H04B15/02

EMI filter for DC motor
11606008 · 2023-03-14 · ·

An electromagnetic interference (EMI) filter 32 is provided which is suitable for a DC motor 10. The EMI filter 32 comprises an EMI suppression circuit 34 having first and second DC-motor-terminal inputs 36a, 36b, and an MW-band power choke 44 coupled to one of the first and second DC-motor-terminal inputs 36a, 36b to increase the motor inductance in the MW frequency band.

DETERMINATION OF NOISE PRESENCE IN RECORDED SOUNDS

In some examples, a non-transitory computer-readable medium stores machine-readable instructions which, when executed by a processor, cause the processor to cause a playback device to produce a sound using an audio file; cause a recording device to record the sound; compare the audio file to the recorded sound; determine, based on the comparison, whether the recorded sound comprises a noise not present in the audio file; and cause, based on the determination, a second recording device to be selected, a multiplexer to select a second playback device, or a combination thereof.

SELF-INTERFERENCE MITIGATION IN IN-BAND FULL-DUPLEX COMMUNICATION SYSTEMS

A system and method for mitigating self-interference in mmWave systems. A transceiver can include a mutual precoder controller that controls both an analog/RF beamforming circuit and a digital/BB beamforming circuit to prefer beams directed along paths in the local RF environment that minimize self-interference. In other cases, a transceiver can include one or more self-interference filters to internally mitigate self-interference.

SELF-INTERFERENCE MITIGATION IN IN-BAND FULL-DUPLEX COMMUNICATION SYSTEMS

A system and method for mitigating self-interference in mmWave systems. A transceiver can include a mutual precoder controller that controls both an analog/RF beamforming circuit and a digital/BB beamforming circuit to prefer beams directed along paths in the local RF environment that minimize self-interference. In other cases, a transceiver can include one or more self-interference filters to internally mitigate self-interference.

Systems and methods for enhanced-isolation coexisting time-division duplexed transceivers

A system for enhancing isolation in coexisting time-division duplexed (TDD) transceivers includes: a blocker canceller that transforms a transmit signal of a TDD transceiver into a blocker cancellation signal configured to remove transmit-band interference in a receive signal; a first filter that filters the blocker cancellation signal; a second filter that filters the transmit signal; and a transmit-noise canceller that transforms the filtered transmit signal into a transmit noise cancellation signal configured to remove receive-band interference in the receive signal.

Systems and methods for enhanced-isolation coexisting time-division duplexed transceivers

A system for enhancing isolation in coexisting time-division duplexed (TDD) transceivers includes: a blocker canceller that transforms a transmit signal of a TDD transceiver into a blocker cancellation signal configured to remove transmit-band interference in a receive signal; a first filter that filters the blocker cancellation signal; a second filter that filters the transmit signal; and a transmit-noise canceller that transforms the filtered transmit signal into a transmit noise cancellation signal configured to remove receive-band interference in the receive signal.

Aerothermal ring structures providing RF isolation

A heat dissipation structure is disclosed that is especially well-suited for use on aerodynamic systems. The heat dissipation structure is formed within a metallic body that surrounds the heat-generating electronics. The heat dissipation structure is designed to both dissipate the generated heat and also to isolate RF cross-talk between the one or more transmitters and receivers. The heat dissipation structure includes a plurality of ring structures that extend around at least a portion of a body that houses the one or more heat-generating electrical components. The plurality of ring structures may be recessed into the body, and a first spacing between a first adjacent pair of ring structures of the plurality of ring structures is different from a second spacing between a second adjacent pair of ring structures of the plurality of ring structures.

Aerothermal ring structures providing RF isolation

A heat dissipation structure is disclosed that is especially well-suited for use on aerodynamic systems. The heat dissipation structure is formed within a metallic body that surrounds the heat-generating electronics. The heat dissipation structure is designed to both dissipate the generated heat and also to isolate RF cross-talk between the one or more transmitters and receivers. The heat dissipation structure includes a plurality of ring structures that extend around at least a portion of a body that houses the one or more heat-generating electrical components. The plurality of ring structures may be recessed into the body, and a first spacing between a first adjacent pair of ring structures of the plurality of ring structures is different from a second spacing between a second adjacent pair of ring structures of the plurality of ring structures.

CROSSTALK CANCELATION STRUCTURES IN SEMICONDUCTOR PACKAGES
20220319980 · 2022-10-06 ·

The embodiments herein are directed to technologies for crosstalk cancellation structures. One semiconductor package includes conductive metal layers separated by insulating layers, the conductive metal layers for routing signals between external package terminals and pads on an integrated circuit device. Signal lines formed in the conductive metal layers have electrode structure (capacitor electrode-like structures) formed for at least adjacent signaling lines of the package terminals. Two of the electrode structures from the adjacent signaling lines are formed opposite each other on different metal layers.

CROSSTALK CANCELATION STRUCTURES IN SEMICONDUCTOR PACKAGES
20220319980 · 2022-10-06 ·

The embodiments herein are directed to technologies for crosstalk cancellation structures. One semiconductor package includes conductive metal layers separated by insulating layers, the conductive metal layers for routing signals between external package terminals and pads on an integrated circuit device. Signal lines formed in the conductive metal layers have electrode structure (capacitor electrode-like structures) formed for at least adjacent signaling lines of the package terminals. Two of the electrode structures from the adjacent signaling lines are formed opposite each other on different metal layers.