An assembly for optical to electrical power conversion including a photodiode assembly having a substrate layer and an internal side, an antireflective layer, a heterojunction buffer layer adjacent the internal side; an active area positioned adjacent the heterojunction buffer layer, a plurality of n+ electrode regions and p+ electrode regions positioned adjacent the active area, and back-contacts configured to align with the n+ and p+ electrode regions. The active area converts photons from incoming light into liberated electron hole pairs. The heterojunction buffer layer prevents electrons and holes of the liberated electron hole pairs from moving toward the substrate layer. The plurality of electrode regions are configured in an alternating pattern with gaps between each n+ and p+ electrode region. The electrode regions receive and generate electrical current from migration of the electrons and the holes, provide electrical pathways for the electrical current, and provide thermal pathways to dissipate heat.

In a particular embodiment, optical communications in a battery pack is disclosed that includes generating, by a module monitoring system of a battery management system, sensor data; encoding, by the module monitoring system, the sensor data into an optical signal; sending, by the module monitoring system, to a data aggregator, the sensor data as the optical signal; and decoding, by the data aggregator, the optical signal into the sensor data.

In a particular embodiment, optical communications in a battery pack is disclosed that includes generating, by a module monitoring system of a battery management system, sensor data; encoding, by the module monitoring system, the sensor data into an optical signal; sending, by the module monitoring system, to a data aggregator, the sensor data as the optical signal; and decoding, by the data aggregator, the optical signal into the sensor data.

Technology for a multi-repeater system including wireless transmission of power from a first repeater to a second repeater is disclosed. A first and second repeater can be disposed opposite each other about a structural element. Wireless power can be transmitted from the first repeater through the structural element to the second repeater for use by the second repeater.

The present disclosure relates to a fiber optic network configuration having an optical network terminal located at a subscriber location. The fiber optic network configuration also includes a drop terminal located outside the subscriber location and a wireless transceiver located outside the subscriber location. The fiber optic network further includes a cabling arrangement including a first signal line that extends from the drop terminal to the optical network terminal, a second signal line that extends from the optical network terminal to the wireless transceiver, and a power line that extends from the optical network terminal to the wireless transceiver.

A sensing system including: a sensor located in an external environment, including: an electrically powered sensor element sensing an environment variable and converting the sensing to a corresponding analog electrical value measure; an electrically powered sensor value conversion system connected to the electrically powered sensor and converting the analog electrical value measure to a digital measure, in addition to encoding the digital measure with sensor identification information; a transducer element for sending the sensed data information over an optical conduit for inputting an optical power signal and outputting optical sensed data information; a coupler splitting a first portion of the optical power signal to an energy storage system; and an energy storage system converting the first portion of the optical power signal into corresponding electrical energy and storing it for on demand usage; said electrically powered sensor value conversion system being supplied with electrical power from said energy storage system.

A pair of optical components is used in an isolator that enables electric isolation. Each of the optical components includes: first lens portions arranged on different optical paths and transmitting light in a first direction; second lens portions arranged on different optical paths and transmitting light in the second direction orthogonal to the first direction; and a reflection portion reflecting, in the second direction, the light in the first direction transmitted through the first lens portion and guiding the light to the second lens portion, or reflecting, in the first direction, the light in the second direction transmitted through the second lens portion and guiding the light to the first lens portion The second lens portion included in one of the pair of optical components and the second lens portion included in the other optical component are spaced apart from each other and face each other.

A USB-C connector for a fiber optic cable has a two-section dongle form. The small plug section has a USB-C plug head and an optical transceiver and control circuitry, but no other signal processing functions. The second section includes a fiber connector and a signal processing chipset, but no optical transceiver. The two sections are connected together by a short hybrid cable containing both optical fibers and electrical wires. The optical fibers connect the optical transceiver to the fiber connector. A subset of electrical wires connect the control circuitry to the chipset, and another subset of electrical wires connect the chipset to a second subset of pins of the plug head. A first subset of pins of the plug head are connected directly to the control circuitry for optical-electrical signal conversion. Two such USB-C connectors connected to the ends of a long all-fiber cable form a USB-C extender.

Provided is a high-speed optical transmission-reception apparatus including a digital-signal processing circuit and optical modulation and optical reception modules, in which a flexible printed circuit is used as a high-frequency interface for the optical modulation and optical reception modules, a mechanism for connecting the high-frequency line pattern to the flexible printed circuit is provided on a package substrate of the digital-signal processing circuit, and the package substrate and the optical modulation and optical reception modules are connected by the flexible printed circuit.

A hybrid electrical and optic system-on-chip (SOC) device configured for both electrical and optic communication includes a substrate, an electrical device configured for electrical communication arranged on the substrate, a photonics device configured for optic communication arranged on the substrate, and a self-test module arranged on the substrate. The self-test module is configured to receive a loop-back signal indicative of an optical signal output from the photonics device and calibrate the photonics device based on the loop-back signal.