A wireless sensor network at a monitored location can be configured to generate sensor channel(s) of data to assess operational conditions at the monitored location. Inputs based on the sensor channel(s) of data are provided to a host system for analysis of a demand to one or more resources at the monitored location. Response messages can be generated based on the demand analysis and transmitted to actuator(s) at the monitored location to effect an adjustment to the operational conditions.

Systems and methods are provided for conveyor operation and maintenance that employ one or both of a “smart shoe” technology where one or more conveyor shoes incorporate features, such as an RFID tag, and a “missing pin detection” technology where one or more pin components of conveyor shoes incorporate features, such as an RFID tag, allowing selective wireless tracking and identification capability. A conveyor system comprises a shoe management system allowing interactions directly with one or more RFID readers, which can detect, store and/or monitor information associated with “smart shoe” and/or “missing pin detection” RFID tags, where interface between this application and the reader can be implemented via a socket interface. An open platform communications (OPC) wrapper can be created around the interface so that a Human Machine Interface (HMI) could interact directly with shoe management system.

Systems and methods are provided for conveyor operation and maintenance that employ one or both of a “smart shoe” technology where one or more conveyor shoes incorporate features, such as an RFID tag, and a “missing pin detection” technology where one or more pin components of conveyor shoes incorporate features, such as an RFID tag, allowing selective wireless tracking and identification capability. A conveyor system comprises a shoe management system allowing interactions directly with one or more RFID readers, which can detect, store and/or monitor information associated with “smart shoe” and/or “missing pin detection” RFID tags, where interface between this application and the reader can be implemented via a socket interface. An open platform communications (OPC) wrapper can be created around the interface so that a Human Machine Interface (HMI) could interact directly with shoe management system.

A duplexer may be used to isolate a transmitter and a receiver that share a common antenna. By using impedance gradients to provide impedances that cause balance-unbalance transformers (balun) of the duplexer to cut-off access to the common antenna rather than duplicate the antenna impedance, the duplexer is balanced. Such cut-offs may have a lower insertion loss than a duplexer that merely duplicates the antenna impedance to separate the differential signals of the receiver and transmitter from the common mode signal.

Devices, systems, and methods for serial communication over a galvanically isolated channel are disclosed. A device includes a first IC device interface, first IO components connected to the first IC device interface, a second IC device interface, second IO components connected to the second IC device interface, an insulator layer having a first major surface and a second major surface, at least one pair of capacitor plates and corresponding interconnection paths on the first major surface, and at least one pair of capacitor plates and corresponding interconnection paths on the second major surface, wherein the at least one pair of capacitor plates on the first major surface of the insulator layer are aligned with the at least one pair of capacitor plates on the second major surface of the insulator layer to form at least one pair of capacitors.

Devices, systems, and methods for serial communication over a galvanically isolated channel are disclosed. A device includes a first IC device interface, first IO components connected to the first IC device interface, a second IC device interface, second IO components connected to the second IC device interface, an insulator layer having a first major surface and a second major surface, at least one pair of capacitor plates and corresponding interconnection paths on the first major surface, and at least one pair of capacitor plates and corresponding interconnection paths on the second major surface, wherein the at least one pair of capacitor plates on the first major surface of the insulator layer are aligned with the at least one pair of capacitor plates on the second major surface of the insulator layer to form at least one pair of capacitors.

Set of devices adapted to form a local network (3), the set comprising at least one first communication device (1) and multiple second communication devices (2), wherein the first and the second communication devices comprise a short-range communication module (4) to communicate in the local network (3) via a hopping mechanism, and wherein the first communication device additionally comprises a long-distance communication module (5) to communicate with a remote server (6), wherein each one of the second communication devices (2) comprises a memory adapted to store a hopping distance to the first communication device wherein the second communication device is configured to execute actions based on said hopping distance in said power cutoff mode.

Loss in a low-pass filter is reduced. A radio-frequency module includes an antenna terminal, a power amplifier, a low-noise amplifier, and a low-pass filter. The low-pass filter is disposed on a transmit path between the antenna terminal and the power amplifier and on a receive path between the antenna terminal and the low-noise amplifier. The low-pass filter has multiple paths. Each of the paths forms a part of either one or both of the transmit path and the receive path. The paths include a first path and a second path. The second path has a smaller reactance than the first path.

The present disclosure relates to a pre-5.sup.th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4.sup.th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

In a radio-frequency module, a conductive layer covers a major surface opposite to the mounting board side of a resin layer and a major surface opposite to the mounting board side of an electronic component. The electronic component includes an electronic component body and a plurality of outer electrodes. The electronic component body includes an electrical insulating portion and a conductive portion provided inside the electrical insulating portion, forming at least a portion of a circuit element of the electronic component. The electronic component body has a third major surface and a fourth major surface opposite to each other, and an outer side surface. The third major surface forms the major surface of the electronic component, and the third major surface is in contact with the conductive layer. The plurality of outer electrodes are provided on the fourth major surface, but are not extended over the third major surface.