Patent classifications
H03K19/20
Event activity trigger
Methods of triggering a test and measurement instrument having a plurality of inputs include the step of generating a trigger signal in response to every occurrence of any one of a plurality of specified trigger events. A first specified trigger event occurs in at least a first one of the inputs and a second specified trigger event occurs in at least a second one of the plurality of inputs. A specified trigger event may include at least one selected input from the plurality of inputs and a selected activity type. Some methods include configuring each of a plurality of event activity detectors to produce a pulse in a logic signal in response to every occurrence of one of the specified trigger events. The plurality of logic signals are combined in a logical OR circuit to generate the trigger signal. Trigger circuits configured according to these methods are also disclosed.
DRIVING ADJUSTMENT CIRCUIT AND ELECTRONIC DEVICE
A driving adjustment circuit and an electronic device are provided. The driving adjustment circuit includes a first NOT gate module, second NOT gate module and third NOT gate module sequentially connected. An input terminal of the first NOT gate module and an output terminal of the third NOT gate module are connected to a signal terminal. The first NOT gate module acquires a to-be-driven signal from the signal terminal and perform a NOT operation on the to-be-driven signal to obtain a first adjustment signal. The second NOT gate module receives the first adjustment signal and performing the NOT operation on the first adjustment signal to obtain a second adjustment signal, when the driving adjustment circuit is in an ON state. The third NOT gate module receives the second adjustment signal and perform voltage adjustment processing on the to-be-driven signal at the signal terminal according to the second adjustment signal.
DRIVING ADJUSTMENT CIRCUIT AND ELECTRONIC DEVICE
A driving adjustment circuit and an electronic device are provided. The driving adjustment circuit includes a first NOT gate module, second NOT gate module and third NOT gate module sequentially connected. An input terminal of the first NOT gate module and an output terminal of the third NOT gate module are connected to a signal terminal. The first NOT gate module acquires a to-be-driven signal from the signal terminal and perform a NOT operation on the to-be-driven signal to obtain a first adjustment signal. The second NOT gate module receives the first adjustment signal and performing the NOT operation on the first adjustment signal to obtain a second adjustment signal, when the driving adjustment circuit is in an ON state. The third NOT gate module receives the second adjustment signal and perform voltage adjustment processing on the to-be-driven signal at the signal terminal according to the second adjustment signal.
ISOLATED DRIVER DEVICE AND METHOD OF TRANSMITTING INFORMATION IN AN ISOLATED DRIVER DEVICE
An isolated driver device comprises a first semiconductor die and a second semiconductor die galvanically isolated from each other. The second semiconductor die includes a signal modulator circuit configured to modulate a carrier signal to produce a modulated signal encoding information. A galvanically isolated communication channel implemented in the first semiconductor die and the second semiconductor die is configured to transmit the modulated signal from the second semiconductor die to the first semiconductor die. The second semiconductor die includes: a fault detection circuit configured to detect electrical faults in the second semiconductor die; a logic circuit coupled to the fault detection circuit and configured to assert a modulation bypass signal in response to a fault being detected by the fault detection circuit; and modulation masking circuitry configured to force the modulated signal to a steady value over a plurality of periods of the carrier signal in response to the modulation bypass signal being asserted. The first semiconductor die includes a respective logic circuit sensitive to the modulated signal and configured to detect a condition where the modulated signal has a steady value over a plurality of periods of the carrier signal, and to assert a fault detection signal in response to the condition being detected.
ISOLATED DRIVER DEVICE AND METHOD OF TRANSMITTING INFORMATION IN AN ISOLATED DRIVER DEVICE
An isolated driver device comprises a first semiconductor die and a second semiconductor die galvanically isolated from each other. The second semiconductor die includes a signal modulator circuit configured to modulate a carrier signal to produce a modulated signal encoding information. A galvanically isolated communication channel implemented in the first semiconductor die and the second semiconductor die is configured to transmit the modulated signal from the second semiconductor die to the first semiconductor die. The second semiconductor die includes: a fault detection circuit configured to detect electrical faults in the second semiconductor die; a logic circuit coupled to the fault detection circuit and configured to assert a modulation bypass signal in response to a fault being detected by the fault detection circuit; and modulation masking circuitry configured to force the modulated signal to a steady value over a plurality of periods of the carrier signal in response to the modulation bypass signal being asserted. The first semiconductor die includes a respective logic circuit sensitive to the modulated signal and configured to detect a condition where the modulated signal has a steady value over a plurality of periods of the carrier signal, and to assert a fault detection signal in response to the condition being detected.
CHIP WITH POWER-GLITCH DETECTION
A chip with power-glitch detection is provided, which includes a power terminal receiving power, an inverter, and a back-up power storage device coupled to the power terminal. The inverter has an input terminal coupled to the power terminal. The back-up power storage device transforms the power to back-up power. The inverter is powered by the back-up power when a power glitch occurs on the power terminal, and the power glitch is reflected at an output terminal of the inverter.
CHIP WITH POWER-GLITCH DETECTION
A chip with power-glitch detection is provided, which includes a power terminal receiving power, an inverter, and a back-up power storage device coupled to the power terminal. The inverter has an input terminal coupled to the power terminal. The back-up power storage device transforms the power to back-up power. The inverter is powered by the back-up power when a power glitch occurs on the power terminal, and the power glitch is reflected at an output terminal of the inverter.
ADDER WITH FIRST AND SECOND ADDER CIRCUITS FOR NON-POWER OF TWO INPUT WIDTH
A method includes receiving, by an x-bit adder, first and second addends. The x bits comprise a first portion and a second portion, the first portion is a power of two number of bits, and x is not a power of two. The method also includes computing a first sum of the first and second addends corresponding to the first portion. Computing the first sum provides a carry out bit. The method includes computing a non-incremented sum of the first and second addends corresponding to the second portion; computing an incremented sum of the first and second addends corresponding to the second portion; selecting one of the non-incremented sum and the incremented sum, responsive to the carry out bit, as a second sum; and providing a final sum by concatenating the second sum and the first sum.
ADDER WITH FIRST AND SECOND ADDER CIRCUITS FOR NON-POWER OF TWO INPUT WIDTH
A method includes receiving, by an x-bit adder, first and second addends. The x bits comprise a first portion and a second portion, the first portion is a power of two number of bits, and x is not a power of two. The method also includes computing a first sum of the first and second addends corresponding to the first portion. Computing the first sum provides a carry out bit. The method includes computing a non-incremented sum of the first and second addends corresponding to the second portion; computing an incremented sum of the first and second addends corresponding to the second portion; selecting one of the non-incremented sum and the incremented sum, responsive to the carry out bit, as a second sum; and providing a final sum by concatenating the second sum and the first sum.
FLOATING POINT FUSED MULTIPLY ADD WITH MERGED 2'S COMPLEMENT AND ROUNDING
A method includes receiving an unrounded mantissa value and a round bit associated with the unrounded mantissa value. The method also includes receiving a 2's complement signal that indicates whether the unrounded mantissa value results from a 1's complement operation. The method includes incrementing the unrounded mantissa value to provide an incremented value. The unrounded mantissa value is a non-incremented value. The method further includes providing one of the incremented value or non-incremented value as a rounded mantissa value responsive to the 2's complement signal.