Provided is an oscillation apparatus and an oscillation control apparatus including a first control section that generates a first control signal that controls an oscillation frequency of an oscillator, based on a temperature detection result of a temperature detecting section; an encoder that generates a feedback signal; a second control section that generates a second control signal that controls the oscillation frequency of the oscillator, based on the temperature detection result of the temperature detecting section, an external input signal input from outside, and the feedback signal; an oscillation circuit that sets the oscillation frequency of the oscillator, based on the first control signal and the second control signal; and a reference voltage generating section that generates a reference voltage, wherein the encoder generates the feedback signal by comparing the second control signal and the reference voltage.

A quantum interference device includes a base having a mounting surface, an atom cell in which alkali metal atoms are encapsulated, a light source adapted to emit light adapted to excite the alkali metal atoms, a photodetector adapted to detect the light having been transmitted through the atom cell, and a support adapted to support the atom cell, the light source, and the photodetector in a lump with respect to the mounting surface in a state in which the atom cell, the light source, and the photodetector are arranged in a direction along the mounting surface.

A quantum interference device includes a base having a mounting surface, an atom cell in which alkali metal atoms are encapsulated, a light source adapted to emit light adapted to excite the alkali metal atoms, a photodetector adapted to detect the light having been transmitted through the atom cell, and a support adapted to support the atom cell, the light source, and the photodetector in a lump with respect to the mounting surface in a state in which the atom cell, the light source, and the photodetector are arranged in a direction along the mounting surface.

An oscillator includes an oscillation circuit, an operation state signal generation circuit that generates an operation state signal based on an operation state of the oscillation circuit, and a first integrated circuit, the oscillation circuit and the operation state signal generation circuit are disposed outside the first integrated circuit, and the first integrated circuit includes a first digital interface circuit, a D/A conversion circuit that converts a digital signal input via the first digital interface circuit into an analog signal to generate a frequency control signal that controls a frequency of the oscillation circuit, and a terminal to which the operation state signal is input.

An oscillator configured to generate an oscillation signal is provided. The oscillator includes a transistor pair and a cross-coupled transistor pair. The transistor pair is coupled to a first current source and has a first transconductance. The first transconductance is changed in response to a current value of the first current source. The cross-coupled transistor pair is coupled to a second current source and has a second transconductance. The second transconductance is changed in response to a current value of second current source. The transistor pair and the cross-coupled transistor pair are mutually coupled by a plurality of inductors. A frequency of the oscillation signal is determined according to the first transconductance and the second transconductance. Furthermore, a clock generator and a method for generating a clock signal thereof are also provided.

An in-situ temperature compensation method of an electronic device and an associated temperature sensor includes providing airflow from a vortex air gun to a board including the electronic device and the associated temperature sensor; determining an associated offset at various temperatures in an operating range; and creating and storing a calibration table in memory including the associated offsets at the various temperatures, the calibration table is used during operation of the electronic device for compensation due to temperature variation. A system includes a board, an electronic device disposed to the board; a temperature sensor disposed on the board; a processor disposed to the board and communicatively coupled to the electronic device and the temperature sensor; and instructions that cause the processor to determine an associated offset at various temperatures in an operating range, and create and store a calibration table in memory with the associated offsets at the various temperatures.

An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

A ring oscillator circuit includes a plurality of first delay circuits each including X first delay elements, and a second delay circuit including a plurality of second delay elements different in delay amount from each other arranged in parallel to each other so as to be alternatively loaded, the plurality of first delay circuits and the second delay circuit are configured to be connected to each other in a ring-like manner, and X is an integer fulfilling X≧1.

A multi-ladder DAC includes first and second resistor ladders, with a switch-interconnect. The switch-interconnect includes a second set of switches connected between each node of the first ladder and the top and bottom tap points of the second ladder. All other second ladder tap points are part of a loop tied to the nodes above and below each resistor through a second set of switches. Because no current flows through the switches that tie the top and bottom second-ladder tap points to the nodes of the first ladder, avoiding IRswitch error, thereby improving DNL.