A circuit device includes an A/D converter that converts a temperature detection voltage from a temperature sensor unit to temperature detection data, and a digital signal processing circuit that executes a temperature compensation process based on the temperature detection data. The A/D converter, in an activation period, may execute a first A/D conversion process to obtain an initial value of the temperature detection data, and in a normal operation period, may execute a second A/D conversion process based on the initial value to obtain the temperature detection data.

A circuit device includes an A/D converter that converts a temperature detection voltage from a temperature sensor unit to temperature detection data, and a digital signal processing circuit that executes a temperature compensation process based on the temperature detection data. The A/D converter, in an activation period, may execute a first A/D conversion process to obtain an initial value of the temperature detection data, and in a normal operation period, may execute a second A/D conversion process based on the initial value to obtain the temperature detection data.

Provided is an oscillator arranged to output an oscillation signal of an oscillation frequency having an increasing and decreasing component that increases and decreases in one period, and an offset component for each period.

A circuit includes a first transistor and a second transistor having respective control terminals coupled to receive first and second bias voltages. A first electronic switch is coupled in series with, and between current paths of the first and second transistors to provide an output current line between a circuit output node and ground. A second electronic switch is selectively activated to a conductive state in order to provide a charge transfer current path between a bias node and a charge transfer node in the output current line. A third electronic switch is selectively activated to a conductive state in order to provide a charge transfer current path between the charge transfer node and the control terminal of the second transistor.

Circuits and methods for converting digital input signals into the analog domain are described. Such circuits may perform the conversion in a segmented fashion. For example, a circuit may include a most significant bit (MSB) path and a least significant bit (LSB) path. The MSB path may include a first delta-sigma modulator having first and second outputs and a first digital-to-analog converter coupled to the first output of the first delta-sigma modulator. The LSB path comprises a second delta-sigma modulator comprising a loop filter and a quantizer. The quantizer may have an input coupled to the loop filter and to the digital filter. The LSB path may further include a second digital-to-analog converter coupled to an output of the quantizer. The circuit may further include a digital filter and/or a gain stage interposed between the MSB path and the LSB path.

A sound source playback unit plays back sound data from a sound source and outputs a playback signal. An amplification unit amplifies the playback signal and outputs the playback signal as an output signal converted to sound in a speaker. A fault detection unit including a first conversion circuit compares the playback signal to a predetermined first threshold, converts a waveform of the playback signal, and outputs the converted waveform as a converted playback signal. A second conversion circuit compares the output signal to a predetermined second threshold, converts a waveform of the output signal, and outputs the converted waveform as a converted output signal. A comparison circuit compares the converted playback signal to the converted output signal, and a determination circuit determines an output of the comparison circuit. Based on the determination, the fault detection unit detects a fault in the amplification unit.

A multi-direction connectable electronic module includes a circuit board, including a top surface, a bottom surface, and at least one side; and a plurality of connectors connected to the circuit board, each including a lateral magnetic connector, a shell, a longitudinal inter-locking part, and a lateral inter-locking part. The lateral inter-locking part is configured to connect with a first electronic building block along the lateral direction. The longitudinal inter-locking part is configured to stack with a second electronic building block along the longitudinal direction. The lateral magnetic connector is configured to magnetically connect with the first electronic building block. A plurality of through holes are formed on the shell. A lateral pin connector disposed on the at least one side of the circuit board includes a plurality of pins located at positions corresponding to the plurality of through holes, and is configured to electrically connect the first electronic building block.

A multi-direction connectable electronic module includes a circuit board, including a top surface, a bottom surface, and at least one side; and a plurality of connectors connected to the circuit board, each including a lateral magnetic connector, a shell, a longitudinal inter-locking part, and a lateral inter-locking part. The lateral inter-locking part is configured to connect with a first electronic building block along the lateral direction. The longitudinal inter-locking part is configured to stack with a second electronic building block along the longitudinal direction. The lateral magnetic connector is configured to magnetically connect with the first electronic building block. A plurality of through holes are formed on the shell. A lateral pin connector disposed on the at least one side of the circuit board includes a plurality of pins located at positions corresponding to the plurality of through holes, and is configured to electrically connect the first electronic building block.

A correction system is configured to correct for duty cycle distortion and/or cross-point distortion in a pair of sample signals. A slope adjustment circuit is configured to generate a plurality of pairs of intermediate signals according to a plurality of drive strengths. A measurement circuit is configured to measure for duty cycle distortion and/or cross-point distortion, and the slope adjustment circuit is configured to set the plurality of drive strengths based on the measurement. The setting of the drive strengths may reduce certain rising and falling slopes of certain transitions of the plurality of intermediate signals, which in turn may reduce duty cycle distortion and/or cross-point distortion in the sample signals.

A superposition operation circuit and a float-voltage digital-to-analog conversion circuit to superpose analog elements according to an indirect current superposition principle, where a voltage follower is implemented using a first operational amplifier such that an output end of the voltage follower is clamped to a voltage that is input to a positive-phase input end, namely, a to-be-superposed analog element. Then a current generation circuit converts a voltage signal to a current signal, a voltage drop for the current signal is generated on a first resistor coupled to an output end of the first operational amplifier, and the voltage drop is superposed on a voltage signal output by the first operational amplifier.