A device for enhanced microwave permeability through a coated transparent substrate includes a first surface of the device and a second surface of the device each forming an exterior boundary of the device. The device includes a first section extending through the device from the first surface to the second surface. The first section enhances a permeability of a first microwave band through the coated transparent substrate. The device also includes a second section extending through the device from the first surface to the second surface. The second section enhances a permeability of a second microwave band through the coated transparent substrate. The device further includes a third section extending through the device. The third section includes a location where the first section and the second section merge. The third section enhances a permeability of a third microwave band through the coated transparent substrate.

To simplify the works a user needs to perform while ensuring a proper operation of a submarine device. A submarine cable system (10) according to an example embodiment includes: a submarine device (11); a first line terminal equipment (1) and a second line terminal equipment each adapted to perform communication with the submarine device (11); and a control apparatus (20) configured to select either one of the first line terminal equipment (1) or the second line terminal equipment (2) based on an order of priorities thereof and to instruct the selected one of the line terminal equipment to output a control signal to the submarine device (11). The order of the priorities is based on a distance from the first line terminal equipment (1) to the submarine device (11) and a distance from the second line terminal equipment (2) to the submarine device (11).

To simplify the works a user needs to perform while ensuring a proper operation of a submarine device. A submarine cable system (10) according to an example embodiment includes: a submarine device (11); a first line terminal equipment (1) and a second line terminal equipment each adapted to perform communication with the submarine device (11); and a control apparatus (20) configured to select either one of the first line terminal equipment (1) or the second line terminal equipment (2) based on an order of priorities thereof and to instruct the selected one of the line terminal equipment to output a control signal to the submarine device (11). The order of the priorities is based on a distance from the first line terminal equipment (1) to the submarine device (11) and a distance from the second line terminal equipment (2) to the submarine device (11).

This invention pertains to the field of free-space optical (FSO) communications, and specifically to the realization of functional FSO optical transceiver terminals located at remote electrically unpowered locations within a communications network. A remote unpowered FSO terminal located at a far-end location receives necessary optical power from a powered base station location (near-end) required for all optical amplification functions necessary for NRZ or RZ format signals within the spectral range of 900 nm to 1480 nm as well as an Ultra Short Pulsed Laser (USPL) centered at 1560 nm at the far-end location. A transmitting node identified as the near-end transmits an optical signal identified as a pump signal to a remote location classified as the far-end node over a free space medium, such as the atmosphere, where the far-end node location does not have available electrical power for operation of electro-optic components required for transmission and retransmission functions.

A cryogenic optoelectronic data link, comprising a sending module operating at a cryogenic temperature less than 100 K. An ultrasensitive electro-optic modulator, sensitive to input voltages of less than 10 mV, may include at least one optically active layer of graphene, which may be part of a microscale resonator, which in turn may be integrated with an optical waveguide or an optical fiber. The optoelectronic data link enables optical output of weak electrical signals from superconducting or other cryogenic electronic devices in either digital or analog form. The modulator may be integrated on the same chip as the cryogenic electrical devices. A plurality of cryogenic electrical devices may generate a plurality of electrical signals, each coupled to its own modulator. The plurality of modulators may be resonant at different frequencies, and coupled to a common optical output line to transmit a combined wavelength-division-multiplexed (WDM) optical signal.

A cryogenic optoelectronic data link, comprising a sending module operating at a cryogenic temperature less than 100 K. An ultrasensitive electro-optic modulator, sensitive to input voltages of less than 10 mV, may include at least one optically active layer of graphene, which may be part of a microscale resonator, which in turn may be integrated with an optical waveguide or an optical fiber. The optoelectronic data link enables optical output of weak electrical signals from superconducting or other cryogenic electronic devices in either digital or analog form. The modulator may be integrated on the same chip as the cryogenic electrical devices. A plurality of cryogenic electrical devices may generate a plurality of electrical signals, each coupled to its own modulator. The plurality of modulators may be resonant at different frequencies, and coupled to a common optical output line to transmit a combined wavelength-division-multiplexed (WDM) optical signal.

In an optical network having a terrestrial terminal and an open cable interface (OCI) connecting a submarine cable to a terrestrial cable, the OCI may include a filter positioned on an optical path between the terrestrial cable and the submarine cable and configured to pass first communication signals of a first frequency band, and filter out secondary signals of a second frequency band that does not overlap with the first frequency band. The secondary signals may be looped back to the terrestrial terminal. The terrestrial terminal may detect the looped back secondary signals, and in response, determine the presence of the OCI and that the supervisory signals were rerouted by the OCI.

In an optical network having a terrestrial terminal and an open cable interface (OCI) connecting a submarine cable to a terrestrial cable, the OCI may include a filter positioned on an optical path between the terrestrial cable and the submarine cable and configured to pass first communication signals of a first frequency band, and filter out secondary signals of a second frequency band that does not overlap with the first frequency band. The secondary signals may be looped back to the terrestrial terminal. The terrestrial terminal may detect the looped back secondary signals, and in response, determine the presence of the OCI and that the supervisory signals were rerouted by the OCI.

An optically-monitored and/or optically-controlled electronic device is described. The device includes at least one of a semiconductor transistor or a semiconductor diode. An optical detector is configured to detect light emitted by the at least one of the semiconductor transistor or the semiconductor diode during operation. A signal processor is configured to communicate with the optical detector to receive information regarding the light detected. The signal processor is further configured to provide information concerning at least one of an electrical current flowing in, a temperature of, or a condition of the at least one of the semiconductor transistor or the semiconductor diode during operation.

A system and method for efficient data transfer in a computing system are described. A computing system includes multiple nodes that receive tasks to process. A bridge interconnect transfers data between two processing nodes without the aid of a system bus on the motherboard. One of the multiple bridge interconnects of the computing system is an optical bridge interconnect that transmits optical information across the optical bridge interconnect between two nodes. The receiving node uses photonic integrated circuits to translate the optical information into electrical information for processing by electrical integrated circuits. One or more nodes switch between using an optical bridge interconnect and a non-optical bridge interconnect based on one or more factors such as measured power consumption and measured data transmission error rates.