Patent classifications
H04B10/60
OPTICAL MODULE
An optical module is disclosed. According to one implementation, the optical module comprises an optical receiver, a diode, a first resistor, a first capacitor, a comparator, and a control chip. The diode anode connects electrically with a triggering signal output end of the optical receiving module, the cathode of the diode connects with one end of the first capacitor and one input end of the comparator. Another end of the first capacitor connects with the ground; the first resistor is connected in parallel with both ends of the first capacitor. A pre-set reference voltage is connected with another input end of the comparator. The optical receiver generates a first triggering signal in response to a burst mode optical signal. After inputting the first triggering signal into the diode anode, the comparator outputs a second triggering signal from the output end, triggering the control chip to generate a reset signal input into the optical receiver.
OPTICAL MODULE
An optical module is disclosed. According to one implementation, the optical module comprises an optical receiver, a diode, a first resistor, a first capacitor, a comparator, and a control chip. The diode anode connects electrically with a triggering signal output end of the optical receiving module, the cathode of the diode connects with one end of the first capacitor and one input end of the comparator. Another end of the first capacitor connects with the ground; the first resistor is connected in parallel with both ends of the first capacitor. A pre-set reference voltage is connected with another input end of the comparator. The optical receiver generates a first triggering signal in response to a burst mode optical signal. After inputting the first triggering signal into the diode anode, the comparator outputs a second triggering signal from the output end, triggering the control chip to generate a reset signal input into the optical receiver.
OPTICAL RECEIVER MODULE AND OPTICAL MODULE
An optical receiver module includes a light receiving element that has a first electrode and a second electrode for receiving a bias and converts an optical signal inputted into an electrical signal to output the electrical signal via the first electrode. A signal line extends from the first electrode through the light receiving element-side signal pad and the second wire to the amplifier-side signal pad. A bias line extends from the second electrode through the light receiving element-side bias pad, the first wire, and the third wire to the first and second amplifier-side bias pads. The signal line three-dimensionally intersects with the bias line at an interval in a direction of the loop height of the first wire and that of the second wire.
Power Adjustment Of A Communication Link Based On State Disturbance Estimations
A communication device is provided that estimates one or more disturbance values associated with one or more components of the communication device, and adjusts the communication device to change a received power of the output signal. The communication device includes a transmitter having a seed laser configured to provide an amount of bandwidth for an output signal, an Erbium-doped fiber amplifier (EDFA) configured to increase an amplitude of the output signal, and a single mode variable optical attenuator (SMVOA) configured to decrease the amplitude of the output signal.
Optical reception circuit
An optical reception circuit includes a first photodetector, a first transimpedance amplifier, a level shift circuit, a second photodetector, a second transimpedance amplifier, a peak hold circuit, and a comparator. The first transimpedance amplifier converts a first light current from the first photodetector to a first voltage. The level shift circuit generates a signal voltage from the first voltage. The second transimpedance amplifier converts the second light current from the second photodetector to a second voltage. The peak hold circuit holds a peak voltage of the second voltage as a first threshold voltage. The comparator compares the signal voltage with the first threshold voltage.
Optical reception circuit
An optical reception circuit includes a first photodetector, a first transimpedance amplifier, a level shift circuit, a second photodetector, a second transimpedance amplifier, a peak hold circuit, and a comparator. The first transimpedance amplifier converts a first light current from the first photodetector to a first voltage. The level shift circuit generates a signal voltage from the first voltage. The second transimpedance amplifier converts the second light current from the second photodetector to a second voltage. The peak hold circuit holds a peak voltage of the second voltage as a first threshold voltage. The comparator compares the signal voltage with the first threshold voltage.
SPATIALLY RESOLVED MONITORING OF CABLE PERTURBATIONS USING MULTICHANNEL INFORMATION
A monitoring system. The monitoring system may include an optical receiver configured to receive an optical signal, the receiver comprising a plurality of equalizers to partition the optical signal over a plurality of optical channels corresponding to a plurality of optical wavelengths. The monitoring system may also include an analysis component, coupled to the receiver, comprising logic, where the logic is configured to construct a plurality of sensor matrices, corresponding to the plurality of optical channels, based upon the optical signal, after reception at the receiver; determine, using the plurality of sensor matrices, a correlation between at least one pair of sensor matrices corresponding to at least one pair of optical channels of the plurality of optical channels; and determine a location of a perturbation, external to the transmission system, based upon the correlation.
SPATIALLY RESOLVED MONITORING OF CABLE PERTURBATIONS USING MULTICHANNEL INFORMATION
A monitoring system. The monitoring system may include an optical receiver configured to receive an optical signal, the receiver comprising a plurality of equalizers to partition the optical signal over a plurality of optical channels corresponding to a plurality of optical wavelengths. The monitoring system may also include an analysis component, coupled to the receiver, comprising logic, where the logic is configured to construct a plurality of sensor matrices, corresponding to the plurality of optical channels, based upon the optical signal, after reception at the receiver; determine, using the plurality of sensor matrices, a correlation between at least one pair of sensor matrices corresponding to at least one pair of optical channels of the plurality of optical channels; and determine a location of a perturbation, external to the transmission system, based upon the correlation.
OPTICAL MODULE
An optical module includes a circuit board and a light receiving assembly. The light receiving assembly is electrically connected to the circuit board and configured to receive optical signals from outside of the optical module. The light receiving assembly includes a light receiving cavity, an optical amplification assembly and a light receiving chip. The optical amplification assembly is disposed in the light receiving cavity and configured to amplify the optical signals. The optical amplification assembly includes a fourth substrate and a semiconductor optical amplifier (SOA). The fourth substrate is electrically connected to the circuit board, and the SOA is disposed on the fourth substrate and is electrically connected to the fourth substrate, The light receiving chip is disposed in the light receiving cavity and configured to receive the amplified optical signals.
OPTICAL MODULE
An optical module includes a circuit board and a light receiving assembly. The light receiving assembly is electrically connected to the circuit board and configured to receive optical signals from outside of the optical module. The light receiving assembly includes a light receiving cavity, an optical amplification assembly and a light receiving chip. The optical amplification assembly is disposed in the light receiving cavity and configured to amplify the optical signals. The optical amplification assembly includes a fourth substrate and a semiconductor optical amplifier (SOA). The fourth substrate is electrically connected to the circuit board, and the SOA is disposed on the fourth substrate and is electrically connected to the fourth substrate, The light receiving chip is disposed in the light receiving cavity and configured to receive the amplified optical signals.