC semiconductor chip 11 which has a gate pad 14, a source pad 13 and a drain pad 12 and in which on-off control is performed between the source and the drain by applying a drive voltage between the gate and the source in a state where a potential difference is applied between the source and the drain, a sense source terminal 4 electrically connected to the source pad 13 for applying the drive voltage, and an external resistance (source wire 16) that is interposed in a current path between the sense source terminal 4 and the source pad 13, is separated from sense source terminal 4, and has a predetermined size.

Systems, apparatuses, and methods for efficient operation of a switch arrangement are described. Selectively operating one of a plurality of parallel-connected switches at different times along a period of a periodic waveform may allow for improved efficiency, uniform loss-spreading, and enhanced thermal design of an electronic circuit including use of power switches.

Systems, apparatuses, and methods for efficient operation of a switch arrangement are described. Selectively operating one of a plurality of parallel-connected switches at different times along a period of a periodic waveform may allow for improved efficiency, uniform loss-spreading, and enhanced thermal design of an electronic circuit including use of power switches.

A level adjusting circuit includes a parallel resistor-capacitor (RC) sub-circuit, a first diode and an adjustable voltage supply. The RC sub-circuit includes an input capacitor and an input resistor, and includes an input node electrically connected to a driving signal source for receiving a driving signal therefrom, and an output node that outputs an adjusted driving signal. The first diode and the adjustable voltage supply are electrically connected, and are further electrically connected to the output node and a reference voltage node, respectively.

A method for determining the junction temperature of at least one die of a semiconductor power module, the semiconductor power module being composed of plural dies connected in parallel and switching between conducting and non conductor states according to pattern cycles, the method comprises the steps of: disabling the conducting of the at least one die during at least a fraction of one switching cycle, applying a current limited voltage to the gate of the at least one die during a period of time of the cycle wherein the at least one die is not conducting, the resulting voltage excursion having a value that does not enable the die to be conducting, measuring the voltage at the gate of the die, deriving from the measured voltage a temperature variation of the junction of the at least one die or the temperature of the junction of the die.

A solid state circuit breaker assembly includes a transistor, a transient voltage suppression device, and a circuit board. The transistor and/or the transient voltage suppression device may be electrically connected to the circuit board. The solid state circuit breaker module may be configured to be connected to one or more non-scalable modules to regulate current. The solid state circuit breaker module may be configured to receive one or more scalable modules. The transistor and/or the transient voltage suppression device may be disposed on the circuit board in a substantially symmetrical configuration.