An integrated circuit including a first standard cell including, first transistors, the first transistors being first unfolded transistors, a first metal pin, a second metal pin, and a third metal pin on a first layer, the first metal pin and the second metal pin having a first minimum metal center-to-metal center pitch therebetween less than or equal to 80 nm, a fourth metal pin and a fifth metal pin at a second layer, the fourth metal pin and the fifth metal pin extending in a second direction, the second direction being perpendicular to the first direction, a first via between the first metal pin and the fourth metal pin, and a second via between the third metal pin and the fifth metal pin such that a first via center-to-via center space between the first via and the second via is greater than double the first minimum metal center-to-metal center pitch.

A wide supply range digital level shifter circuit shifts between a variable desired output voltage ranging from a first voltage level and a second voltage level. The wide supply range digital level shifter circuit includes a latch circuit, a first bleeder circuit, and a second bleeder circuit. The latch circuit receives the first voltage level and the second voltage level, and includes first and second clocked differential switches. The first bleeder circuit is connected between the second voltage rail and the first differential switch and is configured to receive a first digital input voltage. The second bleeder circuit is connected between the second voltage rail and the second differential switch and is configured to receive a second digital input voltage. The first and second bleeder circuits isolate the first and second digital input voltages from the variable desired output voltage.

An electronic device includes a die stack having a plurality of die. The die stack includes a die parity path spanning the plurality of die and configured to alternatingly identify each die as a first type or a second type. The die stack further includes an inter-die signal path spanning the plurality of die and configured to propagate an inter-die signal through the plurality of die, wherein the inter-die signal path is configured to invert a logic state of the inter-die signal between each die. Each die of the plurality of die includes signal formatting logic configured to selectively invert a logic state of the inter-die signal before providing it to other circuitry of the die responsive to whether the die is designated as the first type or the second type.

A PAM (Pulse Amplitude Modulation) modulator driver is configured to receive a PAM input signal having N input amplitude levels and provide a PAM output signal having N output amplitude levels, where N is an integer. The PAM modulator driver circuit configured to electrically adjust amplitude levels in the PAM output signal.

A detection control device including a USB connection port, a first detection circuit, a second detection circuit, a control circuit, a first switching circuit and a second switching circuit is provided. When a first pin group of the USB connection port is coupled to an external device, the first detection circuit generates a first detection signal according to a first time constant. When a second pin group of the USB connection port is coupled to the external device, the second detection circuit generates a second detection signal according to a second time constant. The control circuit generates a first control signal and a second control signal according to the first and second detection signals. Each of the first and second switching circuits communicates with the external device via the first or second pin groups according to either the first control signal or the second control signal.

A diagnostic system for a DC-DC voltage converter having a high voltage switch, a low voltage switch, and a DC-DC voltage converter control circuit is provided. The system includes first and second tri-state buffer ICs and a microcontroller. The first tri-state buffer IC receives a first shutdown indicator voltage from the DC-DC voltage converter control circuit indicating that a first plurality of FET switches in a high side FET IC and a second plurality of FET switches in a low side FET IC have been transitioned to an open operational state. The first tri-state buffer IC outputs a second shutdown indicator voltage to the microcontroller that indicates that the first and second plurality of FET switches have been transitioned to the open operational state.

In some embodiments, a buffer stage device includes a data input for receiving a data signal, a clock input for receiving a clock signal, a data output and a processor that is configured to deliver, to the data output, the data from the data signal in synchronism with clock cycles of the clock signal. The processor includes a first buffer module configured to deliver, to the data output, each datum in synchronism with a first edge of the clock signal and during a first half of a clock cycle, and a second buffer module configured to hold the datum at the data output during the second half of the clock cycle.

An integrated circuit including a first standard cell including, first transistors, the first transistors being first unfolded transistors, a first metal pin, a second metal pin, and a third metal pin on a first layer, the first metal pin and the second metal pin having a first minimum metal center-to-metal center pitch therebetween less than or equal to 80 nm, a fourth metal pin and a fifth metal pin at a second layer, the fourth metal pin and the fifth metal pin extending in a second direction, the second direction being perpendicular to the first direction, a first via between the first metal pin and the fourth metal pin, and a second via between the third metal pin and the fifth metal pin such that a first via center-to-via center space between the first via and the second via is greater than double the first minimum metal center-to-metal center pitch.

A sensor includes an output circuit configured to generate a sensor output signal based on an input signal having a logic high or low level, as may be provided by a Schmitt trigger circuit. During normal operation, the output switches between a first percentage of the supply voltage for logic high and a second percentage of the supply voltage for logic low. To convey a failure at the output, an output signal is output as either ground or the supply voltage when a fault is detected. As such, a fault can be communicated any time the output voltage is not equal to the first percentage or the second percentage of the supply voltage.

In accordance with embodiments of the present disclosure, a system may include a buffer and a switch coupled between the buffer and a voltage supply such that the switch controls a varying voltage at a varying voltage node coupled to the buffer.