Disclosed herein is a temperature compensated crystal oscillator, TCXO, comprising: a crystal oscillator arrangement configured to generate an output signal of the temperature compensated crystal oscillator; and a temperature sensor arranged to generate a temperature sensor signal, wherein the output signal of the crystal oscillator arrangement is controlled in dependence on the temperature sensor signal; wherein: the temperature sensor comprises a plurality of transistor circuits; each transistor circuit comprises a transistor and a bias circuit; each transistor circuit is arranged to output a temperature signal that is dependent on the temperature of the transistor comprised by the transistor circuit; each bias circuit is configured such that the noise level in each output temperature signal is low; and the plurality of transistor circuits are arranged so that the temperature sensor signal is dependent on each of the plurality of output temperature signals.

The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

The present invention provides a temperature-compensated crystal oscillator based on digital circuit, a closed-loop compensation architecture is employed to realize the high precision compensation of the crystal oscillator. The output frequency f(T) of the TCXO to be compensated is directly connected with the compensation voltage V.sub.c(T) in real time, and the compensation voltage is fed back to the voltage control terminal of the VCXO to be compensated to compensate, so that the output frequency after compensation is equal to the target frequency signal, thus avoiding the frequency shift of output signal caused by temperature hysteresis, i.e. the discrepancy between the temperature acquired by a temperature senor and the real temperature of the resonant wafer in the prior art.

An oscillator includes: a resonator; an oscillation circuit configured to oscillate the resonator; a first temperature compensation circuit configured to perform a first temperature compensation processing of temperature-compensating for a frequency of a first clock signal generated by oscillation of the resonator by the oscillation circuit; and a second temperature compensation circuit configured to receive the first clock signal subjected to the first temperature compensation processing, and to output a second clock signal subjected to a second temperature compensation processing based on the first clock signal. The first temperature compensation circuit is configured to perform a first-order first temperature compensation processing as the first temperature compensation processing. The second temperature compensation circuit is configured to perform a high-order second temperature compensation processing as the second temperature compensation processing.

A compensation apparatus including a primary circuit and a compensation circuit is provided. The primary circuit provides a first voltage, a second voltage, and a first current flowing through a first inductor. The primary circuit includes the first inductor and a function circuit generating an input signal. The first inductor is coupled between a first terminal with the first voltage and a second terminal with the second voltage. The compensation circuit includes a second inductor and a current source circuit. The second inductor is coupled between a third terminal with a third voltage and a fourth terminal with a fourth voltage. The current source circuit outputs a second current flowing through the second inductor. The current source circuit adjusts a frequency of the input signal. The primary circuit and the compensation circuit are coupled via the first inductor and the second inductor.

An oscillator includes a container, an oscillation element housed in the container, a heating circuit housed in the container, and adapted to control a temperature of the oscillation element, a temperature detection circuit housed in the container, a temperature control circuit housed in the container, and adapted to control the heating circuit based on an output of the temperature detection circuit, at least one connecting wire housed in the container, and electrically connects a ground of the temperature detection circuit and a ground of the temperature control circuit to each other, and a ground external terminal disposed on an outer surface of the container, and electrically connected to the ground of the temperature detection circuit and the ground of the temperature control circuit.

Provided is a thermostatic type crystal oscillator with short operation stabilization time and low power consumption.

A thermostatic type crystal oscillator according to the present invention includes a crystal resonator including an IT-cut crystal blank, a vibration control circuit configured to control a vibration frequency of the crystal resonator, a temperature regulator configured to regulate a temperature of the crystal resonator within a set temperature range by repeating heating and cooling to the crystal resonator, a heat conducting plate configured to function as a heat absorbing plate and a heat dissipating plate for the temperature regulator, a temperature control circuit configured to control a temperature of the temperature regulator, and a housing that accommodates the crystal resonator. The housing defines a resonator accommodating space in which the crystal resonator is accommodated inside the housing.

A slow-clock calibration method, a slow-clock calibration unit, a clock circuit and a mobile communication terminal are provided. The calibration method includes: obtaining a current temperature of the crystal; searching a unique frequency-divide coefficient corresponding to the current temperature from a preset data base; if the coefficient is found in the data base, inputting the unique coefficient into a frequency divider; if the coefficient is not found in the data base, obtaining an actual sleep length of the mobile communication terminal, if the actual sleep length is not equal to a required sleep length, calculating a required frequency-divide coefficient and updating the data base with the required frequency-divide coefficient, and if the actual sleep length of the mobile communication terminal is equal to the required sleep length, updating the data base with a current frequency-divide coefficient. Accordingly, slow-clock calibration is realized with reduced crystal costs.

There is configured an oscillator characterized by including an outer package having a housing space, an inner package housed in the housing space, a resonator element housed in the inner package, a heater element housed in the housing space, and fixed to the inner package, an oscillation circuit configured to oscillate the resonator element, a conducting member configured to electrically couple the inner package and the heater element to each other, and a first bonding wire configured to couple the heater element and the outer package to each other, and configured to electrically couple the conducting member and the outer package to each other.

A vibration device includes a base including a semiconductor substrate and through electrodes that pass through the portion between first and second surfaces of the semiconductor substrate, and a vibrator fixed to the first surface via an electrically conductive joining member. The following components are placed at the second surface: an oscillation circuit that is electrically coupled to the vibrator via the through electrodes and generates an oscillation signal by causing the vibrator to oscillate, a temperature sensor circuit, a temperature compensation circuit that performs temperature compensation on the oscillation signal, and an output buffer circuit that outputs a clock signal based on the oscillation signal. Dsx1<Dbx1, a distance between the output buffer circuit and one of the through electrodes is Dbx1, a distance between the temperature sensor circuit and the other through electrode is Dsx1.